LEDs

LEDS ARTICLES



Nanotechnology: Lighting up ultrathin films

01/17/2017  Based on a study of the optical properties of novel ultrathin semiconductors, researchers of Ludwig-Maximilians-Universitaet (LMU) in Munich have developed a method for rapid and efficient characterization of these materials.

ams launches world’s first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology

01/17/2017  ams AG today launched the world's first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial applications.

Dow Corning expands LED packaging design options with launch of new silicone coatings

01/17/2017  Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

Wolfspeed introduces new SiC MOSFET for EV drive trains

01/11/2017  New 900V, 10mΩ chip enables new improvements in range, battery usage and vehicle design.

Miniscule amounts of impurities in vacuum greatly affecting OLED lifetime

01/03/2017  Reproducibility is a necessity for science but has often eluded researchers studying the lifetime of organic light-emitting diodes (OLEDs).

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/22/2016  Mentor Graphics Corp. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Seoul Semiconductor Europe GmbH announces new CEO

12/20/2016  Andreas Weisl (38), former Vice President Europe of Korean LED manufacturer Seoul Semiconductor (SSC), has taken on the position of CEO at Seoul Semiconductor Europe GmbH based Munich, Germany, with effect from November 11, 2016.

62 new facilities start operation 2017 and beyond

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

LEDs and power electronic innovations are converging to handle module-level thermal management

12/15/2016  In 2015, all economic indicators pointed to continued market growth for both industries, power electronics and LED, especially with IGBT modules boosted by EV/HEV industry and general lighting applications, a killer application for LEDs since 2012.

Linde Korea acquires Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business

12/15/2016  Linde Korea, a member of The Linde Group, today announced that it has completed the takeover of Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business in South Korea.

Cree announces the next generation of extreme high power LEDs

12/14/2016  The new XHP50.2 LED enables lighting manufacturers to quickly improve the performance of existing XHP50 lighting designs.

Outfitting the future

12/12/2016  Wearable technology is about more than smartwatches or counting steps. Across North Carolina State University, researchers are using it to solve problems — monitoring heart rate and environmental dangers, powering electronic devices, delivering medications, building better prosthetics and improving safety.

University of California, Berkeley places order for PEALD deposition system from Ultratech Cambridge Nanotech

12/08/2016  Ultratech, Inc. announced that the Laboratory for Emerging and Exploratory Devices has chosen the Ultratech-CNT Fiji G2 PEALD system as its instrument of choice for its research activities.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

Leti says FD-SOI light-sensing technique can make transistors far more sensitive to visible light

12/08/2016  In IEDM 2016 presentation, institute’s team demonstrates potential sensing advantages of integrating photodiodes below buried oxide.

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

LED packaging: New relays of growth are required for LED companies to survive

12/02/2016  According to Yole’s analysts, the packaged LED market represented a revenue of nearly US$15.7 billion in 2015. This industry should grow to a size of nearly US$18.2 billion by 2020.

Kateeva President & COO named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association

12/01/2016  Kateeva, the OLED production equipment leader, today announced that President and COO, Conor Madigan, Ph.D., was named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association (SVIPLA).

ChipMOS and Tsinghua Unigroup agree to form joint-venture

11/30/2016  ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS