LEDs

LEDS ARTICLES



A SOI wafer is a suitable substrate for gallium nitride crystals

03/02/2017  Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth.

Dow Corning further expands design freedoms for LED packaging with five new optical silicone encapsulants

03/01/2017  Dow Corning further expanded the design flexibilities for LED packaging manufacturers today with the addition of five new optical encapsulants (OEs) to its portfolio of advanced LED solutions.

Versum Materials expands manufacturing capacity

03/01/2017  Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

LG Innotek unveils the world's first 70mW UV-C LED

02/23/2017  LG Innotek today announced that the company has developed the world's first 70mw UV-C LED for sterilization applications.

Mergers & acquisitions in 2017

02/19/2017  At SEMI's Industry Strategy Syposium this year, a merger's and acquisitions panel, moderated by Robert Maire of Semiconductor Advisors, took a look at how the industry might look in the future.

Vital Control in Fab Materials Supply-Chains - Part 2

02/16/2017  Expert panel discussion at Critical Materials Council (CMC) Conference

Ultratech receives large, repeat multiple system order for fan-out wafer-level packaging applications

02/16/2017  Ultratech, Inc. today announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

Seoul Semiconductor starts mass production of its patented filament LEDs

02/15/2017  Seoul Semiconductor announced the immediate start of the mass production of its LED chip-on-board package for use in LED filament bulbs, a market currently estimated to be $1.3 billion globally.

Is a stretchable smart tablet in our future?

02/15/2017  Engineering researchers at Michigan State University have developed the first stretchable integrated circuit that is made entirely using an inkjet printer, raising the possibility of inexpensive mass production of smart fabric.

Brighter shine for LEDs with Picosun ALD

02/13/2017  Picosun Oy, a provider of high quality Atomic Layer Deposition (ALD) technology, announced a collaboration with Osram Opto Semiconductors and other partners to create a new generation of advanced LED lighting solutions.

AMOLED production equipment purchases to reach record high in 2017

02/10/2017  The flat-panel display (FPD) industry is in the midst of a historic wave of building new factories to manufacture active matrix organic light emitting diode (AMOLED) displays.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

Entegris announces higher-purity gas purification system platform with expanded manufacturing in Asia

02/07/2017  New media provides yield improvements in systems for advanced semiconductor and LED applications.

Global semiconductor sales reach $339B in 2016

02/03/2017  Worldwide industry posts highest-ever annual sales; year-to-year sales increase 12 percent in December.

Veeco enters into agreement to acquire Ultratech

02/03/2017  The Boards of Directors of both Veeco and Ultratech have unanimously approved the transaction.

Leti presents first-ever results in LED pixelization & record high-resolution for micro-displays at Photonics West

02/03/2017  Leti, a research institute of CEA Tech, today announced it has developed a μLED fabrication process to create high-resolution arrays at 10-micron pitch.

1000 times more efficient nano-LED opens door to faster microchips

02/02/2017  The electronic data connections within microchips are increasingly becoming a bottleneck in the exponential growth of data traffic. Optical connections are the obvious successors but optical data transmission requires an adequate nanoscale light source, and this has been lacking. Scientists at Eindhoven University of Technology have created a light source that has the right characteristics: a nano-LED that is 1000 times more efficient than its predecessors, and is capable of handling gigabits per second.

SEMI 2020: "There are far better things ahead than any we leave behind"

02/01/2017  “Do not go where the path may lead, go instead where there is no path and leave a trail,” was how I started last week’s article. In that article we looked back on 2016 and the incredible progress of the industry and how it continually cuts new trail and keeps moving at the speed of Moore’s Law.

The world's smallest reflector-type high brightness 3-color LED

01/31/2017  ROHM has recently announced the availability of an ultra-compact reflector-type LED optimized for consumer devices such as matrix light sources for gaming and wearables that demand increased miniaturization.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS