LEDs

LEDS ARTICLES



Organic semiconductors get weird at the edge: University of British Columbia research

10/08/2015  As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.

Entegris introduces SmartStack 300 mm contactless horizontal wafer shipper

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

Mentor Graphics Tackles SoC Design Challenges

10/06/2015  System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.

Applied Materials Prospers in CMP, Deposition, Etch

10/06/2015  The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.

SPIE Photomask Panel: Money Is An Issue

10/02/2015  "Money (That’s What I Want)" could have been the theme song for playing off the EUV Mask Readiness panel discussion on Thursday morning (October 1) at the SPIE Photomask Technology conference in Monterey, California.

LG Innotek announces high power LED packages

10/01/2015  LG Innotek announced that the company started to produce high-power LED packages (H35C4 Series) featuring 180lm/W.

DuPont Displays opens OLED materials scale-up facility for next generation TVs

10/01/2015  DuPont Displays announced the opening of a state-of-the-art, scale-up manufacturing facility designed to deliver production scale quantities of advanced materials that enable large-format, solution-based printed Organic Light Emitting Diode (OLED) displays.

TSMC forum emphasizes industry collaboration

10/01/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Flip chip technology supported by wider adoption of Cu pillar tech

10/01/2015  Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12” eq. wafers) in 2020, supported by the wider adoption of Cu pillar technology.

Intel Mask Engineer Reports "Steady Progress" in EUV Masks

09/30/2015  Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress.

Mask Conference Highlights Progress in Lithography

09/30/2015  Harry J. Levinson, senior director of technology research at GlobalFoundries, took “Lithography and Mask Challenges at the Leading Edge” as the theme for his keynote presentation Tuesday morning, opening the SPIE Photomask Technology 2015 conference in Monterey, California.

Functionalized graphene ink opens door to innovative screen-printing applications

09/29/2015  A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink.

CMP Technology Evolving to Engineer Surfaces

09/28/2015  New devices, materials, and substrates challenge atomic-scale integration.

Display technologies and electronic circuits to fuel organic electronics market globally through 2018

09/28/2015  Transparency Market Research (TMR) projects the global organic electronics market to grow at a CAGR of 32.6% from 2012 to 2018.

Edwards' abatement solutions meet international emissions standards

09/25/2015  Edwards Ltd and its subsidiaries (Edwards) reassures customers that all of its exhaust management abatement system products are designed to meet industry emission standards.

SEMI Conference Addresses Issues in Semiconductor Materials

09/25/2015  The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”

Linde Electronics Presents 2014 Global Supplier Awards

09/25/2015  Electronic Fluorocarbons LLC and Albemarle Corporation recognized for quality, safety, service and technology performance.

GlobalFoundries CTO Calls for Innovation in Chip Materials

09/24/2015  Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.

Silicone shines new light on optical applications

09/22/2015  As a response to meet the increasing demands of cutting-edge LED technologies, Shin-Etsu Silicones of America has recently introduced its new optically clear LIMS (Liquid Injection Molding System) X-34-1972-3 material.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016