Lithography

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LITHOGRAPHY ARTICLES



North American semiconductor equipment industry posts January 2018 billings

02/23/2018  "The strong billings levels from late 2017 have carried over into the new year," said Ajit Manocha, president and CEO of SEMI.

Supermicro expands its Silicon Valley corporate headquarters

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

Gigaphoton ships latest ArF Excimer Laser GT65A

02/22/2018  In January, Gigaphoton Inc., a major manufacturer of lithography light sources, announced the shipment of an ArF Excimer Laser for advanced immersion exposure (lithography) devices, the "GT65A" Unit 1, as a new product that meets the growing demand for semiconductors in recent years.

Peter Trefonas elected SPIE Fellow

02/22/2018  Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact modeling.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Cymer qualifies and ships new argon fluoride light source

02/21/2018  Cymer, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the first shipment of the newly qualified XLR 800ix light source that improves performance and productivity, as well as lowers cost-of-ownership for leading-edge argon fluoride (ArF) immersion lithography systems.

ASML welcomes Christophe Fouquet to Board of Management

02/20/2018  ASML Holding N.V. (ASML) today announces that its Supervisory Board intends to appoint Christophe Fouquet (44) as Executive Vice President to the Board of Management, subject to notification of the Annual General Meeting of Shareholders on 25 April 2018.

Top 10 semiconductor R&D spenders increase outlays 6% in 2017

02/20/2018  Intel far surpasses others with R&D spending of $13.1 billion in 2017 and accounts for 36% of expenditures among Top R&D spenders.

Technavio releases report on key findings of the global semiconductor IP market 

02/15/2018  The latest market research report by Technavio on the global semiconductor IP market predicts a CAGR of close to 10% during the period 2018-2022.

SEMI China President Lung Chu leads mayor roundtable discussion at International IoT Summit in Silicon Valley

02/14/2018  Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each other’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.

ASML increases its dominance of semiconductor lithography market in 2017

02/12/2018  ASML's dominance in the semiconductor equipment market continued in 2017, according to the report "Sub-100nm Lithography: Market Analysis and Strategic Issues," recently published by The Information Network.

Amkor Technology names Doug Alexander and MaryFrances McCourt to Board of Directors

02/09/2018  Amkor Technology, Inc. today announced that Doug Alexander and MaryFrances McCourt have been appointed as new members of the Company's Board of Directors. With these appointments, Amkor's Board has been expanded to twelve members.

Mass production of new class of semiconductors closer to reality

02/09/2018  Two Waterloo chemists have made it easier for manufacturers to produce a new class of faster and cheaper semiconductors.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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