Lithography

LITHOGRAPHY ARTICLES



Mentor Graphics joins the Center for Power Electronics Systems

03/04/2015  Mentor Graphics Corporation today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems.

Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

03/04/2015  Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Freescale and NXP agree to $40 Billion merger

03/03/2015  Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

New nanowire structure absorbs light efficiently

02/27/2015  Researchers at Aalto University, Finland have developed a new method to implement different types of nanowires side-by-side into a single array on a single substrate.

Top semiconductor R&D leaders ranked for 2014

02/26/2015  Intel’s R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase; Nvidia with highest R&D/sales ratio.

AG Semiconductor Services and JA Mitsui Leasing join forces

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulse

02/23/2015  Cymer, an ASML company, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the shipment of its first XLR 700ix light source.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

02/20/2015  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

02/19/2015  Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Imec reports breakthrough results on DSA

02/19/2015  At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development.

eBeam Initiative announces education and collaboration focus on reactivating density benefits of Moore's Law

02/17/2015  The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that its top theme for 2015 will be the reactivation of the density benefits of Moore's Law through eBeam technology.

Gigaphoton achieves continuous 140W EUV light source output at 50% duty cycle

02/17/2015  Further contributing to the realization of a mass production-quality LPP light source for EUV scanners

SEMI wins semiconductor etch equipment export control ruling

02/11/2015  This week, after a four-month investigation, the U.S. Department of Commerce declared the export controls on certain etch equipment and technology ineffective, thereby removing a cumbersome and onerous impediment to efficient trade.

Applied's merger with TEL: Still a work in progress

02/11/2015  Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

02/10/2015  The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Qualcomm and China's National Development and Reform Commission reach resolution

02/09/2015  Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography

01/30/2015  Extreme ultraviolet lithography (EUV), 3D integration, and the Internet of Things will be among critical technologies featured at SPIE Advanced Lithography 2015 22 to 26 February in San Jose, California.

2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

GIGAPHOTON honored with 2015 "Toshiba Partnership Award"

01/26/2015  Gigaphoton Inc., a lithography light source manufacturer, today announced that the company has been recognized with a 2015 Partnership Award from Toshiba Semiconductor & Storage Company’s Yokkaichi Operations, a world production base of NAND flash memory devices.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015