Lithography

LITHOGRAPHY ARTICLES



Superfast stress inspection for overlay control

07/28/2014  Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

07/24/2014  Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

07/24/2014  Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

SEMI: June 2014 equipment bookings at the highest level since May 2012

07/22/2014  North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI.

Process Watch: The 10 fundamental truths of process control for the semiconductor IC industry

07/22/2014  This is the first in a series of 10 installments which will discuss fundamental truths about process control - inspection and metrology - for the semiconductor industry.

CEA-Leti: Monolithic 3D is the solution for further scaling

07/21/2014  Hughes Metras, Leti’s VP of Strategic Partnerships North America, introduced the lead talk at their SemiconWest 2014 Leti Day about monolithic 3D technology as the "solution for scaling."

IBM announces $3B research initiative

07/15/2014  IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

Paradigm shift in semi equipment - Confirmed

07/15/2014  Technology node transitions slowing below 32nm.

Entegris announces new VaporSorb filter for advanced yield protection

07/09/2014  Entegris, Inc. today announced a product extension for its VaporSorb line of airborne molecular contamination (AMC) filters.

SEMI forecasts double-digit business growth in 2014, 2015

07/09/2014  The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

Applied Materials unveils CVD and CMP systems

07/08/2014  On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

SEMATECH and CNSE/SUNYIT launch CMP Center

07/08/2014  The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

Applied Materials and Tokyo Electron unveil new company name

07/08/2014  Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once the merger closes.

Gigaphoton develops world's first helium-free purge process for ArF immersion lasers

06/30/2014  Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in the development of an innovative purge process, one that does not use the rare gas helium, for its flagship "GT Series" of ArF immersion lasers.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

06/30/2014  EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Gigaphoton achieves 92W EUV light source output

06/30/2014  Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has successfully achieved 92 W EUV light source output at 4.2 percent conversion efficiency (CE) on its prototype laser-produced plasma (LPP) light sources for EUV lithography scanners.

ConFab panelists discuss optimizing R&D in the changing semi landscape

06/24/2014  Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

Bookings and billings maintain a consistent pace in May 2014

06/20/2014  North American semiconductor equipment industry posts May 2014 book-to-bill ratio of 1.00.

Advanced Materials Developer Inpria raises $1.45M from Oregon Angel Fund

06/19/2014  Inpria Corporation, a developer of high-resolution photoresists, announced today that it has received additional equity investment and commitments totaling $1.45 million

450mm transition toward sustainability: Facility and infrastructure requirements

06/19/2014  Design and construction professionals are showing unprecedented levels of collaboration through the G450C.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Advances in Wet Processing and Wafer Cleaning

August 14th at 1:00 p.m. ET Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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VIDEOS