Lithography

LITHOGRAPHY ARTICLES



Technology partners at SEMICON West focus on innovations driving industry growth

05/22/2017  SEMI today announced its plans to deliver specialized programs at SEMICON West 2017 (July 11-13 at Moscone Center in San Francisco, Calif.) in partnership with IEEE (Institute of Electrical and Electronics Engineers), Society of Automotive Engineers International (SAE), and imec.

China's semiconductor industry and "win-win" growth

05/22/2017  As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity.

Lam Research appoints Dr. Y.B. Koh to Board of Directors

05/15/2017  Lam Research today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017.

Worldwide semiconductor revenue grew 2.6% in 2016, reports Gartner

05/15/2017  Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc.

SMIC transitions CEO responsibility to Dr. Haijun Zhao

05/10/2017  Semiconductor Manufacturing International Corporation announces the appointment of Dr. Haijun Zhao as CEO replacing Dr. Tzu-Yin Chiu, who will continue to serve as Vice Chairman and Non-Executive Director of the Board and guide the Company's future strategic direction.

Infineon rides automotive wave into Top-10 semi supplier ranking

05/09/2017  Memory market surge propels SK Hynix and Micron up two spots in the top-10 ranking.

Global semiconductor sales in March up 18.1% year-to-year

05/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $30.9 billion for the month of March 2017, an increase of 18.1 percent compared to the March 2016 total of $26.2 billion and 1.6 percent more than the February 2017 total of $30.4 billion.

Samsung poised to become world’s largest semi supplier in 2Q17

05/01/2017  Intel could yield the #1 position it has held since 1993.

ASML, ZEISS file joint patent infringement lawsuits against Nikon

04/28/2017  ASML and ZEISS today announced that both companies are filing initial legal claims against Nikon for infringement of more than 10 patents.

First EUV lithography high-volume manufacturing solution for N5 BEOL

04/27/2017  Immersion-based self-aligned quadruple patterning is combined with EUV lithography block patterning to achieve metal layers with pitches as small as 32nm.

Graphene 'copy machine' may produce cheap semiconductor wafers

04/19/2017  Engineers use graphene as a 'copy machine' to produce cheaper semiconductor wafers.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

Gartner: Worldwide semiconductor revenue forecast to increase 12.3% in 2017

04/14/2017  Worldwide semiconductor revenue is forecast to total $386 billion in 2017, an increase of 12.3 percent from 2016, according to Gartner, Inc.

Si2 contributes advanced IC power modeling technology to IEEE

04/11/2017  Silicon Integration Initiative, Inc. (Si2), a integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group.

MagnaChip to host its annual Foundry Technology Symposium in Santa Clara, California

04/10/2017  MagnaChip Semiconductor Corporation announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.

Shanhai Capital completes acquisition of Analogix Semiconductor

04/07/2017  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor.

2016 marks year of recovery for global semiconductor market

04/07/2017  In 2016, the market posted a year-end growth rate of 2 percent with chip growth seen across multiple market segments. Global revenue came in at $352.4 billion, up from $345.6 billion in 2015.

D2S unveils fifth-generation GPU acceleration platform for semiconductor manufacturing

04/06/2017  D2S today announced the unveiling of the fifth generation of its computational design platform (CDP), which enables extremely fast and precise simulations for semiconductor design and manufacturing.

Ultratech receives multiple commitments for laser melt anneal system evaluation

04/05/2017  Ultratech, Inc. today announced that it has received multiple commitments for its LM7 laser melt anneal system.

Global semiconductor sales up 16.5% year-to-year

04/04/2017  Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

VIDEOS