Lithography

LITHOGRAPHY ARTICLES



Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

SEMI reports 2014 semiconductor photomask sales of $3.2B

04/14/2015  SEMI reports that the worldwide semiconductor photomask market was $3.2 billion in 2014 and is forecasted to reach $3.4 billion in 2016.

Flexible facilities for 450mm wafer fabs

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Pibond introduces a new product line for logic, memory, power and MEMS devices

04/01/2015  Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02

03/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

GSA announces 2015 Board of Directors election results and appointment

03/19/2015  The Global Semiconductor Alliance (GSA) announced the appointment of two key executives as well as the results of its 2015 Board of Directors’ election.

NXP-Freescale merger to result in world's eighth largest chip maker

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

Process Watch: Know your enemy

03/18/2015  Anything that degrades the quality of the measurement also degrades the quality of the process because it introduces more variability into the Statistical Process Control (SPC) charts which are windows into the health of the process.

EV Group releases new configurations to its high-vacuum wafer bonding technology

03/17/2015  EV Group introduced two new configurations to its EVG 580 ComBond series of automated high-vacuum covalent wafer bonding systems.

High tech start-ups to connect with investors at SEMICON Europa 2015

03/17/2015  SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders.

Imec to honor TSMC Chairman Dr. Morris Chang with "Lifetime of Innovation Award"

03/17/2015  Nano-electronics research center imec has announced that it will award Dr. Morris Chang, founding chairman of Taiwan Semiconductor Manufacturing Company, Limited (TSMC), the world's first and largest semiconductor foundry, with a lifetime of innovation award.

SEMI reports 2014 global semiconductor equipment sales of $37.5B

03/17/2015  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $37.50 billion in 2014, representing a year-over-year increase of 18 percent.

Applied Materials honored as a 2015 World's Most Ethical Company

03/10/2015  Applied Materials, Inc. today announced it has been recognized as a 2015 World's Most Ethical Company by the Ethisphere Institute.

CEA-Leti announces launch of Silicon Impulse IC design competence center

03/10/2015  CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

SPIE 2015 Awards honor achievements in light-based technologies

03/09/2015  The awards recognize outstanding technical accomplishments and meritorious service to the society.

Boston Semi Equipment completes relocation of headquarters and Aetrium test handler business

03/05/2015  The new facility houses corporate functions as well as the Aetrium test handler business acquired in 2014 and relocated from Minnesota to Massachusetts.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS



3D Integration: The Most Effective Path for Future IC Scaling

Thursday, April 23, 2015 at 12:00 p.m. EST

It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

Sponsored By:
Trends in Materials: The Smartphone Driver

Thursday, April 30, 2015 at 1:00 p.m. EST

To understand 3-D FinFET doping and high mobility channel material, this talk will first review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015