Lithography

LITHOGRAPHY ARTICLES



SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

10/29/2014  Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

SMIC and ASML sign volume purchase agreement

10/27/2014  Semiconductor Manufacturing International Corporation and ASML Holding N.V. announce the signing of a volume purchase agreement that will provide SMIC with lithography systems from ASML.

EUV light source developer Adlyte achieves key performance milestone for high-volume manufacturing

10/22/2014  Adlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing (HVM)-readiness.

Gigaphoton achieves 3-hour continuous operation of EUV light source

10/21/2014  Gigaphoton Inc. announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50 percent duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment.

IBM to pay GlobalFoundries $1.5B to take over chip fabs

10/20/2014  IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

Growing momentum in semiconductor manufacturing in Vietnam

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

10/14/2014  India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

EUV and mask complexity

10/13/2014  EUV and mask complexity were the hot topics at this year’s SPIE Photomask Technology conference in Monterey, Calif.

Altera CEO John Daane to receive Robert N. Noyce Award

10/08/2014  The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

SEMI announces rising annual silicon wafer shipment forecast

10/07/2014  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

EV Group unveils room-temperature covalent bonder

10/06/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Photomask Technology speaker says EUV is nearly production-ready

10/03/2014  Highlights at the recent SPIE Photomask Technology 2014 conference included a confident announcement from ASML about current EUV source capabilities, an insightful industry-expert panel discussion on mask-making complexities, and fresh energy from the co-located SPIE Scanning Microscopies conference.

Gigaphoton introduces "eGrycos" for ArF immersion lasers

09/29/2014  Gigaphoton Inc., a lithography light source manufacturer, announced today that it has completed development of an electricity-reduction technology for its flagship “GT Series” of argon fluoride (ArF) immersion lasers used for semiconductor lithography processing.

United States photomask market to reach around $475M by 2019

09/29/2014  According to the recently published TechSci Research report, "United States Photomask Market Forecast & Opportunities, 2019", the photomask market in the United States is forecast to reach $474.58 billion by 2019.

SPIE Photomask Technology Wrap-up

09/23/2014  Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

SPIE panel tackles mask complexity issues

09/19/2014  Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

09/17/2014  Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015