Lithography

LITHOGRAPHY ARTICLES



SMIC TianJin launches capacity expansion project

10/18/2016  After the project's completion, SMIC TianJin is expected to become the world's largest integrated 8-inch IC production line.

SMIC Shanghai starts construction of a new 12-inch wafer fab

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

Wafer shipments forecast to increase in 2016, 2017 and 2018

10/13/2016  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2016–2018.

SEMI announces retirement of president and CEO

10/13/2016  McGuirk will continue to lead SEMI in his current capacity until a successor is appointed.

2016 wafer demand grows while semiconductor chip revenue declines, says Semico Research

10/11/2016  Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies.

200mm fabs on the rise

10/11/2016  Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009.

Companies maximizing 300mm, 200mm wafer capacity

10/07/2016  Reliance on existing wafer sizes increases as near-term outlook for 450mm wafers fades.

KLA-Tencor, Lam Research call off merger deal

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.

Global semiconductor industry posts largest monthly sales increase in 3 years

10/05/2016  August sales up 3.5 percent compared to July, increase year-to-year for first time in more than a year.

Keynotes announced, registration open for SEMICON Japan 2016

10/05/2016  Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan's "SuperTHEATER" focusing on innovation and insights into the future of the electronics supply chain.

Gigaphoton achieves a 10,000 kiloliter annual reduction of helium gas consumption

09/30/2016  Gigaphoton Inc. has announced that its helium-free technology has made it possible to achieve a 10,000 kiloliter annual reduction of helium gas consumed by high-output ArF immersion excimer lasers.

Top 5 takeaways from SEMI Strategic Materials Conference

09/29/2016  As the rate of traditional scaling slows, the chip sector looks increasingly to materials and design to move forward on multiple paths for multiple applications. Figuring out more effective ways to collaborate across silos will be crucial.

Leading-edge leads the way in pure-play foundry growth

09/28/2016  Sales of ICs built using <40nm process technology forecast to rise 23% at pure-play foundries.

North American semiconductor equipment industry posts August 2016 book-to-bill ratio of 1.03

09/27/2016  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

EV Group extends volume manufacturing expertise to biotech and medical applications

09/26/2016  EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

Shanhai Capital to acquire Analogix Semiconductor

09/23/2016  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced that they have entered into a definitive merger agreement under which a consortium led by Shanhai Capital will acquire all of the outstanding shares of Analogix for over $500 million.

SRC honors professors from University of Chicago and University of Michigan

09/22/2016  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from the University of Chicago and the University of Michigan in recognition of their outstanding contributions to semiconductor research.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

09/21/2016  EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS