Lithography

LITHOGRAPHY ARTICLES



Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

Third quarter 2016 worldwide semiconductor equipment billings reach $11B, reports SEMI

12/06/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$11.0 billion in the third quarter of 2016.

Human-focused research and IoT promise profound, positive changes, say Leti CEO

12/06/2016  Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things – guided by a "human-centered research approach and symbiotic development strategies" – herald profound changes in the way individuals relate to each other and to the physical world.

SEMI adds industry veteran to Americas leadership

11/30/2016  David Anderson joins as SEMI Americas President.

Novel silicon etching technique crafts 3-D gradient refractive index micro-optics

11/29/2016  A multi-institutional research collaboration has created a novel approach for fabricating three-dimensional micro-optics through the shape-defined formation of porous silicon (PSi), with broad impacts in integrated optoelectronics, imaging, and photovoltaics.

North American semiconductor equipment industry posts October 2016 book-to-bill ratio of 0.91

11/28/2016  The book-to bill ratio for October dropped below parity for the first time in 11 months, even though bookings and billings activity remains at elevated levels relative to last year.

Executives to get strategic perspectives for success at SEMI ISS 2017

11/17/2016  Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.

Registration open for SEMICON Korea 2017's special 30-Year anniversary

11/16/2016  Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

Gigaphoton enters a new development stage

11/10/2016  Company targets future growth ushered in with new slogan: Challenge for NEXT Growth.

New record for silicon-based multi-junction solar cell

11/09/2016  Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

President’s Council launches semiconductor working group

11/08/2016  Tthe President’s Council of Advisors on Science and Technology (PCAST) announced the formation of a new working group focused on strengthening the U.S. semiconductor industry in ways that benefit the nation’s economic and security interests.

ZEISS and ASML strengthen partnership for next generation of EUV lithography due in early 2020s

11/03/2016  Netherlands-based ASML Holding NV, a chip industry equipment provider, and Germany-based Carl Zeiss SMT, a business group of Carl Zeiss AG (ZEISS), have agreed to strengthen their long-standing and successful partnership in the semiconductor lithography business.

Qualcomm/NXP deal underscores semiconductor merger trend

11/02/2016  Qualcomm's proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale.

Global semiconductor sales increase 11.5% in Q3

11/01/2016  Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

Cadence CEO to be awarded Dr. Morris Chang Exemplary Leadership Award

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

Qualcomm to acquire NXP

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

SEMICON Europa opens tomorrow in Grenoble, France

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS