Lithography

LITHOGRAPHY ARTICLES



2016 semiconductor sales to go negative, says Semico Research

03/15/2016  After analyzing current trends, Semico announced the semiconductor industry is repeating the pattern from 2011-2012, albeit at a muted level.

Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

03/14/2016  Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.

EV Group scales up nanoimprint lithography for display manufacturing

03/14/2016  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 7200 LA SmartNIL system for display manufacturing and other applications that require large-area substrates.

Intel honors 27 companies with Preferred Quality Supplier and Achievement Awards

03/11/2016  Intel Corporation this week recognized 26 companies with its 2015 Preferred Quality Supplier (PQS) award, which celebrates exceptional performance and continuous pursuit of excellence.

JOANNEUM RESEARCH and EV Group develop large-area nanoimprint lithography solutions

03/10/2016  EVG and JOANNEUM RESEARCH today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG770 automated UV-nanoimprint lithography step-and-repeat system.

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

Toppan Printing develops EUV photomask for semiconductors

03/03/2016  Toppan Printing Co., Ltd. announced it has developed a next-generation EUV photomask for semiconductors.

Taiwan passes South Korea to become #1 in total IC wafer fab capacity

03/01/2016  IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region, and by product type through 2020.

Nova and imec developed scatterometry approach for self-aligned quadruple patterning process control

02/26/2016  imec and Nova Measuring Instruments announced this week that they are jointly developing an innovative scatterometry approach to enable SAQP process control.

Bipartisan customs bill combats counterfeit semiconductors

02/26/2016  The Semiconductor Industry Association (SIA) applauded congressional approval of legislation that includes a key provision to combat counterfeit semiconductors.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

imec reveals impact of DSA process variations on electrical performance of DSA-formed vias

02/24/2016  Today, at SPIE Advanced Lithography Conference, imec will present electrical results of DSA-formed vias, gaining insight in the impact of DSA processing variations on electrical readout.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

Imec, Inpria and TEL demonstrate integrated fab process for metal-oxide EUV photoresist

02/23/2016  imec, Inpria and TEL will present the first integrated patterning process for next generation high-resolution devices using a non-chemically amplified metal containing photoresist and EUV lithography.

New industry realities and opportunities at semiconductor manufacturing conference

02/23/2016  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York.

Semiconductor capital spending rebound fails to materialize in 2015

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

Neon shortage coming

02/18/2016  Semiconductor lithographic use of Neon is increasing more rapidly than expected for several reasons including the delay of EUVL while demand for finer line width patterning is increasing.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS