Lithography

LITHOGRAPHY ARTICLES



Flip chip technology supported by wider adoption of Cu pillar tech

10/01/2015  Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12” eq. wafers) in 2020, supported by the wider adoption of Cu pillar technology.

ASML ships new TWINSCAN NXT immersion lithography platform

09/30/2015  ASML announced the first shipment of its new TWINSCAN (TM) NXT:1980Di immersion lithography system to support increasingly demanding multiple-patterning performance requirements.

Intel Mask Engineer Reports "Steady Progress" in EUV Masks

09/30/2015  Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress.

Mask Conference Highlights Progress in Lithography

09/30/2015  Harry J. Levinson, senior director of technology research at GlobalFoundries, took “Lithography and Mask Challenges at the Leading Edge” as the theme for his keynote presentation Tuesday morning, opening the SPIE Photomask Technology 2015 conference in Monterey, California.

eBeam Initiative survey shows rising optimism in EUV lithography, multi-beam technology for photomask production

09/29/2015  The eBeam Initiative announced the completion of its fourth annual eBeam Initiative members' perceptions survey.

CMP Technology Evolving to Engineer Surfaces

09/28/2015  New devices, materials, and substrates challenge atomic-scale integration.

SEMI Conference Addresses Issues in Semiconductor Materials

09/25/2015  The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”

Linde Electronics Presents 2014 Global Supplier Awards

09/25/2015  Electronic Fluorocarbons LLC and Albemarle Corporation recognized for quality, safety, service and technology performance.

GlobalFoundries CTO Calls for Innovation in Chip Materials

09/24/2015  Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.

TSMC Moves from 16nm to 10nm to 7nm

09/21/2015  While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

Dialog Semiconductor to acquire Atmel for $4.6 billion

09/21/2015  Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion.

TSMC Forum Emphasizes Industry Collaboration

09/17/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Semiconductor Research Corporation expands benchmarking research program

09/09/2015  Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research.

Automotive industry now the third largest end market for power semiconductors

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

Intel's Bill Holt awarded Robert N. Noyce Award

09/03/2015  Holt will accept the award at SIA's Annual Award Dinner on Thursday, Dec. 3.

20th annual SEMICON Taiwan 2015 opens today

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Knowm First to Deliver Configurable Artificial Neural Networks using Bi-Directional Learning Memristors

09/02/2015  Breakthrough memristor technology combined with novel adaptive architecture enables machine learning (ML) and artificial intelligence (AI) applications.

Laith Altimime joins SEMI as President of SEMI Europe

09/01/2015  SEMI, the global association serving the electronics supply chain, today announced the appointment of Laith Altimime as president of SEMI Europe, effective October 1, 2015.

Solid State Watch: August 21-27, 2015

08/31/2015  New ams fab going to Marcy, NY: Startups and small electronics companies spent $78.3 billion on semiconductors in 2014; Pure-play foundry sales forecast to grow to all-time high in 4Q15; University of Colorado and SRC research accelerates microscopic imaging for next-generation nanoelectronics




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TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016