Lithography

LITHOGRAPHY ARTICLES



North American semiconductor equipment industry posts June 2016 book-to-bill ratio of 1.00

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

2016 IEEE IEDM to showcase the latest tech developments in micro/nanoelectronics

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

International Technology Roadmap for Semiconductors examines next 15 years of chip innovation

07/21/2016  Final installment of biannual report outlines short-term and long-term challenges and opportunities facing semiconductor technology.

New materials need new handling approaches

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

Packaging and displays drive new litho requirements

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

Global Neon Demand Expected to Exceed Increasing Supply

07/13/2016  Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

SEMICON West Day 2: Don't Miss

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

200mm fabs reawakening

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

Test Protocols for the IoT

07/12/2016  The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

IC innovation at heart of decade of disruption

07/12/2016  On Monday, imec – the Leuven Belgium-based research consortium – hosted its annual imec Technology Forum (ITF) USA, a half-day conference at the Marriott Marquis.

TECHCET 2016 forecast: $1.39B in photoresists, $680M in extensions

07/08/2016  Photoresist manufacturers had reason to smile as fiscal 2015 closed, with sales growing nicely to $1.37B, a 6.2% increase over 2014.

IC Insights lowers 2016 semiconductor market forecast to -1%

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.

Gigaphoton's EUV light source achieves 250W output at 4.0% conversion efficiency

07/07/2016  Gigaphoton Inc. has announced success in achieving 250W light output at 4.0% conversion efficiency with a Laser-Produced Plasma (LPP) light source prototype for EUV scanners, which the company is currently engaged in developing.

Rising number of fabless semiconductor companies, test houses to augment chip handler market

07/07/2016  According to the latest market research report by Technavio, the semiconductor chip handler market is expected to grow at a CAGR of over 4% until 2020.

Nova and Leti collaborate to enhance process control schemes for advanced lithography

07/07/2016  Leti, an institute of CEA Tech, and Nova Measuring Instruments announced today a joint program to develop innovative metrology methods to enable leading-edge process control solutions for multi e-beam and directed self-assembly (DSA) advanced lithography techniques.

Global semiconductor sales up slightly in May

07/05/2016  Sales increase 0.4 percent compared to April, decrease 7.7 percent year-to-year.

Plasma-Therm acquires Nano Etch Systems Inc.

07/05/2016  Plasma-Therm, a supplier of wafer process technology solutions to specialty semiconductor and nanotechnology markets, has acquired Nano Etch Systems Inc. of California, a developer of ion beam etch (IBE) and ion beam deposition (IBD) systems.

SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

07/01/2016  SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of the MA/BA Gen4 series today.

ASML president to receive Robert N. Noyce Award

06/30/2016  Van den Brink will accept the award at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose, an event that will commemorate the 25thanniversary of the Noyce Award.

FormFactor completes acquisition of Cascade Microtech

06/28/2016  FormFactor, Inc. today announced that it has completed the acquisition of Beaverton, Oregon-based Cascade Microtech, Inc.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS