Semiconductor market worth $332B in 2015

07/28/2015 added 2015 semiconductor market research reports that forecast a 2.9 percent CAGR to 2020 for semiconductor industry and a 6.7 percent rise from 2014 in the semiconductor equipment market size during 2015 across the world.

North American semiconductor equipment industry posts June 2015 book-to-bill ratio

07/22/2015  North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders worldwide in June 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the June EMDS Book-to-Bill Report published today by SEMI

Analog Devices joins SRC's Trustworthy and Secure Semiconductors and Systems Initiative

07/20/2015  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced that Analog Devices, Inc. has joined SRC’s hardware cybersecurity research program called Trustworthy and Secure Semiconductors and Systems (T3S).

Got MEMS? Get In Touch With memsstar For Production Equipment

07/17/2015  As you might guess from the company’s name, memsstar is involved in microelectromechanical system (MEMS) devices. The company offers manufacturing equipment for “MEMS-specific production,” says CEO Tony McKie.

Tanaka Precious Metals Is Big in Bonding Wires, Other Products

07/17/2015  Tanaka Precious Metals, a company dating back to 1885, is a leading supplier of gold bonding wire and other types of bonding wire for semiconductor packaging. It also specializes in electroplating equipment, unveiling a new system for research and development applications at SEMICON West 2015.

EUV: Unlike anything else in the fab

07/16/2015  Imagine EUV lithography in high volume production. ASML has been working for years to make it happen.

International Consortium Sets Up Shop for Advanced Manufacturing Research

07/16/2015  A metropolitan area in the center of the state is putting together a public-private partnership to attract high-tech companies, convincing them to set up shop and create jobs. Part of the attraction is a big public university, engaging in advanced research.

Low-Cost Manufacturing of Flexible Functionalities

07/15/2015  FlexTech Alliance updates on substrates, processes, and devices.

Gases: Completely Necessary to Semiconductor Manufacturing

07/15/2015  Silicon wafers. Semiconductor packaging. These are commonly known products in materials for manufacturing and assembling microchips. Process gases? Not as familiar a commodity, yet they are just as critical to semiconductor manufacturing.

Leti and EVG launch INSPIRE

07/15/2015  CEA-Leti and EV Group launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the nano-patterning technology and spread its use for applications beyond semiconductors.

CoorsTek Increases its Business with Covalent Acquisition, Organic Growth

07/14/2015  CoorsTek made one of the biggest acquisitions of its century-long history late last year in purchasing Covalent Materials, formerly known as Toshiba Ceramics.

Technologies for Advanced Systems Shown at IMEC Tech Forum USA

07/14/2015  R&D summarized of the nanoscale building blocks for our fab future.

Applied Materials' new etch system provides atomic-level precision

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

IBM Research alliance produces industry's first 7nm node test chips

07/09/2015  IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

07/07/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

Process Watch: Increasing process steps and the tyranny of numbers

07/06/2015  Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

Tackling advanced litho challenges on the path to node 5

07/02/2015  If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

GLOBALFOUNDRIES completes acquisition of IBM Microelectronics business

07/01/2015  GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.

Building a better semiconductor

06/29/2015  Research led by Michigan State University could someday lead to the development of new and improved semiconductors.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015