Lithography

LITHOGRAPHY ARTICLES



Update on neon shortage 2016 highlighted at the Critical Materials Conference

04/04/2016  Communication with suppliers in the Ukraine and China have continued to verify expected shortages occurring toward the end of 2016. Although supply appears stable now, inventories purchased during the second half of 2015 will deplete inventories on the supplier side toward the end of this year.

Global semiconductor sales dip slightly in February

04/04/2016  Sales decrease 3.2 percent month-to-month and 6.2 percent year-to-year.

Global semiconductor market slumps in 2015, IHS reports

04/04/2016  Weakness in end-market demand will cause revenue decay to extend into 2016 and beyond.

China's semiconductor strategy

03/30/2016  China has become the largest and the fastest growing market in the world. 40% of the worldwide semiconductor shipments go to China and that’s expected to increase to almost 42% in 2019.

Synopsys Debuts Tools at Users Group Meeting

03/30/2016  Aart de Geus, the chairman and co-chief executive officer of Synopsys, used his keynote address at the 2016 Synopsys Users Group conference in Silicon Valley to tout a pair of new products.

Chipmakers seek solution to neon gas supply shortage

03/30/2016  Finding a short term solution to the neon gas shortage problem will be challenging.

Bath semiconductor research boosted by new nano-scale patterning equipment

03/24/2016  The University of Bath is the only university in the UK to have installed a unique Nano-Lithography printing system, enabling Bath to lead the way in the development of advanced manufacturing techniques for nano-engineered semiconductors.

3D Chips, New Packaging Challenge Metrology and Inspection Gear

03/21/2016  Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Molecular Modeling of Materials Defects for Yield Recovery

03/21/2016  New materials are being integrated into High Volume Manufacturing (HVM) of semiconductor ICs, while old materials are being extended with more stringent specifications.

Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production

03/17/2016  Mentor Graphics Corporation today announced further enhancements and optimizations to the Calibre® platform and Analog FastSPICE™ (AFS) platform by completing TSMC 10nm FinFET V1.0 certification.

Replacement for silicon devices looms big with ORNL discovery

03/17/2016  Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

Linde Supports New Wave of PV Plants in SE Asia

03/17/2016  The Linde Group supports the expansion of photovoltaic solar cell manufacturing in Southeast Asia by offering its full portfolio of gases and wet chemicals, along with engineering services, to help the new PV cell plants being established in the region.

New MEMS Design Contest Encourages Advances in MEMS Technology

03/16/2016  Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being launched at DATE 2016.

2016 semiconductor sales to go negative, says Semico Research

03/15/2016  After analyzing current trends, Semico announced the semiconductor industry is repeating the pattern from 2011-2012, albeit at a muted level.

Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

03/14/2016  Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.

EV Group scales up nanoimprint lithography for display manufacturing

03/14/2016  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 7200 LA SmartNIL system for display manufacturing and other applications that require large-area substrates.

Intel honors 27 companies with Preferred Quality Supplier and Achievement Awards

03/11/2016  Intel Corporation this week recognized 26 companies with its 2015 Preferred Quality Supplier (PQS) award, which celebrates exceptional performance and continuous pursuit of excellence.

JOANNEUM RESEARCH and EV Group develop large-area nanoimprint lithography solutions

03/10/2016  EVG and JOANNEUM RESEARCH today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG770 automated UV-nanoimprint lithography step-and-repeat system.

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

Toppan Printing develops EUV photomask for semiconductors

03/03/2016  Toppan Printing Co., Ltd. announced it has developed a next-generation EUV photomask for semiconductors.




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Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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