Lithography

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LITHOGRAPHY ARTICLES



New nanowire structure absorbs light efficiently

02/27/2015  Researchers at Aalto University, Finland have developed a new method to implement different types of nanowires side-by-side into a single array on a single substrate.

SPIE Advanced Lithography conference concludes

02/27/2015  Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

02/27/2015  In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Top semiconductor R&D leaders ranked for 2014

02/26/2015  Intel’s R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase; Nvidia with highest R&D/sales ratio.

Directed Self Assembly Hot Topic at SPIE

02/25/2015  At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Proponents of EUV, immersion lithography face off at SPIE

02/25/2015  The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and TSMC. On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.

AG Semiconductor Services and JA Mitsui Leasing join forces

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

SPIE plenary takes in photonics, 3DICs, connected devices

02/23/2015  Speakers at the plenary session of the SPIE Advanced Lithography conference covered a wide variety of topics, from photonics to 3D chips to the Internet of Things, on Monday morning, February 23, in San Jose, Calif.

Complexity is the Theme at Lithography Conference

02/23/2015  Nikon and KLA-Tencor put on separate conferences in San Jose, Calif., on Sunday, February 22, tackling issues in advanced optical lithography. The overarching theme in both sessions was the increased complexity of lithography as it approaches the 10-nanometer and 7nm process nodes.

Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulse

02/23/2015  Cymer, an ASML company, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the shipment of its first XLR 700ix light source.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

02/20/2015  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

02/19/2015  Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Imec reports breakthrough results on DSA

02/19/2015  At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development.

eBeam Initiative announces education and collaboration focus on reactivating density benefits of Moore's Law

02/17/2015  The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that its top theme for 2015 will be the reactivation of the density benefits of Moore's Law through eBeam technology.

Gigaphoton achieves continuous 140W EUV light source output at 50% duty cycle

02/17/2015  Further contributing to the realization of a mass production-quality LPP light source for EUV scanners

SEMI wins semiconductor etch equipment export control ruling

02/11/2015  This week, after a four-month investigation, the U.S. Department of Commerce declared the export controls on certain etch equipment and technology ineffective, thereby removing a cumbersome and onerous impediment to efficient trade.

Applied's merger with TEL: Still a work in progress

02/11/2015  Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

02/10/2015  The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Qualcomm and China's National Development and Reform Commission reach resolution

02/09/2015  Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.




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TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

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Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

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EVENTS



SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015