MAGAZINE |
HEADLINESINSOLVENCY NOTICE: AUSTRALIAN FILLING & PACKAGING MACHINES ISSUES 'ADVANCED SEARCH'
January 29, 2015 G2 Crowd publishes Winter 2015 rankings of cross-channel advertising platforms; Two platforms earn Leader status while Marin Software tops overall satisfaction rankings in Winter 2015 report January 28, 2015 Garmin unveils Approach S5 GPS golf watch January 28, 2015 Printing Quantum Dot Displays January 28, 2015 LEDs with Pattern Generators for Image Processing January 28, 2015 Philips signs 'largest street lighting upgrade' January 28, 2015 Canadian Transportation Agency Intermediate/Senior Database Developer Analyst January 28, 2015 New funding to create manufacturing hub for nano-engineering January 28, 2015 Regional Applications Engineer January 28, 2015 Applications Engineer, Senior January 28, 2015 |
FINANCIALS |
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TECHNOLOGY PAPERS Epoxies and Glass Transition Temperature Gain a better understanding about glass transition temperature (Tg) and why
it is one of many factors to consider for bonding, sealing, coating and
encapsulation applications. In this paper, we explore how temperature
impacts the performance of polymers, why glass transition temperature is
significant, and how it is measured. Tg can be an extremely useful yardstick
for determining the reliability of epoxies as it pertains to temperature.January 09, 2015 Enhancing the Reliability of Flip Chip Assemblies with Underfill EncapsulantsThe development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014 Conformal Coatings for Reliable Electronic AssembliesModern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014 |
WEBCASTSFinFETsFebruary 2015 (Date and time TBD) FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.
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3D IntegrationMarch 2015 (Date and time TBD) Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.
Sponsored By:
MaterialsApril 2015 (Date and time TBD) Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.
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VIDEOS |
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EVENTSLithoVision 2015San Jose, California United States https://www.nikonprecision.com/lithovision/ February 22, 2015 - February 22, 2015 MEMS Executive Congress Europe 2015Copenhagen, Denmark https://memsindustrygroup.site-ym.com/events/event_details.asp?id=454597&gr March 04, 2015 - March 05, 2015 |
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