Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

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Grenoble, France
October 25, 2016 - October 27, 2016
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November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
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December 03, 2016 - December 07, 2016
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May 14, 2017 - May 17, 2017