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MANUFACTURING ARTICLES



The future of MEMS in the IoT

09/03/2015  SEMI’s European MEMS Summit will be held on 17-18 September 2015 in Milan, Italy. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.

Knowm first to deliver memristors capable of bi-directional learning

09/02/2015  Milestone confirmed by groundbreaking new data; bi-directional incremental capability allows startup to leapfrog IBM and other established competitors in emerging computing fields.

BeSpoon's position-tracking system captures and displays real-time data to improve sports teams' performance

08/31/2015  BeSpoon SAS today launched BeSpoon Sport Edition, an ultra-precise position-tracking system that allows teams to measure and analyze player movement in three dimensions and provide immediate feedback to improve performance.

Three markets will drive the wearable industry

08/28/2015  Yole’s analysts explain wearable is, without doubts, a promising industry. But, who will take benefit of this attracting market, growing from US$22 billion in 2015 to more than US$ 90 billion by 2020?

These microscopic fish are 3-D-printed to do more than swim

08/26/2015  These proof-of-concept synthetic microfish will inspire a new generation of "smart" microrobots that have diverse capabilities such as detoxification, sensing and directed drug delivery, researchers said.

EV Group organizes Photonics Workshop in conjunction with MNE Conference

08/25/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference.

What to expect from the European MEMS Summit Conference

08/25/2015  As Bosch, InvenSense and STMicroelectronics continue to go head-to-head in an attempt to capture the biggest shares of the growing MEMS market, SEMI has announced that it will bring these MEMS giants together in an unprecedented European conference & exhibition to discuss the future of MEMS and Sensors.

MEMS Executive Congress US 2015 examines commercial forces driving MEMS & sensors to $20B by 2020

08/18/2015  MEMS Industry Group (MIG)'s next MEMS Executive Congress US 2015 will explore the market drivers behind the double-digit growth propelling MEMS and sensors to more than $20+ billion by 2020.

SUSS MicroTec announces new competence-center for nanoimprint in North America

08/18/2015  SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies.

Challenges for MEMS, sensors, and semiconductors

08/11/2015  Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

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TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015