05/25/2016 With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.
05/25/2016 Nanoelectronics research center imec, Holst Centre (set up by imec and TNO) and micro-electronic design house Barco Silex, belonging to the Barco group, today announced that they will collaborate to implement data security into sensors for wearable devices and Internet of Things (IoT) sensor networks.
04/29/2016 The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?
04/18/2016 Scientists at the National Institute of Standards and Technology (NIST) have now developed a miniaturized version of a frequency converter, using technology similar to that used to make computer chips.
04/05/2016 STMicroelectronics has surpassed two billion unit sales of its robust and versatile STM8 microcontrollers, less than two years after reaching one billion unit sales, noting particularly strong success in China.
04/01/2016 In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.
03/24/2016 Since 2000, we have entered the age of sensing and interacting with the wide diffusion of MEMS and sensors that give us a better, safer perception of our environment. MEMS have grown in volume to be almost a 15 billion units market today.
03/24/2016 Teams vie for expert consulting services, MEMS foundry package, specialized software tools, industry group membership.
03/17/2016 SITRI and CEA-Leti, in affiliation with MINATEC, this week announced the signing of a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies to power the emerging Internet of Things (IoT) market.
03/16/2016 The semiconductor IP market is expected to reach $7.01 billion USD by 2022 from USD 3.09 Billion in 2015, at a CAGR of 10.55% between 2016 and 2022, according to the newly released report from MarketsandMarkets.
03/11/2016 Nanoelectronics research center imec has today announced the opening of its new 300mm cleanroom.
03/09/2016 IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.
03/07/2016 EV Group (EVG) today announced that its EVG GEMINI 300mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing.
June 21, 2016 at 1 PM ET / Sponsored by Air Products
June 2016 (Date and time TBD)/Sponsored by Air Products
June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
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XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.