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Global MEMS market for mobile devices forecast to grow at a CAGR of 10.55%

04/12/2018  Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

Worldwide PC shipments declined 1.4% in first quarter of 2018

04/12/2018  Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc.

6 key takeaways from ISS Europe 2018

04/11/2018  With its leading research and development hubs, materials and equipment companies and chipmakers, the EU is in a strategic position in the global electronics value chain to support the growth of emerging applications such as autonomous driving, internet of things, artificial intelligence and deep learning.

The 2018 Symposia on VLSI Technology & Circuits covers converging trends in machine learning, artificial intelligence & the IoT

04/09/2018  The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for 'smart living.'

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

GLOBALFOUNDRIES launches RF ecosystem program to accelerate time-to-market for wireless connectivity, radar and 5G applications

03/20/2018  GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFWave, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.

Imec honors Qualcomm founder Irwin M. Jacobs with Lifetime of Innovation Award

03/14/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, today presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm.

EV Group and IBM sign license agreement on laser debonding technology

03/14/2018  IBM's Hybrid Laser Release Process technology complements EV Group's low-temperature laser debonding equipment and process portfolio designed to enable highly flexible, high-throughput solution.

Researchers develop spectroscopic thermometer for nanomaterials

03/13/2018  A scientific team led by the Department of Energy's Oak Ridge National Laboratory has found a new way to take the local temperature of a material from an area about a billionth of a meter wide, or approximately 100,000 times thinner than a human hair.

Micron appoints Raj Talluri as senior vice president and general manager of Mobile Business Unit

03/13/2018  Micron Technology Inc. announced today that the company has appointed Raj Talluri as senior vice president and general manager of the Mobile Business Unit.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

New approach to measuring stickiness could aid micro-device design

03/08/2018  Brown University engineers have devised a new method of measuring the stickiness of micro-scale surfaces. The technique, described in Proceedings of the Royal Society A, could be useful in designing and building micro-electro-mechanical systems (MEMS), devices with microscopic moving parts.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

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Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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