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MANUFACTURING ARTICLES



Many mixes to match litho apps

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

New nanodevice shifts light's color at single-photon level

04/18/2016  Scientists at the National Institute of Standards and Technology (NIST) have now developed a miniaturized version of a frequency converter, using technology similar to that used to make computer chips.

STMicroelectronics accelerates STM8 sales past two billion units

04/05/2016  STMicroelectronics has surpassed two billion unit sales of its robust and versatile STM8 microcontrollers, less than two years after reaching one billion unit sales, noting particularly strong success in China.

Heat and light get larger at the nanoscale

04/01/2016  In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.

A new virtuous cycle for the MEMS industry

03/24/2016  Since 2000, we have entered the age of sensing and interacting with the wide diffusion of MEMS and sensors that give us a better, safer perception of our environment. MEMS have grown in volume to be almost a 15 billion units market today.

Entrepreneurs to compete in MEMS Shark Tank at Hilton Head 2016

03/24/2016  Teams vie for expert consulting services, MEMS foundry package, specialized software tools, industry group membership.

SITRI, CEA-Leti and MINATEC to cooperate in "More than Moore" technology development

03/17/2016  SITRI and CEA-Leti, in affiliation with MINATEC, this week announced the signing of a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies to power the emerging Internet of Things (IoT) market.

Semiconductor IP market worth $7.01B by 2022

03/16/2016  The semiconductor IP market is expected to reach $7.01 billion USD by 2022 from USD 3.09 Billion in 2015, at a CAGR of 10.55% between 2016 and 2022, according to the newly released report from MarketsandMarkets.

Imec opens new 300mm cleanroom for 7nm and beyond chip scaling

03/11/2016  Nanoelectronics research center imec has today announced the opening of its new 300mm cleanroom.

IoT Planet to co-locate with SEMICON Europa in 2016

03/09/2016  IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.

EV Group brings 300mm wafer bonding to MEMS manufacturing with GEMINI Automated Wafer

03/07/2016  EV Group (EVG) today announced that its EVG GEMINI 300mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing.

New NTU microchip shrinks radar cameras to fit into a palm

02/23/2016  NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

Vesper partners with AAC Technologies on piezoelectric MEMS microphones

02/22/2016  Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.

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Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
MEMS: Current Status and Future Directions

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

In 2015, the MEMS market did not grow as much as we initially expected. In the past, the Smart Phone industry was a strong driver of the MEMS industry with ever increasing volume. Today, MEMS are becoming commodity products with very low price. The webcast will review the latest market data and forecasts for the future. The MEMS “commoditization” paradox will be discussed as well as latest technical trends (sensors combos, packaging).

Sponsored By:
Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS