Manufacturing

MANUFACTURING ARTICLES



Frank Shemansky to lead SEMI's MEMS & Sensors Industry Group

02/13/2018  SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

Leti Chief Scientist Barbara De Salvo to deliver opening day talk on brain-inspired technologies at ISSCC 2018

02/08/2018  Delivering a keynote talk during the Feb. 12 plenary session that formally opens the conference, De Salvo will note that the architecture will include human-brain inspired hardware coupled to new computing paradigms and algorithms that "will allow for distributed intelligence over the whole IoT network, all-the-way down to ultralow-power end-devices."

A billion devices from SiTime empower self-driving cars, mobile phones, and everything in between

02/07/2018  SiTime Corporation, a developer of MEMS timing devices, announced today that it has shipped cumulatively over 1 billion timing devices.

MACOM and STMicroelectronics to bring GaN on silicon to mainstream RF markets and applications

02/07/2018  MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs

02/06/2018  Texas Instruments (TI) today introduced the industry's smallest operational amplifier (op amp) and low-power comparators at 0.64 mm2.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

New sensor for measuring electric field strength

01/26/2018  TU Wien has developed a sensor for measuring the strength of electric fields, which is much smaller, simpler and less prone to distortion than comparable devices.

Growth of IoT to drive the global reset IC market

01/23/2018  Technavio market research analysts forecast the global reset IC market to grow at a CAGR of close to 12% during the forecast period, according to their latest report.

ASML announces appointment of new CFO to the Board of Management

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Boston Semi Equipment receives multisystem order for Zeus pressure MEMS test handler

01/11/2018  Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and provider of test automation technical services, announced today that it has received a multisystem order for its Zeus gravity feed systems for handling pressure MEMS devices.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

Global semiconductor sales increase 21.5% year-to-year in November

01/03/2018  Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

SEMI data projects new highs in fab equipment spending

01/03/2018  The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion.

The coldest chip in the world

12/20/2017  Physicists at the University of Basel have succeeded in cooling a nanoelectronic chip to a temperature lower than 3 millikelvin.

Tessera reaches global settlement with Broadcom

12/18/2017  Settlement includes multi-year license agreement.

The world's 1st "7-axis" motion tracking devices: tiner package & better response time

12/13/2017  Accelerometers and gyroscopes are fueling the robotic revolution, especially the drones’ market segment. However, these MEMS devices are not the only ones on the market place anymore, with environmental sensors penetrating this industry too.

ProPlus and MPI Corporation establish strategic partnership

12/12/2017  ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

Nambi Seshadri wins 2018 IEEE Alexander Graham Bell Medal

12/05/2017  Awarded for exceptional contributions to communications and networking sciences and engineering.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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VIDEOS