Manufacturing

MANUFACTURING ARTICLES



MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

08/15/2014  MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

Global pressure sensors market is expected to reach $9.36B in 2020

08/14/2014  The global pressure sensors market was valued at $6.53 billion USD in 2013, growing at a CAGR of 6.2% from 2014 to 2020 to account for $9.36 billion USD in 2020.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

08/13/2014  A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

NJR and UMC extend collaboration on MEMS microphone manufacturing

08/07/2014  New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

National Science Foundation tests out the assembly line of the future

08/05/2014  NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

SEMATECH and CNSE/SUNYIT launch CMP Center

07/08/2014  The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

Smart, sustainable manufacturing: new sensors for process monitoring

07/03/2014  Industries ranging from chemicals to agri-food to bio-tech and pharmaceuticals are looking at new sensor technologies to streamline processes and improve quality control.

The bright future of Si photonics

06/25/2014  Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.

memsstar relocates; Increases manufacturing capacity by 40%

06/18/2014  memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced that it has relocated to a new, larger facility.

InvenSense unveils gyroscope for high speed motion and wearable applications

06/11/2014  InvenSense, Inc., the provider of MotionTracking system on chip (SoC) and sound devices, announced the world’s widest full scale range (FSR) 3-axis MEMS gyroscope for high impact wearable applications.

Sensor hubs make big gains while enabling the future of sensing

04/30/2014  Sensor hubs that offload tasks from power-hungry application processors and let mobile devices like smartphones and tablets run longer on a single battery charge are reaping gargantuan gains thanks to the global microelectromechanical systems (MEMS) market

imec reports 4 percent growth in 2013 fiscal year

04/24/2014  Revenue for 2013 totaled 332 million euro, a four percent growth from the previous year.

Global scientific team "visualizes" a new crystallization process

04/17/2014  Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.

MEMS microphones broadcast strong growth

04/04/2014  Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

6 and 9-axis DOF sensors are creating a new paradigm in the combos business

03/18/2014  Over the last years, inertial MEMS have been subject to dramatic market & technological evolution. This has been driven by a large increase of the consumer market.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

02/03/2014  "Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

New "photodetector" nanotechnology allows photos in near darkness

01/29/2014  Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

01/28/2014  MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

2014 Outlook: An era of unprecedented change

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014