Manufacturing

MANUFACTURING ARTICLES



Researchers make flexible glass for tiny medical devices

03/24/2017  Glass can bend over and over again on a nanoscale.

Intel elects two new members to Board of Directors

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Eutelsat, ST announce low-cost, low-power System-on-Chip for interactive satellite terminals

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

Semiconductor manufacturing's next big thing at ASMC 2017

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

Nano 'sandwich' offers unique properties

02/27/2017  Rice University researchers simulate two-dimensional hybrids for optoelectronics.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

Improved polymer and new assembly method for ultra-conformable 'electronic tattoo' devices

02/22/2017  Process uses household inkjet printer without soldering to create 750nm-thin elastomeric sheet.

Flemish government increases financial support of imec

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Vital Control in Fab Materials Supply-Chains - Part 2

02/16/2017  Expert panel discussion at Critical Materials Council (CMC) Conference

imec debuts plastic NFC tag, compatible to ISO protocols

02/07/2017  Innovative tag is the thinnest and mechanically most robust technology compatible to ISO protocols.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

ams announces completion of transaction to acquire Heptagon

01/25/2017  ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

Vital Control in Fab Materials Supply-Chains

01/25/2017  Expert panel discussion at Critical Materials Council (CMC) conference.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS