Manufacturing

MANUFACTURING ARTICLES



Stamping technique creates tiny circuits with electronic ink

12/09/2016  New stamping technique creates functional features at nanoscale dimensions.

State of the art sensors made from graphene and children's toy silly putty

12/09/2016  World-first graphene innovation could be used for applications in medical devices and diagnostics.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

12/07/2016  EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

Delivering a power punch

12/05/2016  Microscale energy storage units for wearable and miniaturized electronic devices are improved using porous materials.

QuickLogic joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/01/2016  QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Lab4MEMS project recognized with European Innovation Award

11/28/2016  Project developed pilot line for next-generation MEMS devices.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

SMIC and IMECAS sign an agreement for MEMS R&D and foundry platform

11/15/2016  Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

Fan-in wafer-level packaging market to grow due to high demand for miniaturized electronics

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

MicroVision and STMicroelectronics to co-market MEMS mirror-based laser beam scanning solutions

11/10/2016  MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.

Analog Devices makes MEMS switch technology a commercial reality

11/08/2016  Analog Devices, Inc. (ADI) today introduced a breakthrough in switch technology that provides a long-sought replacement for electromechanical relay designs first adopted by the electronics industry more than 100 years ago.

Automotive systems forecast to show strongest growth through 2020

11/03/2016  Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.

WORLD OF IOT grows with 30 new exhibitors at SEMICON Japan

11/03/2016  Today, SEMI announced that WORLD OF IOT, a show-within-a-show at SEMICON Japan 2016, will expand with the addition of 30 new exhibitors.

The gas sensor market is about to change

11/02/2016  Nowadays, the number of enforceable patents dedicated to miniaturized gas sensors is increasing worldwide, and several companies already stand out by their strong IP position.

A tiny machine

10/31/2016  UCSB electrical and computer engineers design an infinitesimal computing device.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

When it comes to atomic-scale manufacturing, less really is more

10/28/2016  Electrical currents can be now be switched on and off at the smallest conceivable scale enabling a new generation of 'green electronics' with the potential for great impact on the digital economy.

Next-generation smartphone battery inspired by the gut

10/26/2016  Researchers have developed a prototype of a next-generation lithium-sulphur battery which takes its inspiration in part from the cells lining the human intestine. The batteries, if commercially developed, would have five times the energy density of the lithium-ion batteries used in smartphones and other electronics.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:
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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS