Manufacturing

MANUFACTURING ARTICLES



Shipments of residential Internet of Things devices expected to total over $330 billion through 2025

11/10/2015  A recent report from Navigant Research suggests the global market for residential IoT devices will grow strongly through 2025.

Advance could bring commercial applications for silver nanowires

11/10/2015  New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

New MEMS, Sensors Emerge at MEMS Executive Congress US

11/09/2015  A wide variety of microelectromechanical system (MEMS) devices, sensors, and MEMS sensors were described and introduced at the MEMS Executive Congress US in Napa, Calif.

MEMS, Sensors Poised for Growth in the Internet of Things Era

11/09/2015  Not all segments in MEMS and sensors are enjoying hockey-stick growth forecasts, as commoditization and pricing pressures take hold. This was just one of the insights gleaned at last week’s MEMS Executive Congress US 2015.

GLOBALFOUNDRIES achieves 14nm finFET technology success for next-generation AMD products

11/06/2015  GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

China to dominate flat panel display manufacturing by 2018, IHS

11/05/2015  China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

MEMS Executive Congress US Speaker Looks at MEMS Past, Present, and Future

11/04/2015  Much has changed in the world of microelectromechanical system (MEMS) devices in the past 20 years, and much more will change in the next two decades, said Steve Nasiri of Nasiri Ventures in his keynote address Wednesday (November 4) at the MEMS Executive Congress US conference in Napa, Calif.

FEI announces agreement to acquire DCG Systems

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

New Helios G4 Series DualBeam from FEI sets new standards

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

Global semiconductor sales increase 1.5 percent in third quarter

11/03/2015  SIA announced worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5 percent compared to the previous quarter.

DCG Systems addresses localization of electrical shorts with EBIRCH technology

11/03/2015  DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

China's Tsinghua Unigroup invests in Taiwan's Powertech

11/03/2015  Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

X-FAB announces investments to further expand X-FAB Sarawak capacity

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

Practical Limits for Metallization Scaling in Fabs

11/02/2015  On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

11/02/2015  Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

Ziptronix and Fraunhofer collaborate on low-cost 3D integration solutions

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

Soraa announces LED manufacturing expansion in Syracuse, NY

10/30/2015  Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.

Reports: TI, STMicro to add to semiconductor acquisitions spree

10/30/2015  Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

InvenSense announces UltraPrint mass-manufacturable ultrasound fingerprint touch sensor solution

10/28/2015  InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

mCube unveils the world's smallest 1x1mm accelerometer

10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016