Manufacturing

MANUFACTURING ARTICLES



mCube named MEMS Start-Up of the Year at MEMS Executive Congress

11/13/2014  mCube, provider of the world’s smallest MEMS motion sensors, today announced the company secured three awards at last week’s MEMS Executive Congress for its significant innovations in MEMS and sensors

Cavendish Kinetics secures funding to accelerate the growth of the RF MEMS market

11/11/2014  Cavendish Kinetics, the provider of high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced the closing of a $7 million funding round as well as the appointment of Gilles Delfassy to its board of directors.

MEMS Industry Group announces first open-source Algorithm Community

11/06/2014  MEMS Executive Congress -- Karen Lightman, executive director of MEMS Industry Group (MIG), today announced the first open-source algorithm cooperative, Accelerated Innovation Community (AIC), during her opening remarks at MEMS Executive Congress US 2014.

'Nanomotor lithography' answers call for affordable, simpler device manufacturing

11/04/2014  Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.

Apple and Samsung drive adoption of next-generation sensors

11/03/2014  Propelled by the race between Apple and Samsung to enhance their mobile products with cutting-edge sensor technology, the market for sensors in cellphones and tablets is set to nearly triple from 2012 through 2018, according to IHS Technology.

Experts at the Table: Focus on Semiconductor Materials

11/03/2014  The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde Electronics; Kate Wilson of Edwards Vacuum; David Thompson of Applied Materials; and Ed Shober of Air Products and Chemicals.

Air-gaps in Copper Interconnects for Logic

10/31/2014  Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.

STMicroelectronics tops five billion MEMS sensors shipped

10/23/2014  Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

Finalists announced for MEMS Executive Congress US 2014

10/23/2014  Six companies selected from a pool of applicants will compete in MEMS Industry Group's (MIG)'s MEMS & Sensors Technology Showcase at MEMS Executive Congress.

Mergers, acquisitions reshape the automotive semi supplier landscape

10/22/2014  Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

10/20/2014  MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Wearable sensor market to expand sevenfold in five years

10/16/2014  Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

SPIE Photomask Technology Wrap-up

09/23/2014  Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

SPIE panel tackles mask complexity issues

09/19/2014  Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?

Rudolph introduces new acoustic metrology and defect inspection technology

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

09/18/2014  Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

ASML on EUV: Available at 10nm

09/17/2014  Extreme-ultraviolet lithography systems will be available to pattern critical layers of semiconductors at the 10-nanometer process node, and EUV will completely take over from 193nm immersion lithography equipment at 7nm, according to Martin van den Brink, president and chief technology officer of ASML Holding.

Design and Manufacturing Technology Development in Future IC Foundries

09/16/2014  Virtual Roundtable provides perspective on the need for greater integration within the “fabless-foundry” ecosystem.

Monolithic 3D breakthrough at IEEE S3S 2014

09/15/2014  In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) could be built using the existing fab and the existing transistor flow.




FINANCIALS



TECHNOLOGY PAPERS



High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015