X-FAB announces investments to further expand X-FAB Sarawak capacity

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

Practical Limits for Metallization Scaling in Fabs

11/02/2015  On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

11/02/2015  Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

Ziptronix and Fraunhofer collaborate on low-cost 3D integration solutions

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

Soraa announces LED manufacturing expansion in Syracuse, NY

10/30/2015  Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.

Reports: TI, STMicro to add to semiconductor acquisitions spree

10/30/2015  Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

InvenSense announces UltraPrint mass-manufacturable ultrasound fingerprint touch sensor solution

10/28/2015  InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

mCube unveils the world's smallest 1x1mm accelerometer

10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

IDT to Acquire ZMDI for $310 Million

10/27/2015  Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.

Brewer Science and Arkema announce partnership to bring high-performance material to semiconductor market

10/27/2015  Brewer Science, Inc., and Arkema announced a partnership to produce high-quality directed self-assembly (DSA) materials for use in semiconductor manufacturing.

Manipulating wrinkles could lead to graphene semiconductors

10/26/2015  RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

North American semiconductor equipment industry posts September 2015 book-to-bill ratio of 1.07

10/23/2015  North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2015 (three-month average basis) and a book-to-bill ratio of 1.07.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Lam Research to acquire KLA-Tencor

10/21/2015  Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

Western Digital announces acquisition of SanDisk

10/21/2015  Western Digital Corporation and SanDisk Corporation today announced that they have entered into a definitive agreement where Western Digital will purchase SanDisk.

Stanford engineers create artificial skin that can send pressure sensation to brain cell

10/20/2015  Stanford engineers have created a plastic "skin" that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Sitri launches in Silicon Valley to accelerate innovation in “More than Moore” and IoT technologies

10/20/2015  SITRI announced the opening of SITRI Innovations in Belmont, California during a recent event attended by many of Silicon Valley's leading investors, technologists, entrepreneurs, and incubators.

Historic era of consolidation for chip makers

10/19/2015  We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

10/19/2015  Mentor Graphics Corp. today announced the Veloce® VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today.

Evonik and SCREEN FT enter strategic partnership to promote iXsenic technology

10/19/2015  German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015