Manufacturing

MANUFACTURING ARTICLES



Number of connected IoT devices will surge to 125 billion by 2030

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

Piezoelectrics stretch their potential with a method for flexible sticking

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

Toshiba Memory Corp to invest in production equipment for Fab 6 at Yokkaichi operations

10/11/2017  TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

TowerJazz and Crocus expand presence in magnetic sensors market

09/27/2017  Crocus TMR sensors offer important advantages for multiple applications in IoT, consumer, automotive, industrial and medical sectors.

Wearable sensors reach their first billion-dollar year, with growth coming in three waves

09/27/2017  IDTechEx predict that 2017 will be the first billion dollar year for wearable sensors.

Understanding the impact of valve flow coefficient (Cv) in fluid systems

09/26/2017  Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

Fab equipment spending breaking industry records

09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

UPMEM announces the first processing in-memory chip accelerating Big Data applications

09/08/2017  UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks.

STMicroelectronics boosts its ecosystem with partner program that connects customers with qualified third parties

08/31/2017  STMicroelectronics has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

08/29/2017  Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

Automotive sensing: A mature yet highly dynamic market

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

High-speed switching for ultrafast electromechanical switches and sensors

08/29/2017  Unlike the slow ferroelastic domain switching expected for ceramics, high-speed sub-microsecond ferroelastic domain switching and simultaneous lattice deformation are directly observed for the Pb(Zr0.4Ti0.6)O3 thin films. This exciting finding paves the way for high-frequency ultrafast electromechanical switches and sensors.

SiFive and Rambus to provide IP to the 'DesignShare' economy

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

Intel completes tender offer for Mobileye

08/08/2017  The combination of Intel and Mobileye will allow Mobileye's computer vision expertise (the "eyes") to complement Intel's high-performance computing and connectivity expertise (the "brains") to create automated driving solutions from cloud to car.

NUS engineers achieve significant breakthrough in spin wave-based information processing technology

07/24/2017  Novel method of propagating spin waves could pave the way for high-speed, miniaturized data processing devices.

Digital revolution: The path to innovation is opened by disruption

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS