Manufacturing

MANUFACTURING ARTICLES



Lab4MEMS project recognized with European Innovation Award

11/28/2016  Project developed pilot line for next-generation MEMS devices.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

SMIC and IMECAS sign an agreement for MEMS R&D and foundry platform

11/15/2016  Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

Fan-in wafer-level packaging market to grow due to high demand for miniaturized electronics

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

MicroVision and STMicroelectronics to co-market MEMS mirror-based laser beam scanning solutions

11/10/2016  MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.

Analog Devices makes MEMS switch technology a commercial reality

11/08/2016  Analog Devices, Inc. (ADI) today introduced a breakthrough in switch technology that provides a long-sought replacement for electromechanical relay designs first adopted by the electronics industry more than 100 years ago.

Automotive systems forecast to show strongest growth through 2020

11/03/2016  Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.

WORLD OF IOT grows with 30 new exhibitors at SEMICON Japan

11/03/2016  Today, SEMI announced that WORLD OF IOT, a show-within-a-show at SEMICON Japan 2016, will expand with the addition of 30 new exhibitors.

The gas sensor market is about to change

11/02/2016  Nowadays, the number of enforceable patents dedicated to miniaturized gas sensors is increasing worldwide, and several companies already stand out by their strong IP position.

A tiny machine

10/31/2016  UCSB electrical and computer engineers design an infinitesimal computing device.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

When it comes to atomic-scale manufacturing, less really is more

10/28/2016  Electrical currents can be now be switched on and off at the smallest conceivable scale enabling a new generation of 'green electronics' with the potential for great impact on the digital economy.

Next-generation smartphone battery inspired by the gut

10/26/2016  Researchers have developed a prototype of a next-generation lithium-sulphur battery which takes its inspiration in part from the cells lining the human intestine. The batteries, if commercially developed, would have five times the energy density of the lithium-ion batteries used in smartphones and other electronics.

Revenue growth sounding strong for suppliers of packaged MEMS microphones

10/21/2016  Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

10/11/2016  MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

First demonstration of brain-inspired device to power artificial systems

10/07/2016  New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.

New sensor material could enable more sensitive readings of biological signals

10/07/2016  Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

imec and Holst Centre present the world's most energy-efficient biomedical sensor hub

10/04/2016  imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.

Silicon Labs acquires leading RTOS company Micrium

10/03/2016  Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS