08/24/2016 Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.
08/12/2016 A major research institution has placed orders for two Advanced Vacuum plasma processing systems that will provide etch and deposition capabilities to be used in nanoelectronics research and development.
08/08/2016 MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.
08/05/2016 ON Semiconductor (Nasdaq: ON) this week announced that it is joining the Original Equipment Suppliers Association.
08/04/2016 Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.
08/03/2016 Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).
08/02/2016 ams AG has launched the smallest ever optical sensor module that delivers a combination of colour (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.
08/02/2016 Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.
08/01/2016 STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.
07/29/2016 STMicroelectronics today announced that it has acquired ams' assets related to NFC1 and RFID2 reader business
07/28/2016 Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.
07/28/2016 Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.
07/22/2016 Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.
07/21/2016 Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.
07/20/2016 Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.
07/19/2016 Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.
07/13/2016 Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.
07/12/2016 The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.
07/06/2016 EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices
06/29/2016 A new roadmap, the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), aims to integrate fast optical communication made possible with photonic devices.
December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,