Manufacturing

MANUFACTURING ARTICLES



New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

10/11/2016  MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

First demonstration of brain-inspired device to power artificial systems

10/07/2016  New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.

New sensor material could enable more sensitive readings of biological signals

10/07/2016  Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

imec and Holst Centre present the world's most energy-efficient biomedical sensor hub

10/04/2016  imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.

Silicon Labs acquires leading RTOS company Micrium

10/03/2016  Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).

SiTime introduces high-precision MEMS oscillators

09/27/2016  SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

Process Watch: Salami slicing your yield

09/26/2016  The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference

09/26/2016  MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.

EV Group extends volume manufacturing expertise to biotech and medical applications

09/26/2016  EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

Synopsys and TSMC collaborate to certify Custom Compiler for 16FFC process

09/22/2016  Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

09/21/2016  EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

High-volume processes for next-generation biotechnology devices

09/12/2016  Over the past several decades, miniaturization has significantly improved clinical diagnostics, pharmaceutical research and analytical chemistry. Modern biotechnology devices— such as biosensors, fully integrated systems for diagnostics, cell-analysis or drug discovery—are often chip-based and rely on close interaction of biological substances at the micro- and nanoscale. Thus, process technologies that enable the production of surface patterns and integration of fluidic components with small feature sizes are needed.

IC Insights updates semiconductor outlook for Internet of Things

09/07/2016  Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.

SEMI European MEMS Summit brings industry leaders to Stuttgart

09/06/2016  Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.

Thinner wafers are fostering the growth and emergence of new dicing technologies

09/06/2016  Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS