Manufacturing

MANUFACTURING ARTICLES



imec, Coventor expand project on 7nm semiconductor manufacturing process

12/07/2015  Kicking off IEDM, imec and Coventor are expanding their existing joint development project to explore process variation issues in 7nm chip technology.

Measuring nanoscale features with fractions of light

12/04/2015  National Institute of Standards and Technology (NIST) researchers are seeing the light, but in an altogether different way. And how they are doing it just might be the semiconductor industry's ticket for extending its use of optical microscopes to measure computer chip features that are approaching 10 nanometers, tiny fractions of the wavelength of light.

SITRI and Bosch announce IoT technology collaboration

12/02/2015  The agreement covers IoT applications such as smart home, wearable devices, smart city, Industry 4.0 and robotics.

Measuring 5nm Particles In-Line

11/30/2015  ITRI and TSMC co-develop aerosol method to monitor liquids and slurries.

Tallness Makes Reliable Spindt Tip Cold Cathodes

11/30/2015  Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers

Trillium announces acquisition of Oxford Instruments - Austin Division

11/24/2015  Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.

InvenSense CEO touts the Internet of Sensors

11/23/2015  InvenSense president and chief executive officer Behrooz Abdi sees the Internet of Things as an Internet of Sensors, a theme he explored Tuesday afternoon (November 17) at the opening of the fourth annual InvenSense Developers Conference.

The inertial MEMS device market keeps on growing. What's next?

11/23/2015  Gyroscope and accelerometer production volumes are also growing, with the following CAGR: 7.9% and 1.6% respectively over the same period. Every sector will keep growing. So, what’s next?

InvenSense Developers Conference Tackles Sensor Security, New Technologies

11/23/2015  The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

Europe’s secondary industry in the spotlight

11/17/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

What lies beneath? 50 years of enabling Moore’s Law

11/17/2015  Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

Wafer bonding for high performance MEMS, power devices, and RF components

11/17/2015  Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

Wally Rhines of Mentor Graphics Gets Phil Kaufman Award

11/16/2015  The Phil Kaufman Award is presented by the Electronic Design Automation Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA). It honors the memory of Philip A. Kaufman, the EDA industry pioneer, electronics engineer, and entrepreneur, who died in 1992.

Bosch Sensortec CEO recognized with Lifetime Achievement Award

11/13/2015  Bosch Sensortec announced that its CEO, Dr. Stefan Finkbeiner, has been chosen by the MEMS & Sensors Industry Group to receive its prestigious MEMS/Sensors Lifetime Achievement Award.

Security by design

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

GLOBALFOUNDRIES launches high-performance ASIC offering on 14nm FinFET process technology

11/11/2015  GLOBALFOUNDRIES today announced the availability of FX-14, an ASIC offering built on the company's next-generation 14nm FinFET process technology.

Gartner: 6.4B connected "Things" in use in 2016

11/11/2015  Gartner, Inc. forecasts that 6.4 billion connected things will be in use worldwide in 2016, up 30 percent from 2015, and will reach 20.8 billion by 2020.

Analog market to reach $56.5B in 2020

11/11/2015  The world electronics market will consume over 121 billion analog ICs in 2015 and grow to over $56 billion by 2020.

Shipments of residential Internet of Things devices expected to total over $330 billion through 2025

11/10/2015  A recent report from Navigant Research suggests the global market for residential IoT devices will grow strongly through 2025.




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WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

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