Manufacturing

MANUFACTURING ARTICLES



Manipulating wrinkles could lead to graphene semiconductors

10/26/2015  RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

North American semiconductor equipment industry posts September 2015 book-to-bill ratio of 1.07

10/23/2015  North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2015 (three-month average basis) and a book-to-bill ratio of 1.07.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Lam Research to acquire KLA-Tencor

10/21/2015  Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

Western Digital announces acquisition of SanDisk

10/21/2015  Western Digital Corporation and SanDisk Corporation today announced that they have entered into a definitive agreement where Western Digital will purchase SanDisk.

Stanford engineers create artificial skin that can send pressure sensation to brain cell

10/20/2015  Stanford engineers have created a plastic "skin" that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Sitri launches in Silicon Valley to accelerate innovation in “More than Moore” and IoT technologies

10/20/2015  SITRI announced the opening of SITRI Innovations in Belmont, California during a recent event attended by many of Silicon Valley's leading investors, technologists, entrepreneurs, and incubators.

Historic era of consolidation for chip makers

10/19/2015  We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

10/19/2015  Mentor Graphics Corp. today announced the Veloce® VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today.

Evonik and SCREEN FT enter strategic partnership to promote iXsenic technology

10/19/2015  German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership.

Next-generation perovskite solar cells made stable by metal oxide "sandwich"

10/19/2015  New solar cell construction extends the cell's effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

Applied Materials and A*STAR announce new R&D joint lab in Singapore for advanced semiconductor technology

10/19/2015  Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

Silver: The promising electrode winner for low-cost perovskite solar cells

10/16/2015  A study published in Advanced Materials Interfaces by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST) reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

Automotive MEMS sensors market to grow 6% from 2015-2020, P&S Market Research

10/15/2015  The global automotive MEMS sensor market was valued at $2,600.5 million in 2014, and it is expected to grow at a CAGR of 6.0%, during the period 2015-2020.

VeriSilicon to acquire Vivante Corporation

10/13/2015  VeriSilicon Holdings Co., Ltd. and Vivante Corporation announced a definitive merger agreement.

Japan well positioned to support IoT and the industry

10/13/2015  Japan has long played a critical role in semiconductor manufacturing and accounts for the largest portion of the global total installed fab capacity in 2015 according to the SEMI Fab database.

Infineon CEO Says Robot Cars Will Drive Semiconductor Demand

10/12/2015  Infineon’s CEO, Reinhard Ploss, says that the autonomously driven cars of the future will create a large demand for a variety of new semiconductors and sensors.

SEMI announces FlexTech Alliance as first Strategic Association Partner

10/07/2015  SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.

Mentor Graphics Tackles SoC Design Challenges

10/06/2015  System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.

Applied Materials Prospers in CMP, Deposition, Etch

10/06/2015  The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.




TWITTER


WEBCASTS



Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS