Manufacturing

MANUFACTURING ARTICLES



China's Tsinghua Unigroup invests in Taiwan's Powertech

11/03/2015  Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

X-FAB announces investments to further expand X-FAB Sarawak capacity

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

Practical Limits for Metallization Scaling in Fabs

11/02/2015  On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

11/02/2015  Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

Ziptronix and Fraunhofer collaborate on low-cost 3D integration solutions

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

Soraa announces LED manufacturing expansion in Syracuse, NY

10/30/2015  Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.

Reports: TI, STMicro to add to semiconductor acquisitions spree

10/30/2015  Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

InvenSense announces UltraPrint mass-manufacturable ultrasound fingerprint touch sensor solution

10/28/2015  InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

mCube unveils the world's smallest 1x1mm accelerometer

10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

IDT to Acquire ZMDI for $310 Million

10/27/2015  Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.

Brewer Science and Arkema announce partnership to bring high-performance material to semiconductor market

10/27/2015  Brewer Science, Inc., and Arkema announced a partnership to produce high-quality directed self-assembly (DSA) materials for use in semiconductor manufacturing.

Manipulating wrinkles could lead to graphene semiconductors

10/26/2015  RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

North American semiconductor equipment industry posts September 2015 book-to-bill ratio of 1.07

10/23/2015  North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2015 (three-month average basis) and a book-to-bill ratio of 1.07.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Lam Research to acquire KLA-Tencor

10/21/2015  Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

Western Digital announces acquisition of SanDisk

10/21/2015  Western Digital Corporation and SanDisk Corporation today announced that they have entered into a definitive agreement where Western Digital will purchase SanDisk.

Stanford engineers create artificial skin that can send pressure sensation to brain cell

10/20/2015  Stanford engineers have created a plastic "skin" that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Sitri launches in Silicon Valley to accelerate innovation in “More than Moore” and IoT technologies

10/20/2015  SITRI announced the opening of SITRI Innovations in Belmont, California during a recent event attended by many of Silicon Valley's leading investors, technologists, entrepreneurs, and incubators.

Historic era of consolidation for chip makers

10/19/2015  We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

10/19/2015  Mentor Graphics Corp. today announced the Veloce® VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today.




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Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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