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MATERIALS AND EQUIPMENT ARTICLES



Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor assembly and packaging services: Rising number of fabs is driving the market

04/23/2018  Technavio market research analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of close to 5% during the period 2018-2022, according to their latest report.

SEMI and TechSearch International report global semiconductor packaging materials market reaches $16.7B

04/18/2018  SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017.

Amkor factories receive key automotive certification

04/16/2018  Amkor Technology, Inc. today announced that multiple factories have passed certification audits for IATF 16949:2016, a key certification required for manufacturers who supply products to the automotive market

China now world's largest consumer of semiconductor packaging equipment and materials

04/02/2018  Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world's largest consumer of packaging equipment and materials.

A treasure trove for nanotechnology experts

03/06/2018  A team from EPFL and NCCR Marvel has identified more than 1,000 materials with a particularly interesting 2D structure. Their research paves the way for groundbreaking technological applications.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

SEMI showcases achievements in flexible hybrid electronics, MEMS and sensors at 2018FLEX and MSTC conferences

02/22/2018  Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems

02/15/2018  Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

Boston Semi Equipment develops custom automation modules for strip handling equipment

01/31/2018  Boston Semi Equipment (BSE) today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer.

Alpha and Omega Semiconductor announces the newest generation of XSPairFET

01/30/2018  Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

GLOBALFOUNDRIES delivering 45nm RF SOI customer prototypes for 5G applications

01/26/2018  Company's advanced 300mm RF SOI offering is ready for volume production.

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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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