Materials and Equipment



Mentor Graphics announces collaboration with GLOBALFOUNDRIES

11/25/2015  Mentor Graphics Corp. announced it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform, including the RealTime Designer physical RTL synthesis solution and Olympus-SoC place & route system, for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

Intel and ASM look to TCB

11/17/2015  Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

What lies beneath? 50 years of enabling Moore’s Law

11/17/2015  Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

Cut costs: Improve competitive advantage

11/13/2015  Systematic – and predictive – cost reduction in semiconductor equipment manufacturing

Shipments of residential Internet of Things devices expected to total over $330 billion through 2025

11/10/2015  A recent report from Navigant Research suggests the global market for residential IoT devices will grow strongly through 2025.

Advance could bring commercial applications for silver nanowires

11/10/2015  New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

FEI announces agreement to acquire DCG Systems

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

New Helios G4 Series DualBeam from FEI sets new standards

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

X-FAB announces investments to further expand X-FAB Sarawak capacity

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

Soraa announces LED manufacturing expansion in Syracuse, NY

10/30/2015  Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.





Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015