Materials and Equipment

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MATERIALS AND EQUIPMENT ARTICLES



Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems

02/15/2018  Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

Boston Semi Equipment develops custom automation modules for strip handling equipment

01/31/2018  Boston Semi Equipment (BSE) today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer.

Alpha and Omega Semiconductor announces the newest generation of XSPairFET

01/30/2018  Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

GLOBALFOUNDRIES delivering 45nm RF SOI customer prototypes for 5G applications

01/26/2018  Company's advanced 300mm RF SOI offering is ready for volume production.

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

Value of semiconductor industry M&A deals slows dramatically in 2017

01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

Korea is at full throttle on memory investments

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

ASML announces appointment of new CFO to the Board of Management

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Odyssey Technical Solutions named exclusive distributor for Comet Capacitors in the Americas

01/08/2018  Odyssey Technical Solutions today announced that they have reached agreement with COMET PCT (Plasma Control Technologies) division, located in San Jose, CA. with headquarters in Switzerland, to stock and exclusively distribute the COMET vacuum capacitor line of components for North, Central and South America.

Nordson Corporation acquires Sonoscan

01/04/2018  Nordson Corporation has acquired Sonoscan, Inc., an Elk Grove Village, Illinois-based designer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems used in a variety of microelectronic, automotive, aerospace and industrial electronics assembly applications.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

SEMI European 3D Summit makes Dresden debut

12/22/2017  The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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