05/24/2016 Tessera Technologies, Inc. announced today that it and certain of its subsidiaries filed legal proceedings for patent infringement in both domestic and international jurisdictions against Broadcom.
05/20/2016 Synopsys, Inc. today announced that the company's Custom Compiler tool has been enabled by Samsung for 14 nanometer (nm) LPP and LPC FinFET production.
05/12/2016 Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.
04/25/2016 SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.
04/25/2016 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that, Geoff Ribar, senior vice president and chief financial officer, who joined the company in 2010, has decided to retire from Cadence effective March 31, 2017.
04/14/2016 To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.
04/13/2016 Imec, the nanoelectronics research center, today announced that its annual Imec Technology Forum (ITF) in Brussels will take place May 24-25, 2016 in Brussels, Belgium at SQUARE, Brussels Meeting Centre
04/08/2016 Molex, a global manufacturer of electronic solutions, announced today the acquisition of Interconnect Systems, Inc. ("ISI") which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.
04/08/2016 The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.
03/31/2016 Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that it has executed a definitive agreement with two strategic investment funds owned by the Municipality of Chongqing, China.
02/23/2016 Recent capital spending trends indicative of maturing semiconductor industry.
02/17/2016 University of Colorado Boulder researchers have demonstrated the use of the world's first ultrafast optical microscope, allowing them to probe and visualize matter at the atomic level with mind-bending speed.
02/12/2016 At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.
May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments
Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.
June 21, 2016 at 1 PM ET / Sponsored by Air Products
June 2016 (Date and time TBD)/Sponsored by Air Products
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016Sponsored by Diamond-MT
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.