02/21/2014 Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, and Jiangsu Changjiang Electronics Technology Co., Ltd., the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing.
02/11/2014 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.
02/06/2014 SEMI’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.
01/30/2014 Novoset, LLC and Lonza are pleased to announce the introduction of Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.
01/23/2014 At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.
01/15/2014 The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.
11/25/2013 Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.
11/18/2013 STMicroelectronics and Yogitech, a provider of functional safety solutions, have signed an agreement to create a comprehensive package that will simplify the development and certification of safety-critical applications based on STM32 microcontrollers.
11/12/2013 FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) - (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.
11/07/2013 Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.
11/01/2013 SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.