Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Boston Semi Equipment expands sales and service organization

07/08/2014  Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel.

With "ribbons" of graphene, width matters

07/03/2014  Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

Entegris opens new facility in Bedford, MA

06/19/2014  Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

UC Riverside to lead new energy frontier research center project

06/18/2014  SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

SEMI releases first quarter 2014 worldwide PV equipment market report

06/18/2014  Bookings recover for second consecutive quarter; above parity for first time since 2011

TowerJazz and Genoray develop CMOS image sensor for medical diagnostic equipment

06/06/2014  TowerJazz, a global specialty foundry, and Genoray Co. Ltd., a manufacturer of digital X-ray devices, today announced collaboration on the successful development of a CMOS image sensor (CIS) for medical diagnostic devices such as X-ray equipment, fluoroscopy and radiography.

IEEE Packaging Awards handed out at 2014 ECTC

06/05/2014  The 2014 Electronic Component Technology Conference (ECTC) took place last week in Orlando Florida.

SABIC collaborates with Cima NanoTech on breakthrough display technology

06/05/2014  As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

Amkor and Carsem announce patent infringement settlement

05/28/2014  Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor's MicroLeadFrame (MLF) patents.

Ziptronix and EV Group demonstrate submicron accuracies for wafer-to-wafer hybrid bonding

05/27/2014  ­ Ziptronix Inc. and EV Group today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers.

KLA-Tencor announces new Teron SL650 reticle inspection system

05/23/2014  Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

Mentor Graphics acquires Nimbic

05/20/2014  Mentor Graphics Corp. today announced that it has acquired Nimbic, Inc., a provider of Maxwell-accurate, 3D full-wave electromagnetic (EM) simulation solutions.

Slideshow: What to look for at IITC 2014

05/20/2014  The 17th annual IITC will be held May 21 – 23, 2014 in conjunction with the 31st AMC at the Doubletree Hotel in San Jose, California.

BASF opens facility in Oregon

05/08/2014  BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.

SRC and UC Berkeley pursue more cost-effective approach to 3D chip integration

05/07/2014  University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC) are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.

Zeta Instruments hires former KLA-Tencor exec as new COO

04/30/2014  Zeta Instruments, Inc., an optical profiling and inspection company providing solutions for high-tech manufacturing, has announced that Jeff Donnelly has joined the company as its chief operating officer.

Graphene not all good

04/29/2014  In a first-of-its-kind study of how a material some think could transform the electronics industry moves in water, researchers at the University of California, Riverside Bourns College of Engineering found graphene oxide nanoparticles are very mobile in lakes or streams and therefore likely to cause negative environmental impacts if released.

STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

04/22/2014  Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas' Bond Via Array (BVATM) technology for next generation smartphone and tablet customers.

Altera and TSMC collaborate to bring advanced packaging technology to Arria 10 FPGAs and SoCs

04/21/2014  Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

In the permanent bonding market, EV Group is leading, Applied Materials and Tokyo Electron are merging

04/18/2014  Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, advanced packaging, LED devices, and SOI substrate applications.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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