Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Opportunities in packaging are driving photolithography equipment demand

07/27/2015  Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

“Above and beyond TSV for advanced ICs” - SEMI European 3D Summit 2016

07/22/2015  SEMI today announced the fourth annual European 3D Summit. Entitled “European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

Amkor Technology announces expansion of China operations

07/21/2015  Amkor Technology, Inc. today announced plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.

Inspection smooths a bumpy road

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

Fan-out wafer level packaging set to expand

07/14/2015  The expansion of fan-out is finally coming, says Rich Rogoff, Vice President and General Manager, Lithography Systems Group at Rudolph Technologies.

Buying used equipment? Be careful; know your seller

07/14/2015  The used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.

IRT Nanoelec partners achieve 3D chip-stacking technology & 3D network-on-chip framework

07/09/2015  IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

Diverse packaging and test issues up for debate at SEMICON West 2015

05/29/2015  SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

NXP and Stora Enso to develop intelligent packaging solutions

05/29/2015  NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions.

Advantest develops semiconductor circuit analysis terahertz technology

05/21/2015  Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

SRC names former Freescale CTO Ken Hansen as new president and CEO

05/14/2015  Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

Microchip Technology to acquire Micrel

05/07/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has signed a definitive agreement to acquire Micrel.

ITRS 2.0: Heterogeneous integration

05/06/2015  Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

SEMI seminar focuses on European packaging, assembly and test

04/14/2015  On June 18, the SEMI Packaging Tech Seminar will take place in Vila do Conde, Portugal.

Consider packaging requirements at the beginning, not the end, of the design cycle

04/02/2015  Consider these eight issues where the packaging team should be closely involved with the circuit design team.

Pibond introduces a new product line for logic, memory, power and MEMS devices

04/01/2015  Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Mentor Graphics launches Xpedition Package Integrator flow for IC-package-board design

03/27/2015  Mentor Graphics Corporation announced its new Xpedition Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization.

Entrepix adds 300mm CMP capabilities to Phoenix foundry

03/17/2015  Entrepix, Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced that it has expanded its foundry operations in Phoenix, Arizona by installing 300mm chemical mechanical planarization (CMP) processing.




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TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
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VIDEOS



EVENTS



SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015