Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

03/04/2015  Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Mentor Graphics acquires Tanner EDA

03/03/2015  Mentor Graphics Corp. today announced it has acquired the business assets of Tanner EDA, a tool provider for the design, layout and verification of analog/mixed-signal (AMS) and MEMS integrated circuits.

AG Semiconductor Services and JA Mitsui Leasing join forces

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

Amkor Technology names Susan Kim to Board of Directors

02/11/2015  Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors.

The CMOS image sensors industry is about to change, with major investment in manufacturing & design

02/03/2015  Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020.

Amkor Technology announces settlement with Tessera

01/15/2015  Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

Leti will discuss CoolCube technology for 3D transistor stacking at workshop preceding IEDM 2014

12/11/2014  CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif.

What to expect from the 3rd Edition of the European 3D TSV Summit

12/04/2014  Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

Wireless nanorod-nanotube film enables light stimulation of blind retina

12/03/2014  Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

TI to open 300mm wafer bumping facility in Chengdu, China

11/06/2014  Chengdu assembly/test facility now in production; site celebrates grand opening

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

11/05/2014  SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

Kandou introduces in-package chip interconnect enabling lower cost semiconductor solutions

11/04/2014  Kandou Bus has announced the Glasswing family of chip interconnects targeted for in-package chip-to-chip links.

Rice chemists gain edge in next-generation energy

11/04/2014  Rice University scientists who want to gain an edge in energy production and storage report they have found it in molybdenum disulfide.

Imec presents back-side illuminated CMOS image sensor with UV-optimized antireflective coating

11/04/2014  At this week’s VISION 2014 exhibition, imec presents a backside-illuminated (BSI) CMOS image sensor chip featuring a new anti-reflective coating (ARC) optimized for UV light.

MegaChips to acquire SiTime for $200M

10/29/2014  SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

Element Six introduces new thermal grade of CVD diamond

10/15/2014  Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

10/15/2014  IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

Texas Instruments announces 22B copper wire bond technology units shipped

10/14/2014  Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

Threshold voltage tuning for 10nm and beyond CMOS integration

10/13/2014  A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

10/02/2014  ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON China 2015
Shanghai
http://www.semiconchina.org
March 17, 2015 - March 19, 2015
LED Taiwan 2015
Taipei, Taiwan
http://www.ledtaiwan.org/en/
March 25, 2015 - March 28, 2015
SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015