Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Rudolph introduces new acoustic metrology and defect inspection technology

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

09/18/2014  Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

09/09/2014  Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

09/09/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

Intel releases new packaging, test technologies for 14nm foundries

08/27/2014  Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

Global pressure sensors market is expected to reach $9.36B in 2020

08/14/2014  The global pressure sensors market was valued at $6.53 billion USD in 2013, growing at a CAGR of 6.2% from 2014 to 2020 to account for $9.36 billion USD in 2020.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

08/12/2014  University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

National Science Foundation tests out the assembly line of the future

08/05/2014  NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

New material allows for ultra-thin solar cells

08/04/2014  Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Materials matter — Enabling the future of IC fabrication and packaging

07/31/2014  The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Boston Semi Equipment expands sales and service organization

07/08/2014  Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel.

With "ribbons" of graphene, width matters

07/03/2014  Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

Entegris opens new facility in Bedford, MA

06/19/2014  Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

UC Riverside to lead new energy frontier research center project

06/18/2014  SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

SEMI releases first quarter 2014 worldwide PV equipment market report

06/18/2014  Bookings recover for second consecutive quarter; above parity for first time since 2011

TowerJazz and Genoray develop CMOS image sensor for medical diagnostic equipment

06/06/2014  TowerJazz, a global specialty foundry, and Genoray Co. Ltd., a manufacturer of digital X-ray devices, today announced collaboration on the successful development of a CMOS image sensor (CIS) for medical diagnostic devices such as X-ray equipment, fluoroscopy and radiography.

IEEE Packaging Awards handed out at 2014 ECTC

06/05/2014  The 2014 Electronic Component Technology Conference (ECTC) took place last week in Orlando Florida.

SABIC collaborates with Cima NanoTech on breakthrough display technology

06/05/2014  As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

Amkor and Carsem announce patent infringement settlement

05/28/2014  Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor's MicroLeadFrame (MLF) patents.

Ziptronix and EV Group demonstrate submicron accuracies for wafer-to-wafer hybrid bonding

05/27/2014  ­ Ziptronix Inc. and EV Group today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers.




HEADLINES

Medical Electronics Market Growing at 5.5% CAGR to 2020 Says a New Research Report Available at ReportsnReports.com; ReportsnReports.com adds "Medical Electronics Market by Component (Sensor, Battery, Memory Device, Display, & Microprocessor/MCU), by Application (Imaging, Medical Therapeutics, Diagnosis, Monitoring, and Fitness & Wellness), and by Geography - Global Forecast to 2020" global research report to its store.
September 20, 2014

Medical Electronics Market Growing at 5.5% CAGR to 2020 Says a New Research Report Available at ReportsnReports.com; ReportsnReports.com adds "Medical Electronics Market by Component (Sensor, Battery, Memory Device, Display, & Microprocessor/MCU), by Application (Imaging, Medical Therapeutics, Diagnosis, Monitoring, and Fitness & Wellness), and by Geography - Global Forecast to 2020" global research report to its store.
September 20, 2014

Mentor Graphics Introduces Embedded Hypervisor Product
September 20, 2014

ET deals: ActionFit sweat-resistant headphones for $40, 23-inch touch IPS monitor for $150, more
September 19, 2014

With iPhone 6 Debut, iPhone Unlockers Rake in Big Business; iPhones being unlocked in record numbers amid iPhone 6 consumer frenzy as consumers trade in older iPhones
September 19, 2014

Wireless Internet Enabled Devices to Drive Demand for Electronic Contract Manufacturing Services, According to New Report by Global Industry Analysts, Inc.
September 19, 2014

NFL Commissioner Roger Goodell Apologizes for the Past, Promises to Do Better in Future; Nearly $3.5 Billion Spent Last Year in Advertising; Latest on the Alibaba IPO; 10 Percent of Americans Showed up to Work Stoned
September 19, 2014

Total Parts Costa Rica Hosts Product Seminars Presented By Uniweld's Richard Apodaca, Director – International.
September 19, 2014

New York: 3rd Annual Eugene H. Fram Chair in Applied Critical Thinking Lecture
September 19, 2014

United States : NEC displays form backdrop for wilmington-based children hospital's new interactive video wall
September 19, 2014

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014
SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014