Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Global FEOL semiconductor equipment market to boom after the high demand for semiconductor chips

08/29/2016  According to the latest market study released by Technavio, the global front-end-of-the-line semiconductor equipment market recorded a revenue of over $22 billion in 2015 and this growth is expected to exceed $24 billion in 2020.

Edwards Vacuum receives Lam Research 2016 Supplier Excellence Award

08/26/2016  Edwards Vacuum has been recognized as one of ten companies receiving a 2016 Supplier Excellence Award from Lam Research Corp.

S. Korean University employs Advanced Vacuum plasma systems in nanotechnology research

08/24/2016  A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Advanced packaging: Hot topic at SEMICON Taiwan 2016

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

Reno Sub-Systems secures first EVC matching network design win and large production order

08/16/2016  Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

Busch to open a new service center in Austin, Texas

07/28/2016  Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.

Applied Materials appoints Judy Bruner to Board of Directors

07/25/2016  Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

Worldwide semiconductor capital spending to decline 0.7% in 2016, Gartner reports

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

The danger that lurks below

07/19/2016  The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance.

Global Neon Demand Expected to Exceed Increasing Supply

07/13/2016  Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

200mm fabs reawakening

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

Test Protocols for the IoT

07/12/2016  The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

Rudolph Technologies announces new Clearfind technology for advanced packaging inspection

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

Applied Materials' next-generation e-beam inspection system provides industry's highest resolution

07/11/2016  Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

IC Insights lowers 2016 semiconductor market forecast to -1%

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.

EV Group expands high-vacuum wafer bonding capabilities of EVG ComBond platform

07/06/2016  EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices

Tiniest imperfections make big impacts in nano-patterned materials

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

More Technology Papers

EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS