Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Nano 'sandwich' offers unique properties

02/27/2017  Rice University researchers simulate two-dimensional hybrids for optoelectronics.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

New window into the nanoworld

02/21/2017  Scientists combine the ultra-fast with the ultra-small to pioneer microscopy at terahertz frequencies.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

Vital Control in Fab Materials Supply-Chains - Part 2

02/16/2017  Expert panel discussion at Critical Materials Council (CMC) Conference

3D and 2.5D IC packaging market expected to be worth $170B by 2022

02/14/2017  The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022.

IC market growth limited by narrow window of global GDP expansion

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

Nexperia emerges as dynamic new force in discretes, logic and MOSFETs

02/07/2017  Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition.

Micron CEO announces upcoming retirement

02/02/2017  Micron Technology, Inc. today announced the upcoming retirement of its Chief Executive Officer, Mark Durcan.

Samsung and Apple continued to lead as top global semiconductor customers in 2016

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

Top 3 trends impacting the global field-programmable gate array market through 2021

01/27/2017  Technavio’s latest market research report on the global field-programmable gate array (FPGA) market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Global semiconductor chip packaging market dominated by 3DIC through-silicon via stacks packaging technique

01/26/2017  The global semiconductor chip packaging market is expected to grow at a CAGR of more than 31% during the forecast period.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

Vital Control in Fab Materials Supply-Chains

01/25/2017  Expert panel discussion at Critical Materials Council (CMC) conference.

Amtech announces large orders for high throughput PECVD systems and bi-facial n-type technology

01/24/2017  Amtech Systems, Inc. today announced fiscal year 2017 year-to-date order bookings through January 20, 2017 are approximately $84 million.

Fire, rain, and M&A 

01/19/2017  The expert panel, "The Future of M&A in the Semiconductor Industry," was a hot topic at SEMI's Industry Strategy Symposium (ISS) conference on January 11.

Dow Corning expands LED packaging design options with launch of new silicone coatings

01/17/2017  Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.




TWITTER


WEBCASTS



Internet of Things

March 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

March 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS