Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



EV Group expands high-vacuum wafer bonding capabilities of EVG ComBond platform

07/06/2016  EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices

Tiniest imperfections make big impacts in nano-patterned materials

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

Amkor Technology receives Qualcomm Technologies’ 2015 Supplier of the Year award

06/21/2016  Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.

What is driving the advanced packaging market in China?

06/16/2016  Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015.

Samsung Electro-Mechanics to launch IC packaging business

06/15/2016  Samsung Electro-Mechanics, an electronic parts affiliate of Samsung Group, is preparing to dive into the integrated circuit packaging industry, according to news reports on Monday.

Advanced Packaging Forum provides answers at SEMICON West 2016

06/14/2016  Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum - and on display on the exhibition floor.

Efficient hydrogen production made easy

06/13/2016  Sticking electrons to a semiconductor with hydrazine creates an electrocatalyst.

Solid State Watch: June 3-9, 2016

06/10/2016  Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report

Global semiconductor sales decrease in April; Annual sales projected to dip slightly in 2016

06/10/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $25.8 billion for the month of April 2016.

An interview with Dr. Dongkai Shangguan

06/08/2016  Dr. Dongkai Shangguan is currently the Chief Marketing Officer of STATS ChipPAC. Previously, Dongkai served as the founding CEO of the National Center for Advanced Packaging Co., Ltd. (“NCAP China”), worked for 10 years at Ford Motor Company in various technical and management functions, and for 11 years at Flextronics as Corporate Vice President of Global Advanced Technology.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

06/06/2016  The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

06/05/2016  Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

06/05/2016  Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

Solid State Watch: May 27-June 2, 2016

06/03/2016  GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators

Solid State Watch: May 20-26, 2016

05/31/2016  SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond

An increasing number of healthcare applications is using bioMEMS components

05/27/2016  According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.

MACOM launches new GaN power transistors

05/26/2016  MACOM Technology Solutions reported the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless basestations.

Tessera files legal proceedings against Broadcom for patent infringement

05/24/2016  Tessera Technologies, Inc. announced today that it and certain of its subsidiaries filed legal proceedings for patent infringement in both domestic and international jurisdictions against Broadcom.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

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