Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



aveni extends copper interconnects to 5nm and below for BEOL integration

12/12/2017  aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

Leti develops world's first micro-coolers for CERN particle detectors

12/11/2017  Leti, a research institute of CEA Tech, today announced it has created the world's first microfluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider.

Solutions for controlling resin bleed out

12/05/2017  The hows and whys of resin bleed-out (RBO) are discussed, as well as the impact it makes and how to control it.

Reveal previously invisible defects and contaminants in advanced packaging applications

12/05/2017  A new illumination technology compares favorably to conventional bright field illumination.

Semiconductor industry continues upward trend toward record year

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

Advantest launches automated IC handler with thermal control for use in semiconductor engineering labs

11/29/2017  Semiconductor test equipment supplier Advantest Corporation has developed the M4171 handler to meet the mobile electronics market's needs for cost-efficient thermal control testing of ICs with high power dissipation during device characterization and pre-production bring up.

DARPA's new initiative

11/08/2017  Earlier this year, DARPA's Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) "to open pathways for far-reaching improvements in electronics performance well beyond the limits of traditional scaling."

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

Piezoelectrics stretch their potential with a method for flexible sticking

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

Nanotube fiber antennas as capable as copper

10/23/2017  Rice University researchers show their flexible fibers work well but weigh much less.

ASE, Amkor and JCET expected to top TrendForce's revenue ranking of OSAT providers for 2017

10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

Toshiba Memory Corp to invest in production equipment for Fab 6 at Yokkaichi operations

10/11/2017  TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

CMOS image sensor market to witness growth owing to high adoption of innovative technologies

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

Stay ahead of the curve with SMC 2017 - Materials accelerating innovation

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

Dow Corning receives Global Supplier Award from Bosch

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.




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WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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