Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

Versum Materials reaches milestone with installation of 200th CHEMGUARD Gen. III refill system

01/06/2017  The Delivery Systems and Services Group (DS&S) of Versum Materials, Inc. (NYSE: VSM) has realized an important milestone: the sale and commissioning of its 200th CHEMGUARD Gen III high purity, liquid delivery system since the product line launched in early 2016.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/22/2016  Mentor Graphics Corp. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

62 new facilities start operation 2017 and beyond

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Linde Korea acquires Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business

12/15/2016  Linde Korea, a member of The Linde Group, today announced that it has completed the takeover of Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business in South Korea.

Global Semiconductor Alliance announces 2016 Award recipients

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

TriLumina appoints Brian Wong as president and CEO

11/16/2016  TriLumina Corp., a developer of semiconductor laser illuminators for solid-state LiDAR systems that enable autonomous vehicles and new automotive safety systems, announced that Brian Wong has been named as the company's new President and Chief Executive Officer and as a member of the board of directors.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

Fan-in wafer-level packaging market to grow due to high demand for miniaturized electronics

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

The Chinese advanced packaging ecosystem: Looking ahead

11/02/2016  In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.

CMOS image sensor update

10/30/2016  Toshiba was the first to commercially implement CMOS image sensors with backside TSV last technologies in 2007. Many of us stated in 2007 that further advances could be obtained by removing the CMOS circuitry to a separate layer and forming a true 3D chip stack, but the technology imple- mentation had to wait while the industry first converted to back side imaging technology.

ams schedules 2017 multi-project wafer starts for analog foundry customers

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

Nanowires as sensors in new type of atomic force microscope

10/17/2016  A new type of atomic force microscope (AFM) uses nanowires as tiny sensors. Unlike standard AFM, the device with a nanowire sensor enables measurements of both the size and direction of forces. Physicists at the University of Basel and at the EPF Lausanne have described these results in the recent issue of Nature Nanotechnology.

New sensor material could enable more sensitive readings of biological signals

10/07/2016  Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

KLA-Tencor, Lam Research call off merger deal

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS