Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Busch COBRA BC achieves 12 year milestone at GlobalFoundries Fab 1

06/29/2017  Twelve years of continuous operation amounts to over 18.9 billion rotations.

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

HPC, chiplets and interposers

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

Advanced packaging brings more value and cost reduction to future semiconductor products

06/15/2017  Yole Developpement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue.

Artificial intelligence: A new era of the advanced packaging industry

06/08/2017  AI is driving the development of 3D TSV and heterogeneous integration technologies.

Mentor OSAT Alliance program streamlines IC high-density advanced packaging design and manufacturing

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

Diamond quantum sensor reveals current flows in next-gen materials

04/27/2017  World-first images of electric currents in graphene released.

Chroma releases the newest semiconductor test solution

04/24/2017  Chroma ATE Inc. has recently released the newest semiconductor test solution for the IoT IC market.

March billings reached levels not seen since March 2001, reports SEMI

04/21/2017  North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017, according to the March Equipment Market Data Subscription Billings Report published today by SEMI.

Global ESD packaging market driven by the miniaturization of semiconductors, says Technavio

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

NXP announces new 65 V LDMOS technology that speeds RF power design

04/10/2017  NXP Semiconductors N.V. today announced a new laterally diffused metal oxide semiconductor (LDMOS) technology for RF power transistors designed for operation up to 65 volts (V).

Advanced packaging industry: What we could expect in 2017

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

IEEE unveils next lifecycle phase of the IRDS to drive computing industry beyond Moore’s Law

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

IC Insights more than doubles its 2017 IC market growth forecast

03/30/2017  Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.

Synopsys' IC Validator used for physical sign-off on more than 100 finFET production tapeouts

03/29/2017  Synopsys, Inc. today announced that its IC Validator physical verification product has been successfully used for signoff on more than 100 tapeouts at advanced FinFET nodes.

Ultratech receives follow-on, multiple system orders from world's leading OSATs for advanced packaging applications

03/28/2017  Ultratech, Inc. today announced that it has received follow-on, multiple system orders from several outsourced semiconductor assembly and test (OSAT) companies in Taiwan, Korea and China.

Intel elects two new members to Board of Directors

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

European SEMI Award honors advanced packaging technologists

03/23/2017  At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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