Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

Dow Corning receives Global Supplier Award from Bosch

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Multitest Atlas contactor demonstrates advanced electrical and mechanical performance in WLCSP testing

07/21/2017  Atlas 0.3 mm pitch spring probe validated at customer site.

PLAT4M matures three silicon photonic platforms

07/14/2017  Leti today announced that the European FP7 project PLAT4M has now been completed with results that exceeded expectations.

Digital revolution: The path to innovation is opened by disruption

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

Meniscus-assisted technique produces high efficiency perovskite PV films

07/10/2017  A new low-temperature solution printing technique allows fabrication of high-efficiency perovskite solar cells with large crystals intended to minimize current-robbing grain boundaries.

Busch COBRA BC achieves 12 year milestone at GlobalFoundries Fab 1

06/29/2017  Twelve years of continuous operation amounts to over 18.9 billion rotations.

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

HPC, chiplets and interposers

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

Advanced packaging brings more value and cost reduction to future semiconductor products

06/15/2017  Yole Developpement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue.

Artificial intelligence: A new era of the advanced packaging industry

06/08/2017  AI is driving the development of 3D TSV and heterogeneous integration technologies.

Mentor OSAT Alliance program streamlines IC high-density advanced packaging design and manufacturing

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

Diamond quantum sensor reveals current flows in next-gen materials

04/27/2017  World-first images of electric currents in graphene released.

Chroma releases the newest semiconductor test solution

04/24/2017  Chroma ATE Inc. has recently released the newest semiconductor test solution for the IoT IC market.

March billings reached levels not seen since March 2001, reports SEMI

04/21/2017  North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017, according to the March Equipment Market Data Subscription Billings Report published today by SEMI.

Global ESD packaging market driven by the miniaturization of semiconductors, says Technavio

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

NXP announces new 65 V LDMOS technology that speeds RF power design

04/10/2017  NXP Semiconductors N.V. today announced a new laterally diffused metal oxide semiconductor (LDMOS) technology for RF power transistors designed for operation up to 65 volts (V).

Advanced packaging industry: What we could expect in 2017

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.




TWITTER


WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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