Materials

MAGAZINE



MATERIALS ARTICLES



IBM scientists observe elusive gravitational effect in solid-state physics

07/19/2017  An international team of physicists, materials scientists and string theoreticians have observed a phenomenon on Earth that was previously thought to only occur hundreds of light years away or at the time when the universe was born. This result could lead to a more evidence-based model for the understanding the universe and for improving the energy-conversion process in electronic devices.

Researchers find path to discovering new topological materials

07/19/2017  An international team of researchers has found a way to determine whether a crystal is a topological insulator -- and to predict crystal structures and chemical compositions in which new ones can arise.

Taiwan largest semiconductor materials market, as SEMICON Taiwan approaches

07/19/2017  Taiwan is the world's largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.

Fluorine grants white graphene new powers

07/18/2017  Rice University researchers turn common insulator into a magnetic semiconductor.

IC deposition materials market forecast of $1.2B by 2021

07/17/2017  Precursors for metals and dielectrics in strong demand for finFETs and 3D-NAND.

Industry acting to reduce greenhouse gases

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

New materials, new challenges

07/12/2017  In order to increase device performance, the semiconductor industry has slowly been implementing many new materials.

Thinking thin brings new layering and thermal abilities to the semiconductor industry

07/11/2017  In a breakthrough for the semiconductor industry, researchers demonstrate a new layer transfer technique called "controlled spalling" that creates many thin layers from a single gallium nitride wafer.

Linde Group announces rare gas capacity expansions

07/11/2017  The Linde Group is expanding production of the rare gases used by the semiconductor industry, including xenon, which is in increasing demand for etching 3D semiconductor structures.

Meniscus-assisted technique produces high efficiency perovskite PV films

07/10/2017  A new low-temperature solution printing technique allows fabrication of high-efficiency perovskite solar cells with large crystals intended to minimize current-robbing grain boundaries.

Brewer Science partners with Arkema to develop high-chi DSA materials for advanced node patterning

07/10/2017  Brewer Science Inc. today announced from SEMICON West the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers.

New class of 'soft' semiconductors could transform HD displays

06/29/2017  Berkeley Lab researchers find tunable halide perovskites could usher in new generation of optoelectronic devices.

Taiwan Compound Semiconductor Seminar − Envisioning next-gen communications

06/29/2017  Market demand is driving development of 5G network standards, and commercial applications are expected to be introduced by 2020.

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TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS