08/03/2015 ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.
08/03/2015 OMRON Corporation announced its entry into a stock purchase agreement to acquire a 100 percent stake in Delta Tau Data Systems, Inc. of California (DT), which will result in DT becoming a member of the OMRON Group.
08/03/2015 The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014.
07/29/2015 IBM today announced the launch of a new community, IBM developerWorks Recipes, designed to help developers – from novice to experienced – quickly and easily learn how to connect Internet of Things (IoT) devices to the cloud and how to use data coming from those connected devices.
07/29/2015 Marketshare expansion, Internet of Things opportunities, rising costs of R&D, and China’s aggressive new focus on the semiconductor industry all driving the recent M&A surge.
07/28/2015 A team of researchers with Berkeley Lab's Materials Sciences Division, working at the Advanced Light Source (ALS), has generated and detected plasmons that boast one of the strongest confinement factors ever: the plasmon wavelength is only one hundredth of the free-space photon wavelength.
07/27/2015 Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.
07/24/2015 By encoding information in photons via their spin, "photonic" computers could be orders of magnitude faster and efficient than their current-day counterparts. Likewise, encoding information in the spin of electrons, rather than just their quantity, could make "spintronic" computers with similar advantages.
07/23/2015 After two Semiconductor Strategy Symposiums in Ho Chi Minh City in 2013 and 2014, SEMI announced today that a SEMI Member Delegation will visit the Vietnamese Central Government in Hanoi on September 21-24.
07/23/2015 Ben-Gurion University of the Negev (BGU) and University of Western Australia researchers have developed a new process to develop few-layer graphene for use in energy storage and other material applications that is faster, potentially scalable and surmounts some of the current graphene production limitations.
View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015Sponsored by Epicor
Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015Sponsored by Fit-LINE, Inc.
Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015Sponsored by Master Bond, Inc.,
August 6, 2015 at 1:00 p.m. ET
Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.
August 26, 2015 at 1:00 p.m. ET
August 2015 (Date and time TBD)