12/07/2016 “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.
12/07/2016 EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.
12/07/2016 Presented at IEDM 2016, breakthrough suggests path to embedding neuromorphic learning in low-power devices that could enable autonomous systems.
12/06/2016 At the 2016 IEEE International Electron Devices Meeting, in a special poster session on MRAM, world-leading research and innovation hub for nano-electronics and digital technology imec presented a 8nm p-MTJ device with 100 percent tunnel magnetoresistance (TMR) and coercive field as high 1500Oe.
12/05/2016 Microscale energy storage units for wearable and miniaturized electronic devices are improved using porous materials.
12/01/2016 QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.
11/30/2016 New report also projects good IC sales increases in medical electronics, digital TVs, and servers.
11/28/2016 DGIST developed electrodes that can measure biological signals.
11/28/2016 Project developed pilot line for next-generation MEMS devices.
11/22/2016 The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions, according to a report by Persistence Market Research.
11/21/2016 Technavio's latest report on the global industrial embedded systems market provides an analysis on the most important trends expected to impact the market outlook from 2016-2020.
11/16/2016 Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.
11/15/2016 Today, SEMI announced that Innovation Village at SEMICON Japan 2016 has been expanded with participation by 31 start-up companies.
December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,