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MEMS ARTICLES



Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

Plasma-Therm earns multiple 'RANKED 1st' awards in industry survey

05/17/2018  For the 20th year, a worldwide survey of semiconductor manufacturers has resulted in Plasma-Therm winning multiple awards for its systems and superior customer service.

SiTime opens new Center of Excellence in Michigan

05/17/2018  SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

Advanced materials: processing glass like a polymer

05/17/2018  KIT materials scientists develop new forming technology -- publication in advanced materials.

SEMI position on EC's proposed framework for screening foreign direct investments in the European Union

05/17/2018  In response to the European Commission’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

Engineers on a roll toward smaller, more efficient radio frequency transformers

05/14/2018  The future of electronic devices lies partly within the "internet of things" - the network of devices, vehicles and appliances embedded within electronics to enable connectivity and data exchange. University of Illinois engineers are helping realize this future by minimizing the size of one notoriously large element of integrated circuits used for wireless communication - the transformer.

Global MEMS Design Contest 2018 winners announced

05/11/2018  Team from ESIEE Paris and Sorbonne University awarded grand prize for innovative use of MEMS and mixed-signal design in 3D vibration energy harvester project.

ON Semiconductor Rochester assembly and test facility expands manufacturing operation

05/10/2018  ON Semiconductor Corporation announced the expansion of their manufacturing facility in Rochester, New York.

Lab-on-a-chip device mimics eye damage due to intense light

05/10/2018  Houston Methodist researchers create eye neuron network model to study retinal diseases, possible treatment options.

Silicon Microstructures launches ultra-low differential pressure sensor with extraordinary long term stability

05/09/2018  SMI (Silicon Microstructures, Inc.) introduces the SM933X Series of ultra low MEMS pressure sensor systems.

Cohu to acquire Xcerra

05/08/2018  Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

Expecting the unexpected: 5 takeaways from FLEX Japan and MEMS & Sensors Forum Japan 2018

05/08/2018  Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

RF power semiconductors near $1.5B for 2017 with GaN driving the way

05/07/2018  Gallium Nitride (GaN) has the promise of gaining market share in 2018 and is forecast to be a significant force over the next few years.

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WEBCASTS



Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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