MEMS

MAGAZINE



MEMS ARTICLES



Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

Fundamental chemistry findings could help extend Moore’s Law

07/23/2014  A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

SEMI announces new South America Semiconductor Strategy Summit

07/22/2014  SEMI today announced the launch of the association's first-ever event in Latin America.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

07/22/2014  Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Imaging without limits: Phones lead growth but innovative applications expanding the market

07/18/2014  To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

IBM announces $3B research initiative

07/15/2014  IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

MORE MEMS ARTICLES

HEADLINES

Balance Stepper; DAILY EXPRESS reader offer 41956 Only £29.99 Was £59.99 Save £30
July 29, 2014

Software Toolbox Takes Wraps Off TOP Server Version 5.15
July 29, 2014

Knowles Updates on MEMS Microphone Shipments
July 29, 2014

Balance Stepper; SCOTTISH DAILY EXPRESS reader offer 41956 Only £29.99 Was £59.99 Save £30
July 29, 2014

Computer Graphics Market by Software (CAD/CAM, Visualization/Simulation, Digital video, Imaging, Modeling/Animation), Service (Consulting, Training & Support, Integration), End-User (Enterprise and SMB) - Worldwide Forecasts & Analysis (2014-2019)
July 28, 2014

Multi-Function Display (MFD) Market by Platforms, by Systems, by Technology, by Size, by Geography - Global Forecasts, Trends & Analysis to 2014 - 2020
July 28, 2014

AOL Announces Havas' Affiperf as Charter Global Partner for ONE by AOL
July 28, 2014

ON Semiconductor Offers Integrated Switching Regulators to Enable High Efficiency Offline Power Converters for Consumer Applications; Integrated 650 volt avalanche-rated MOSFETs enable robust, compact switching solutions for power-hungry applications such as household appliances, DVD players and set top boxes
July 28, 2014

DSP & Microcontrollers Market Growing at 6.96% CAGR to 2020: Global Analysis and Forecast in New Research Report Available at ReportsnReports.com; ReportsnReports.com offers "Microcontrollers, DSP, & IP Core Chip Market by Type, Applications (Automotive & Transportation, Consumer Electronics, Industrial, Communications, Security, and Medical & Healthcare) and Geography (Americas, Europe, APAC & ROW) - Analysis & Forecast to 2014 - 2020" global research report in its store.
July 28, 2014

China investigates Microsoft for antitrust violations: report
July 28, 2014

FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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