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MEMS ARTICLES



Researchers make flexible glass for tiny medical devices

03/24/2017  Glass can bend over and over again on a nanoscale.

Intel elects two new members to Board of Directors

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

SEMI headquarters relocates

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

STMicroelectronics collaborates with iFLYTEK for Chinese voice-recognition cloud services

03/15/2017  STMicroelectronics, a global semiconductor and a top MEMS supplier, and iFLYTEK, a voice-recognition cloud service provider in China, have introduced the market's first IoT development platform that enables voice-recognition cloud services in Chinese.

The ConFab 2017 announces leading semiconductor industry keynotes

03/14/2017  The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

NXP launches single-chip SoC with integrated microcontroller

03/09/2017  NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.

Imec, Holst Centre present a digital receiver excelling in energy efficiency and small size for Bluetooth 5

03/09/2017  Imec and Holst Centre (initiated by imec and TNO) have developed a novel phase-tracking receiver bringing further power and cost reduction for the next generations of Bluetooth and IEEE802.15.4 radio chips.

Polymer-coated silicon nanosheets as an alternative to graphene

03/08/2017  Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.

Eutelsat, ST announce low-cost, low-power System-on-Chip for interactive satellite terminals

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

Reducing conducting thin film surface roughness for electronics

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.

Imec’s 200mm GaN-on-Si e-mode power devices withstand heavy ion and neutron irradiation

03/07/2017  Radiation hardness of e-mode devices confirm maturity of imec’s 200mm GaN-on-Si platform.

Sweat patch mops up real-time performance monitor

03/06/2017  In 2016, the Nano-Bio Manufacturing Consortium (NBMC), a FlexTech-managed consortium focused on human performance monitoring technology, and funded in part by the Air Force Research Laboratories (AFRL), contracted with a broad-based team of industry and academia researchers, to develop a wearable monitor based on sweat analysis.

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TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

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TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

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