MEMS

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MEMS ARTICLES



QuickLogic joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/01/2016  QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

IoT and automotive to drive IC market growth through 2020

11/30/2016  New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

Health diagnosis through bio-signal measuring electrodes on IoT devices

11/28/2016  DGIST developed electrodes that can measure biological signals.

Lab4MEMS project recognized with European Innovation Award

11/28/2016  Project developed pilot line for next-generation MEMS devices.

SATS market driven by increasing demand for high-end packaging solutions

11/22/2016  The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions, according to a report by Persistence Market Research.

Multi-core, wireless, advanced materials top trends in industrial embedded systems market

11/21/2016  Technavio's latest report on the global industrial embedded systems market provides an analysis on the most important trends expected to impact the market outlook from 2016-2020.

Registration open for SEMICON Korea 2017's special 30-Year anniversary

11/16/2016  Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.

Fueling the industry with innovation at SEMICON Japan 2016

11/15/2016  Today, SEMI announced that Innovation Village at SEMICON Japan 2016 has been expanded with participation by 31 start-up companies.

SMIC and IMECAS sign an agreement for MEMS R&D and foundry platform

11/15/2016  Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

Fan-in wafer-level packaging market to grow due to high demand for miniaturized electronics

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

The best MEMS microphones for the iPhone 7 Plus

11/10/2016  The MEMS microphone market has enjoyed continuous growth since its debut.

MicroVision and STMicroelectronics to co-market MEMS mirror-based laser beam scanning solutions

11/10/2016  MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.

Smartphone unit shipments forecast to grow at single-digit rates through 2020

11/09/2016  IC Market Drivers 2017 analyzes end-use applications and impact on IC market growth.

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TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS