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MEMS ARTICLES



2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

Racyics launches 'makeChip' design service platform for GLOBALFOUNDRIES’ 22FDX technology

05/12/2017  Racyics GmbH announced today it has launched makeChip, an design service platform, developed using GLOBALFOUNDRIES' 22FDX process technology and supported by Cadence.

Scientists help thin-film ferroelectrics go extreme

05/10/2017  Berkeley Lab researchers create polarization gradient, boost temperature span of ubiquitous material.

Altair Semiconductor joins GSMA

05/10/2017  Altair Semiconductor announced that it has become an Associate Member of the GSMA.

Discovery of new transparent thin film material could improve electronics and solar cells

05/08/2017  Conductivity is highest-ever for thin film oxide semiconductor material.

Apple dips as global smartphone shipments hit 353M in Q1 2017

05/03/2017  According to the latest research from Strategy Analytics, global smartphone shipments grew 6 percent annually to reach 353 million units in Q1 2017.

Sigenics, Inc. receives $1M NIH grant to engineer technology for visual prosthesis system

05/02/2017  Sigenics, Inc. has received a $1M award from the National Institutes of Health (NIH) to develop electronics technology that is key to a brain-based visual prosthesis system.

STMicroelectronics appoints Jean-Marc Chery as Deputy CEO and names new executive team

04/27/2017  STMicroelectronics announced today the appointment of Jean-Marc Chery as Deputy CEO, effective July 1, 2017.

Worldwide smartphone market gains steam in the first quarter of 2017 with shipments up 4.3%, according to IDC

04/27/2017  Phone companies shipped a total of 347.4 million smartphones worldwide in the first quarter of 2017 (1Q17).

Diamond quantum sensor reveals current flows in next-gen materials

04/27/2017  World-first images of electric currents in graphene released.

SEMICON Southeast Asia attendance surges on disruptive technology

04/25/2017  Today, SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year.

Analog Devices’ MEMS accelerometers deliver compelling noise performance for condition monitoring applications

04/24/2017  Analog Devices, Inc. (ADI) today announced two high frequency, low noise MEMS accelerometers designed specifically for industrial condition monitoring applications.

Engineering technique is damaging materials, research reveals

04/21/2017  Widely used microscopy technique has unintended consequences, new Oxford University research reveals.

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WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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