MEMS

MAGAZINE



MEMS ARTICLES



Catching the (invisible) wave

04/11/2014  UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

Domain walls in nanowires cleverly set in motion

04/10/2014  Important prerequisite for the development of nano-components for data storage and sensor technology.

Scalable CVD process for making 2-D molybdenum diselenide

04/10/2014  Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

New "switch" could power quantum computing

04/10/2014  A light lattice that traps atoms may help scientists build networks of quantum information transmitters.

SEMI announces Innovation Village at SEMICON Europa 2014

04/09/2014  After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

MEMS microphones broadcast strong growth

04/04/2014  Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

2013: A year in review

04/04/2014  2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

MORE MEMS ARTICLES

HEADLINES

Move to change gadget import norms irks US; likely to impact products like Apple's iPads, iPhones
April 17, 2014

Move to Change Gadget Import Norms Irks US
April 17, 2014

MegaChips and Vidatronic execute Joint Development Agreement; MegaChips Corporation announces the MegaChips new generation LDO, a new line of products jointly developed with Texas-based semiconductor company, Vidatronic, Inc.
April 16, 2014

Lava Selects Broadcom Quad-Core HSPA+ Turnkey Platform to Power New QPAD Tablet; Feature-Rich Tablet Satisfies India's Booming Demand for Advanced Connectivity and Entertainment at an Affordable Price Point
April 16, 2014

Getac Announces T800 Fully Rugged Tablet with 8.1-Inch Display Designed for Today's Mobile Workforce; Compact Size, Extreme Ruggedness, Advanced Wireless, Extended Battery Life and New SnapBack Add-Ons Help T800 Perform in Extreme Conditions
April 16, 2014

Vivado Design Suite 2014.1 Increases Productivity with Automation of UltraFast Design Methodology and OpenCL Hardware Acceleration; New release delivers faster runtimes, improved QoR, OpenCL kernel support and automates UltraFast design methodology best practices for 7 series and UltraScale All Programmable devices
April 16, 2014

REMINDER: MEDIA ALERT: Oski Technology to Host Latest Decoding Formal Club for Formal Verification Enthusiasts; April 21 Agenda Includes Panel on Building Formal Team, Presentation on Formal Test Planning
April 16, 2014

Deca Technologies Ships 100-Millionth Wafer-Level Packaged Component; Fully Automated Manufacturing Technology Drives Growth for WLP Startup
April 16, 2014

Deca Technologies Ships 100-Millionth Wafer-Level Packaged Component; Fully Automated Manufacturing Technology Drives Growth for WLP Startup
April 16, 2014

QuickLogic Announces Release of IrDA-Based TV Remote Control PSB for Mobile Devices; Enables Mobile Device OEMs to Convert Their Smartphones Into TV Remote Controls
April 16, 2014

FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014