MEMS

MAGAZINE



MEMS ARTICLES



New MIPI Alliance Group collaborates with automotive industry experts to address interface specifications for automotive applications

10/16/2017  The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the formation of an Automotive Birds of a Feather (BoF) Group to solicit industry input from original equipment manufacturers (OEMs) and their suppliers to enhance existing or develop new interface specifications for automotive applications.

ArterisIP joins GLOBALFOUNDRIES FDXcelerator Partner Program

10/13/2017  ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.

GLOBALFOUNDRIES introduces new automotive platform to fuel tomorrow's connected car

10/12/2017  GLOBALFOUNDRIES today unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.

Toshiba Memory Corp to invest in production equipment for Fab 6 at Yokkaichi operations

10/11/2017  TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

Gartner identifies the top 10 strategic technology trends for 2018

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

MEMS & sensors companies compete for tech showcase "crown"

10/05/2017  MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

Unprecedented opportunities in automotive electronics

10/03/2017  Workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.

Comet Group to open Silicon Valley office

10/03/2017  COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

TowerJazz and Crocus expand presence in magnetic sensors market

09/27/2017  Crocus TMR sensors offer important advantages for multiple applications in IoT, consumer, automotive, industrial and medical sectors.

Wearable sensors reach their first billion-dollar year, with growth coming in three waves

09/27/2017  IDTechEx predict that 2017 will be the first billion dollar year for wearable sensors.

Understanding the impact of valve flow coefficient (Cv) in fluid systems

09/26/2017  Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

MORE MEMS ARTICLES

TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS