MEMS

MAGAZINE



MEMS ARTICLES



Scientists 'bend' elastic waves with new metamaterials that could have commercial applications

01/23/2015  Engineering researchers at the University of Missouri have developed a material that has the ability to control these waves, creating possible medical, military and commercial applications with the potential to greatly benefit society.

Will new policy in China trigger big changes?

01/21/2015  In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

Apple Watch spurs rapid growth of market for wireless charging in wearable technology in 2015

01/20/2015  Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Carbon nanotube finding could lead to flexible electronics with longer battery life

01/16/2015  University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Temporary tattoo offers needle-free way to monitor glucose levels

01/16/2015  Nanoengineers at the University of California, San Diego have tested a temporary tattoo that both extracts and measures the level of glucose in the fluid in between skin cells. This first-ever example of the flexible, easy-to-wear device could be a promising step forward in noninvasive glucose testing for patients with diabetes.

Further growth seen for semiconductor equipment and materials at SEMI ISS 2015

01/14/2015  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.”

MORE MEMS ARTICLES

FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015