Next-generation smartphone battery inspired by the gut

10/26/2016  Researchers have developed a prototype of a next-generation lithium-sulphur battery which takes its inspiration in part from the cells lining the human intestine. The batteries, if commercially developed, would have five times the energy density of the lithium-ion batteries used in smartphones and other electronics.

3D-printed organ-on-a-chip with integrated sensors

10/24/2016  Harvard University researchers have made the first entirely 3D-printed organ-on-a-chip with integrated sensing.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

Revenue growth sounding strong for suppliers of packaged MEMS microphones

10/21/2016  Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Working under pressure: Diamond micro-anvils with huge pressures will create new materials

10/20/2016  UAB researchers will use pressures greater than those found at the center of the Earth to create as yet unknown new materials.

Motion-sensing device from ST supports immersive virtual, augmented reality on Android mobile devices

10/18/2016  STMicroelectronics today announced that its LSM6DSM 6-axis Inertial Measurement Unit (IMU) has earned certification for use in next-generation mobile devices running Google Daydream, a high-performance virtual-reality platform, and Tango, a platform that maps 3D space and enables it to be overlaid with virtual objects.

Samsung starts industry's first mass production of System-on-Chip with 10nm finFET technology

10/17/2016  Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.

Nanowires as sensors in new type of atomic force microscope

10/17/2016  A new type of atomic force microscope (AFM) uses nanowires as tiny sensors. Unlike standard AFM, the device with a nanowire sensor enables measurements of both the size and direction of forces. Physicists at the University of Basel and at the EPF Lausanne have described these results in the recent issue of Nature Nanotechnology.

The future of electronics at SEMICON Europa 2016

10/13/2016  SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.

Researchers develop DNA-based single-electron electronic devices

10/13/2016  Researchers at the Nanoscience Center (NSC) of the University of Jyväskylä and BioMediTech (BMT) of the University of Tampere have now demonstrated a method to fabricate electronic devices by using DNA.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

10/11/2016  MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

First demonstration of brain-inspired device to power artificial systems

10/07/2016  New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.




Enabling The Future Of Information Technology Without Moore’s Law Scaling

November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017