MEMS

MAGAZINE



MEMS ARTICLES



Engineers develop new sensor to detect tiny individual nanoparticles

09/02/2014  A team of researchers at Washington University in St. Louis, led by Lan Yang, PhD, the Das Family Career Development Associate Professor in Electrical & Systems Engineering, and their collaborators at Tsinghua University in China have developed a new sensor that can detect and count nanoparticles, at sizes as small as 10 nanometers, one at a time.

IDC lowers tablet projections for 2014 as demand in mature markets levels off

09/02/2014  Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

UMC joins Fujitsu's new foundry company

08/29/2014  United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

08/28/2014  SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

MEMS Industry Group hosts 10th annual MEMS Executive Congress US

08/28/2014  MEMS Industry Group (MIG) will host MEMS Executive Congress US 2014, an annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ.

The industry's first foundry business for MEMS utilizing thin-film piezoelectric elements

08/28/2014  ROHM has recently established a process for MEMS utilizing thin-film piezoelectric elements, and implemented the industry's first foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

Scientists craft a semiconductor only three atoms thick

08/27/2014  Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.

MORE MEMS ARTICLES

HEADLINES

Samsung Begins Mass Producing 3D TSV Technology Based DDR4 Modules for Enterprise Servers
September 03, 2014

Apple looms large at electronics showtech giant to stage mystery unveiling on september 9
September 03, 2014

Says Recent Report Shows Consumer Adoption Continues To Be A Struggle For Digital Wallet Providers While Consumers Feel More Comfortable With Using Cards Apple Icloud Data Theft Further
September 02, 2014

u-blox launches low-cost Wi-Fi / Bluetooth "Internet of Things" module; Rugged ODIN-W160 supports dual-band Wi-Fi & dual-mode Bluetooth for reliable connectivity
September 02, 2014

Mouser Electronics Signs Global Agreement to Distribute Broadcom Mass Market Products
September 02, 2014

By Switching Catalyst From Silver to Copper, Natcore Finds Additional Solar Cell Savings.; Research is Published in the Royal Society of Chemistry's Journal of Materials Chemistry A.
September 02, 2014

Kulicke & Soffa Introduces APAMATM - New Thermo-Compression Bonder
September 02, 2014

Presto Engineering Expands RF Capacity; Growing market drives Presto Engineering expansion in RF (including millimeter wavelength) test and production services in its North American and European Hubs.;
September 02, 2014

Opens Australian Office To Serve Marketers Down Under
September 02, 2014

SmartMetric Says Recent Report Shows Consumer Adoption Continues to Be a Struggle for Digital Wallet Providers While Consumers Feel More Comfortable With Using Cards -- Apple iCloud Data Theft Further Compounds Trust Issue for Mobile Phones
September 02, 2014

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014