MEMS

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MEMS ARTICLES



Renesas unveils 90nm one-transistor MONOS flash memory tech

02/11/2016  Renesas Electronics Corp. reported the development of 90nm one-transistor MONOS (1T-MONOS) flash memory technology that can be used in combination with a variety of processes.

Another record year for silicon wafer shipment volumes in 2015

02/10/2016  Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

58% of pure-play foundry capacity under high risk for seismic activity

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

Call for Papers issued for SEMICON Russia

02/08/2016  SEMICON Russia 2016 on 7-9 June will provide insights into market developments, technology, and business opportunities, short and long-term.

The iron stepping stones to better wearable tech without semiconductors

02/05/2016  The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

Researchers develop hack-proof RFID chips

02/04/2016  New technology could secure credit cards, key cards, and pallets of goods in warehouses.

Cautious expectations amid a slow-growth global economy

02/04/2016  The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

Gartner says worldwide wearable devices sales to grow 18.4 percent in 2016

02/03/2016  Gartner, Inc. forecasts that 274.6 million wearable electronic devices will be sold worldwide in 2016, an increase of 18.4 percent from 232.0 million units in 2015.

Apple products are driving market growth for MEMS microphones

02/03/2016  The popularity of Apple’s iPhone 6S and other products is boosting the microelectromechanical-systems (MEMS) microphones market to a compound annual growth rate (CAGR) of 11 percent from 2015 to 2019.

Self-calibrated 10 Mbit/s phase modulator exceeds state-of-the-art performance

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a self-calibrated high-speed (10Mbits/s) phase modulator achieving an excellent Error Vector Magnitude (EVM) of -37dB at 10.25 GHz.

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TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016