MEMS

MAGAZINE



MEMS ARTICLES



Detecting sleep apnea: Leti embeds sensors in wristband to measure heart rate and three other indicators

12/14/2017  Leti, a research institute of CEA Tech, will demonstrate at CES 2018 its new wristband that measures physical indicators of a range of conditions, including sleep apnea, dehydration and dialysis-treatment response.

New insight into battery charging supports development of improved electric vehicles

12/14/2017  First technique capable of determining lithium metal plating during lithium ion battery charging reported in Materials Today.

The world's 1st "7-axis" motion tracking devices: tiner package & better response time

12/13/2017  Accelerometers and gyroscopes are fueling the robotic revolution, especially the drones’ market segment. However, these MEMS devices are not the only ones on the market place anymore, with environmental sensors penetrating this industry too.

Plasmonic biosensors enable development of new easy-to-use health tests

12/13/2017  Researchers at Aalto University have developed a biosensor that enables creating a range of new easy-to-use health tests similar to home pregnancy tests. The plasmonic biosensor can detect diseased exosomes even by the naked eye. A rapid analysis by biosensors helps recognize inflammatory bowel diseases, cancer and other diseases rapidly and start relevant treatments in time. In addition to using discovery in biomedicine, industry may use advanced applications in energy.

USC Viterbi faculty design thermal 'skin' to maintain temperature of satellites

12/13/2017  VO2 coated silicon material designed in collaboration with Northrop Grumman performs 20 times better than current semiconductors.

ProPlus and MPI Corporation establish strategic partnership

12/12/2017  ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

Discovery sets new world standard in nano generators

12/11/2017  Researchers discover new way to power electrical devices.

IBM's Khare on A.I.

12/07/2017  Mukesh Khare, VP of IBM Research, talked about the impact artificial intelligence (AI) is going to have on the semiconductor industry during a recent panel session hosted by Applied Materials. He said that today most artificial intelligence is too complex.

How to tame the electromagnetic interference in the fabs and beyond

12/07/2017  Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Automotive and IoT will drive IC growth through 2021

12/06/2017  IC Insights’ IC Market Drivers 2018 report also projects good increases in IC sales for medical electronics, wearable systems, cellphones, servers, and gov/mil applications.

Global semiconductor sales increase 21.9% year-to-year in October

12/05/2017  October marked the global industry's largest-ever monthly sales total.

Nambi Seshadri wins 2018 IEEE Alexander Graham Bell Medal

12/05/2017  Awarded for exceptional contributions to communications and networking sciences and engineering.

MORE MEMS ARTICLES

TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS