MEMS

MEMS ARTICLES



Semiconductor unit shipments to exceed one trillion devices in 2017

02/26/2015  Updated forecast expects robust 8.2% average annual unit shipment growth through 2019.

Technologists focus on semiconductor factory productivity and process solutions at ASMC 2015

02/25/2015  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2015) will be held May 3-6 in Saratoga Springs, New York.

Imec and Panasonic present breakthrough in CMOS-based transceivers for mm-wave radar systems

02/25/2015  Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

Penang to host inaugural SEMICON Southeast Asia

02/25/2015  The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia.

Freescale pushes for a secure Internet of Things

02/24/2015  As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Radio chip for the 'Internet of things'

02/24/2015  At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Optical nanoantennas set the stage for a NEMS lab-on-a-chip revolution

02/24/2015  Newly developed tiny antennas, likened to spotlights on the nanoscale, offer the potential to measure food safety, identify pollutants in the air and even quickly diagnose and treat cancer, according to the Australian scientists who created them.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

02/20/2015  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

Techniques for simplifying pulsed measurements: Part 1

02/20/2015  Pulsed measurements are defined in Part 1, and common pulsed measurement challenges are discussed in Part 2.

Call for Papers open for SEMICON Europa 2015 and Plastic Electronics 2015

02/19/2015  SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2015 which takes place October 6-8 in Dresden, Germany. Technical presentation abstracts are due April 30.

China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

MIG announces finalists for MEMS & Sensors Technology Showcase

02/19/2015  Selected from a pool of applicants, finalist companies will demo their MEMS/sensors-based applications as they vie for attendees’ votes.

GLOBALFOUNDRIES joins imec to develop innovative RF solutions for Internet of Things applications

02/17/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced a partnership with imec, a nanoelectronics research center, for joint research on future radio architectures and designs for highly integrated mobile devices and IoT applications.

Novel crumpling method takes flat graphene from 2-D to 3-D

02/17/2015  Researchers at the University of Illinois at Urbana-Champaign have developed a unique single-step process to achieve three-dimensional (3D) texturing of graphene and graphite.

Samsung announces mass production of industry’s first 14nm finFET mobile application processor

02/17/2015  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

A new spin on spintronics

02/17/2015  A team of researchers from the University of Michigan and Western Michigan University is exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.

Security should not be hard to implement

02/17/2015  Data is ubiquitous today. It is generated, exchanged and consumed at unprecedented rates.

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

02/17/2015  Silicon photonics enables extreme light-matter interaction.

Researchers glimpse distortions in atomic structure of materials

02/13/2015  Researchers from North Carolina State University are using a technique they developed to observe minute distortions in the atomic structure of complex materials, shedding light on what causes these distortions and opening the door to studies on how such atomic-scale variations can influence a material's properties.

Giga-scale challenges will dominate 2015

02/13/2015  It wasn’t all that long ago when nano-scale was the term the semiconductor industry used to describe small transistor sizes to indicate technological advancement.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015