The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Synopsys and industry technologists to address the path to 2nm SoC design

03/16/2018  Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.

Imec honors Qualcomm founder Irwin M. Jacobs with Lifetime of Innovation Award

03/14/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, today presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm.

EV Group and IBM sign license agreement on laser debonding technology

03/14/2018  IBM's Hybrid Laser Release Process technology complements EV Group's low-temperature laser debonding equipment and process portfolio designed to enable highly flexible, high-throughput solution.

Researchers develop spectroscopic thermometer for nanomaterials

03/13/2018  A scientific team led by the Department of Energy's Oak Ridge National Laboratory has found a new way to take the local temperature of a material from an area about a billionth of a meter wide, or approximately 100,000 times thinner than a human hair.

Micron appoints Raj Talluri as senior vice president and general manager of Mobile Business Unit

03/13/2018  Micron Technology Inc. announced today that the company has appointed Raj Talluri as senior vice president and general manager of the Mobile Business Unit.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Breakthrough in circuit design makes electronics more resistant to damage and defects

03/12/2018  A newly published paper in Nature Electronics details how researchers at the Advanced Science Research Center, GC/CUNY, used an array of nonlinear resonators to overcome signal disruption when electronic circuits are broken or damaged.

Scientists develop new tool for imprinting biochips

03/09/2018  The new technology could allow researchers to fit more biochemical probes onto a single biochip and reduce the cost of screening and analyzing changes associated with disease development, detecting bioterrorism agents, and other areas of research.

A universally profitable renewable energy business model

03/08/2018  The solar energy sector shined in a global renewable energy market that maintained steady growth last year despite the United States’ shocking withdrawal from the Paris Agreement. Solar panel costs dropped to an all-time low, driving global demand that surpassed the 100GW mark for the first time on the strength of standout annual 26 percent growth.

New approach to measuring stickiness could aid micro-device design

03/08/2018  Brown University engineers have devised a new method of measuring the stickiness of micro-scale surfaces. The technique, described in Proceedings of the Royal Society A, could be useful in designing and building micro-electro-mechanical systems (MEMS), devices with microscopic moving parts.

Palma Ceia closes Series B funding

03/07/2018  Palma Ceia SemiDesign (PCS), a fabless semiconductor company offering wireless chips, modules, systems and IP supporting emerging Machine-to-Machine (M2M) WiFi and cellular standards for the Internet of Things (IoT), today announced it has completed a Series B round of financing.

Are the major DRAM suppliers stunting DRAM demand?

03/07/2018  Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

A treasure trove for nanotechnology experts

03/06/2018  A team from EPFL and NCCR Marvel has identified more than 1,000 materials with a particularly interesting 2D structure. Their research paves the way for groundbreaking technological applications.

Materials 'sandwich' breaks barrier for solar cell efficiency

03/05/2018  NYU Tandon Professor André D. Taylor's research team combines materials and borrows lessons from nature to build a better organic solar cell.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

TDK to acquire Chirp Microsystems

03/02/2018  TDK Corporation announced that it has reached an agreement with Chirp Microsystems, Inc., a developer of high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Semiconductor Manufacturing Electronics Corporation formally signed a joint venture agreement

03/01/2018  SMIC, Shaoxing Government, and Shengyang Group together announced today the founding of the Semiconductor Manufacturing Electronics (Shaoxing) Corporation (planned) with joint capital contributions. T

A marriage of light-manipulation technologies

03/01/2018  Researchers have, for the first time, integrated two technologies widely used in applications such as optical communications, bio-imaging and Light Detection and Ranging (LIDAR) systems that scan the surroundings of self-driving cars and trucks.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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