Yang awarded MacArthur "genius" fellowship for synthetic "leaf" of nanowires, bacteria

10/01/2015  Yang and his collaborators have created a synthetic “leaf” that is a hybrid system of semiconducting nanowires and bacteria.

ams introduces solution for 24/7 heart rate measurement for wearables

09/30/2015  ams AG announced the launch of the AS7000, the first member of a new family of health/fitness solutions aimed at wearable devices.

2015 IEEE International Electron Devices meeting to showcase the latest technology developments in micro/nanoelectronics

09/30/2015  At the 61st annual IEEE International Electron Devices Meeting (IEDM) subjects under discussion will encompass a range of topics critical to the continuing progress of the industry.

Hillcrest Labs unveils MotionEngine Wear software

09/29/2015  Hillcrest Labs unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

ARM joins Semiconductor Research Corporation

09/28/2015  Semiconductor Research Corporation (SRC) today announced that ARM has joined SRC’s Global Research Collaboration (GRC) program.

ULVAC launches G-TRAN series multi ionization gauge ST2

09/28/2015  ULVAC, Inc. announced that the company has developed G-TRAN series multi ionization gauge ST2, a transducer-type ionization vacuum gauge.

First optical rectenna converts light to DC current

09/28/2015  Using nanometer-scale components, researchers have demonstrated the first optical rectenna, a device that combines the functions of an antenna and a rectifier diode to convert light directly into DC current.

ams offers truly scalable transistors in High-Voltage CMOS

09/28/2015  The Full Service Foundry division of ams AG today announced a further expansion of its industry-leading 0.35µm High-Voltage CMOS specialty process platform.

ULVAC launches dry vacuum pump accessory ECO-SHOCK ES4A

09/25/2015  ULVAC, Inc. announced that it has recently developed and started selling the ECO-SHOCK ES4A, a power saving accessory for dry vacuum pumps that can reduce power consumption.

X-FAB sets benchmark for low-noise CMOS

09/25/2015  Enhanced XH035 and XH018 CMOS transistors deliver industry-leading performance for highly noise-sensitive applications.

New software update for parametric test system reduces test times by 25 percent

09/24/2015  Tektronix, Inc. announced the release of a major system software update for the Keithley S530 Parametric Test System that can reduce measurement speed by as much as 25 percent.

UMC enters high volume touch IC production using foundry industry's first 0.11um eFlash process

09/24/2015  United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.

Europe's secondary industry in the spotlight

09/22/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

Semiconductor Manufacturing: ASMC 2016 - Nov. 2 "call for papers" deadline

09/22/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

Microcontroller market growth tied to IoT applications, IHS

09/22/2015  The market for microcontroller units (MCUs) used in Internet of things (IoT) applications is on the rise, which is having a positive effect on overall MCU market growth.

Alcatel-Lucent acquires Mformation

09/18/2015  Alcatel-Lucent has announced the acquisition of Mformation, a leading provider of mobile and "Internet of Things" security and device management solutions for mobile operators, service providers and enterprises. Terms of the deal were not disclosed.

S3S - the conference for IoT technologies

09/18/2015  The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

New motion sensor from STMicroelectronics enhances user interface and image stabilization in smartphones and tablets

09/17/2015  STMicroelectronics has introduced a six-axis motion-sensing device fully supporting image stabilization in smartphones, tablets, and digital still cameras.

Leti demos MEMS fabrication on its 300mm line, pointing the way to lower manufacturing costs

09/17/2015  CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

GE creates GE Digital

09/17/2015  GE announced the creation of GE Digital, a move that brings together all of the digital capabilities from across the company into one organization.




Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts



SEMICON Europa 2015
Dresden, Germany
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015