MEMS

MEMS ARTICLES



Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Industry Upswing: End of Cycles?

08/14/2017  Semiconductor-related companies are trading at all-time highs, and record device shipments and revenues as well as equipment revenues are expected.

Brain-mimicking nanomaterials for A.I. retina receive $7M research grant

08/09/2017  A future android brain like that of Star Trek’s Commander Data might contain neuristors, multi-circuit components that emulate the firings of human neurons.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

Intel completes tender offer for Mobileye

08/08/2017  The combination of Intel and Mobileye will allow Mobileye's computer vision expertise (the "eyes") to complement Intel's high-performance computing and connectivity expertise (the "brains") to create automated driving solutions from cloud to car.

Opto-mechanical technique circumvents mechanical losses using the action of light

08/08/2017  A research collaboration between the University of Illinois at Urbana-Champaign, the National Institute of Standards and Technology, and the University of Maryland has revealed a new technique by which scattering of sound waves from disorder in a material can be suppressed on demand. All of this, can be simply achieved by illuminating with the appropriate color of laser light. The result, which is published in Nature Communications, could have a wide-ranging impact on sensors and communication systems.

Worldwide semiconductor capital spending is forecast to grow 10.2% in 2017

08/07/2017  Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc.

NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Knowles appoints Dr. Cheryl Shavers to Board of Directors

08/04/2017  Knowles Corporation (NYSE: KN) today announced the appointment of Dr. Cheryl Shavers to the Board of Directors. Her appointment is effective August 1, 2017 and expands the Board to 9 directors, 8 of whom are independent.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

Alkaline soil, sensible sensor

08/02/2017  Field sensor quickly, accurately identifies soil issues.

Kuala Lumpur debut for SEMICON Southeast Asia in 2018

08/01/2017  SEMICON Southeast Asia will make its debut in Kuala Lumpur, Malaysia on May 8-10 at the new Malaysia International Trade & Exhibition Centre (MITEC).

Analog Devices joins University of Michigan’s Mcity Initiative for advancing connected and autonomous vehicles

07/31/2017  Analog Devices, Inc. (ADI) today announced that it has become an affiliate member of Mcity at the University of Michigan.

Universities obtain new funding from nano-bio manufacturing consortium

07/28/2017  Three leading U.S. universities are the latest recipients of funding from the Nano-Bio Manufacturing Consortium (NBMC), operated by SEMI.

The pervasiveness of ASICs in the IoT era

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

What’s next in leading edge semiconductor manufacturing?

07/27/2017  Solid State Technology will be conducting a new survey will take aim at understanding what this evolution means to the semicon-ductor manufacturing industry supply chain in terms of the technology that will be needed.

Dow Corning receives Global Supplier Award from Bosch

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Ultrathin device harvests electricity from human motion

07/24/2017  A new electrochemical energy harvesting device developed at Vanderbilt University can generate electrical current from the full range of human motions and is thin enough to embed in clothing.

NUS engineers achieve significant breakthrough in spin wave-based information processing technology

07/24/2017  Novel method of propagating spin waves could pave the way for high-speed, miniaturized data processing devices.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS