MEMS

MEMS ARTICLES



An increasing number of healthcare applications is using bioMEMS components

05/27/2016  According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.

MACOM launches new GaN power transistors

05/26/2016  MACOM Technology Solutions reported the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless basestations.

The next generation of carbon monoxide nanosensors

05/26/2016  Scientists have been investigating sensors that can determine CO concentration, and a team from the Okinawa Institute of Science and Technology Graduate University (OIST), in tandem with the University of Toulouse, has found an innovative method to build such sensors.

MEMS technology is contributing to the inkjet printing industry revolution

05/25/2016  With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.

Imec, Holst Centre and Barco Silex collaborate on data security for wearables and IoT networks

05/25/2016  Nanoelectronics research center imec, Holst Centre (set up by imec and TNO) and micro-electronic design house Barco Silex, belonging to the Barco group, today announced that they will collaborate to implement data security into sensors for wearable devices and Internet of Things (IoT) sensor networks.

Smart city devices to top 1 billion units in 2025

05/25/2016  Global unit shipments of smart city devices, which are internet-connected devices used in smart city projects, will increase from 115.4 million in 2015 to 1.2 billion in 2025.

Optics breakthrough to revamp night vision

05/25/2016  A breakthrough by an Australian collaboration of researchers could make infra-red technology easy-to-use and cheap, potentially saving millions of dollars in defence and other areas using sensing devices, and boosting applications of technology to a host of new areas, such as agriculture.

North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10

05/24/2016  North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

05/24/2016  The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

Solid State Watch: May 13-19, 2016

05/23/2016  IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments; New type of graphene-based transistor will increase the clock speed of processors

Fujitsu boosts efficiency of manufacturing processes at Shimane Fujitsu through IoT collaboration with Intel

05/19/2016  Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.

STMicroelectronics, Arduino launch cooperation to expand maker-community access to STM32 MCUs and sensors

05/19/2016  Moving to enable makers to make even more than before, STMicroelectronics and Arduino today announced an agreement that brings the STM32 family of microcontrollers (MCU), along with ST's full portfolio of sensing, power, and connectivity technology, even closer to the Arduino maker community.

The CEA announces expanded collaboration with Intel

05/18/2016  The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

IBM keynoter outlines disruptive "Economy of Things" at SEMI’s ASMC 2016

05/18/2016  The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.

TowerJazz begins mass producing new integrated SiGe-based "front-end module on a chip" RF platform for IoT applications

05/17/2016  TowerJazz today announced volume production of a new RF technology capable of integrating a wireless front-end module (FEM) on a single chip, tailored to meet the challenges of Internet of Things (IoT) applications.

Worldwide wearables market increases 67.2% amid seasonal retrenchment, reports IDC

05/16/2016  A combination of device releases, price reductions, and company rationalizations marked the first quarter of 2016 (1Q16) in the worldwide wearables market.

Si2 launches project to develop new integrated circuit power modeling technology

05/12/2016  Silicon Integration Initiative (Si2), an Austin-based integrated circuit research and development joint venture, has launched a project to help designers reduce power consumption, a growing challenge for most system-on-chip designs.

Samsung PhD Fellowship program recognizes best and brightest student innovators

05/12/2016  Each student will receive a Fellowship award of $50,000 as well as mentorship to support their ground-breaking research.

Automotive electronics system demand fails to boost automotive IC market in 2015

05/10/2016  Falling ASPs offset strong unit growth in automotive IC market, resulting in 3% decline.

Global semiconductor sales increase slightly in March

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.




TWITTER


WEBCASTS



High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS