MEMS

MEMS ARTICLES



ESPResSo, an EU funded collaboration to make perovskite solar cells a market reality

04/18/2018  Imec, a research and innovation hub in nanoelectronics, energy and digital technologies and partner in EnergyVille, has been named the coordinator of an ambitious 3-year European Union (EU) funded project, "ESPResSo" that gathers known leaders in the field of perovskite PV technology to revolutionize Europe's photovoltaics (PV) industry.

Surrey creates new tool to speed up the design of wearable tech

04/17/2018  In a new paper published by Nano Energy, experts from the Advanced Technology Institute (ATI) at the University of Surrey detail a new methodology that allows designers of smart-wearables to better understand and predict how their products would perform once manufactured and in use.

Amkor factories receive key automotive certification

04/16/2018  Amkor Technology, Inc. today announced that multiple factories have passed certification audits for IATF 16949:2016, a key certification required for manufacturers who supply products to the automotive market

Global MEMS market for mobile devices forecast to grow at a CAGR of 10.55%

04/12/2018  Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

Worldwide PC shipments declined 1.4% in first quarter of 2018

04/12/2018  Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc.

ABI Research's Teardowns service finds first hidden under-display fingerprint sensor bites into Apple's face recognition technology

04/11/2018  What makes the Vivo X20 Plus UD smartphone so important is that it is the first smartphone to use Synaptics' under-display fingerprint sensor, and it has the potential to bite into Apple's face recognition technology, announced the Teardowns service of ABI Research.

6 key takeaways from ISS Europe 2018

04/11/2018  With its leading research and development hubs, materials and equipment companies and chipmakers, the EU is in a strategic position in the global electronics value chain to support the growth of emerging applications such as autonomous driving, internet of things, artificial intelligence and deep learning.

Global IoT market to register revenue CAGR of 21.6% over next 10 years

04/09/2018  The first five-year cumulative revenue (2017-2021) is projected to be US$ 7,760.8 billion, which is expected to increase rather significantly over the latter part of the five-year forecast period.

The 2018 Symposia on VLSI Technology & Circuits covers converging trends in machine learning, artificial intelligence & the IoT

04/09/2018  The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for 'smart living.'

POET Technologies and SilTerra announce partnership to develop and manufacture POET's Optical Interposer Platform

04/09/2018  The partnership is expected to accelerate the path to commercial production of the Optical Interposer, which will enable optical engines for single-mode transceiver modules and other high bandwidth devices

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

Fraunhofer ISE and EV group achieve 33.3% efficiency with silicon-based multi-junction solar cell

04/04/2018  The Fraunhofer researchers achieved the high conversion efficiency of the silicon-based multi-junction solar cell with extremely thin 0.002 mm semiconductor layers of III-V compound semiconductors, bonding them to a silicon solar cell.

Cat-like 'hearing' with device tens of trillions times smaller than human eardrum

04/02/2018  Developing atomically thin 'drumheads' for ultra-low power communications and sensory devices.

Engineers turn plastic insulator into heat conductor

04/02/2018  Technique could prevent overheating of laptops, mobile phones, and other electronics.

More than Moore’s overall wafer demand is driven by the megatrends

03/29/2018  The wafer demand is expected to reach more than 66 million 8-inch eq. wafers by 2023, with an almost 10% CAGR between 2017 and 2023.

NUS scientists develop novel chip for fast and accurate disease detection at low cost

03/29/2018  Innovative microfluidic chip uses only standard lab microscope to spot nano-biomolecules without any fluorescent labels.

Optoelectronics, sensors/actuators, and discretes hit record-high sales

03/29/2018  Total revenues in the three O-S-D market segments climbed 11% in 2017 -- the strongest growth rate since 2010 -- and continue to be driven by high demand for sensors, actuators, CMOS imaging devices, light sensors, laser transmitters, and power discretes.

Smaller and faster: The terahertz computer chip is now within reach

03/28/2018  Hebrew university researcher shows proof of concept for nanotechnology that will make computers run 100 times faster.

Synopsys acquires Silicon and Beyond Private Limited

03/22/2018  Synopsys, Inc. today announced it has acquired Silicon and Beyond Private Limited, a provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

Golden touch: Next-gen optical disk to solve data storage challenge

03/22/2018  New technology offer cost-efficient and sustainable solution to global data storage challenge, while enabling the pivot from Big Data to Long Data and opening new realms of scientific discovery.




TWITTER


WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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