MEMS

MEMS ARTICLES



Mergers, acquisitions reshape the automotive semi supplier landscape

10/22/2014  Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

Special UO microscope captures defects in nanotubes

10/21/2014  University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Semiconductor equipment book-to-bill declines in September

10/21/2014  While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

10/20/2014  MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Magnetic mirrors enable new technologies by reflecting light in uncanny ways

10/17/2014  As in Alice’s journey through the looking-glass to Wonderland, mirrors in the real world can sometimes behave in surprising and unexpected ways, including a new class of mirror that works like no other.

Growing momentum in semiconductor manufacturing in Vietnam

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Wearable sensor market to expand sevenfold in five years

10/16/2014  Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

The mystery of reed relays: Understanding specifications

10/15/2014  Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

New 'lab-on-a-chip' could revolutionize early diagnosis of cancer

10/13/2014  University of Kansas Medical Center and KU Cancer Center have just published a breakthrough paper in the Royal Society of Chemistry journal describing their invention of a miniaturized biomedical testing device for exosomes.

Smallest world record has 'endless possibilities' for bio-nanotechnology

10/13/2014  Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine.

UMC announce joint venture for a 12" fab in China

10/09/2014  The Board of Directors of United Microelectronics Corporation, a global semiconductor foundry, today announced a joint venture company focused on 12" wafer foundry services with Xiamen Municipal People's Government and FuJian Electronics & Information Group.

SEMI announces rising annual silicon wafer shipment forecast

10/07/2014  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

Global semiconductor sales continue to climb in August

10/06/2014  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014.

Adoption of SiC & GaN to directly impact the power electronics industry

10/06/2014  Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

EV Group unveils room-temperature covalent bonder

10/06/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Europe: Strong growth in chip equipment spending in 2015

10/06/2014  Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

Crumpled graphene could provide an unconventional energy storage

10/03/2014  Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Boston Semi Equipment creates industry's largest independent ATE organization

10/01/2014  Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

More Webcasts

VIDEOS