MEMS

MEMS ARTICLES



Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

01/22/2016  According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Gartner says worldwide IT spending is forecast to grow 0.6% in 2016

01/22/2016  Worldwide IT spending is forecast to total $3.54 trillion dollars in 2016, just a 0.6 percent increase over 2015 spending of $3.52 trillion dollars, according to Gartner, Inc.

2016 Critical Materials Council (CMC) Seminar – Call for Papers

01/21/2016  The Critical Materials Council (CMC) and TECHCET have issued a call for papers to be presented at the “Critical Materials for Device Driven Scaling” Seminar to be held May 5-6, 2016 in Hillsboro, Oregon, USA.

Semiconductor R&D growth slows in 2015

01/21/2016  Industry-wide R&D expenditures grew 0.5% to a record-high $56.4 billion in 2015. Top 10 R&D spenders collectively increased expenditures by nearly 2% in the year.

Worldwide device shipments to grow 1.9% in 2016, while end-user spending to decline for the first time

01/20/2016  Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are expected to reach 2.4 billion units in 2016 , a 1.9 percent increase from 2015, according to Gartner, Inc.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

01/20/2016  Acoustic sensing company works with top foundry to support mass-market consumer products.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Gartner analysts reveal unexpected implications arising from the Internet of Things

01/19/2016  More than half of major new business processes and systems will incorporate some element of the Internet of Things (IoT) by 2020, according to Gartner, Inc.

Physicists develop a cooling system for the processors of the future

01/19/2016  Researchers from MIPT have found a solution to the problem of overheating of active plasmonic components.

Team develops wireless, dissolvable sensors to monitor brain

01/18/2016  A team of neurosurgeons and engineers has developed wireless brain sensors that monitor intracranial pressure and temperature and then are absorbed by the body, negating the need for surgery to remove the devices.

Sensor technologies are mature for autonomous driving application

01/15/2016  Currently the most advanced commercial car with autonomous features embeds about 17 sensors with two main solutions: ultrasonic sensors and cameras for surround. And by 2030, Yole anticipates more than 29 sensors.

Engineers invent a bubble-pen to write with nanoparticles

01/14/2016  Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.

Gartner reports worldwide PC shipments declined 8.3% in fourth quarter of 2015

01/13/2016  Worldwide PC shipments totaled 75.7 million units in the fourth quarter of 2015, a 8.3 percent decline from the fourth quarter of 2014, according to preliminary results by Gartner, Inc

Growth and a changing ecosystem at SEMI ISS 2016

01/13/2016  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Integrating for Growth: Markets, Technology, Ecosystem.” The packed conference of C-level executives gave the year’s first strategic outlook of the global electronics manufacturing industry.

Viewpoints: 2016 outlook

01/11/2016  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2016.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

AKHAN Semiconductor deploys 200mm manufacturing process in new diamond-based chip production facility

01/08/2016  AKHAN Semiconductor, Inc. this week announced that it is deploying 200mm manufacturing equipment and process in its new production facility in Gurnee, Illinois, continuing its preparation for delivering AKHAN diamond semiconductor based-technology products to the company’s first commercial customer this quarter.

Flexible hybrid electronics market heating up in 2016

01/07/2016  Flexible and printed electronics applications are becoming real. Forecasters are predicting a nearly $30 billion market for internet-connected devices in a combined industry and consumer sector.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016