MEMS

MEMS ARTICLES



MEMS industry influencers to present at SEMI European MEMS Summit

05/07/2015  SEMI has announced that executives from MEMS giants Bosch and STMicroelectronics, MEMS largest fabless Invensense and dominating IC foundry TSMC will be delivering the keynote talks at the European MEMS Summit.

New approaches to small problems

05/07/2015  The market expectations of modern electronics technology are changing the landscape in terms of performance and, in particular, power consumption, and new innovations are putting unprecedented demands on semiconductor devices.

ITRS 2.0: Heterogeneous integration

05/06/2015  Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

05/04/2015  A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

First quarter semiconductor sales up 6% compared to last year

05/04/2015  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $83.1 billion during the first quarter of 2015, an increase of 6.0 percent compared to the first quarter of 2014.

Solid State Watch: April 24-30, 2015

05/04/2015  Applied Materials and Tokyo Electron terminate merger; Sensor competition, actuator recovery impact supplier ranking; Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications; Silicon Motion announces agreement to acquire Shannon Systems

It’s blue skies for Jabil and its customers

05/01/2015  While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center emphasizes that Jabil has progressed from being a board manufacturer to a full-service supply chain management firm.

Sensor competition, actuator recovery impact supplier ranking

04/30/2015  Sensor leader Bosch grabs 20 percent of worldwide sales in 2014 while ST falls from second to fourth place with a 19 percent drop in dollar volume last year, says new O-S-D Report.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

04/30/2015  Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

Imec reports 9% growth in 2014

04/29/2015  Nanoelectronics research center imec, today reported the financial results for fiscal year ended December 31, 2014.

Safe CMP slurries for future IC materials

04/29/2015  New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects were presented at the CMP Users Group meeting.

SIGFOX and TI collaborate to deliver cost-effective, long-range, low-power Internet of Things connectivity

04/28/2015  SIGFOX and Texas Instruments (TI) announced the two companies are working together to increase IoT deployments using the Sub-1 GHz spectrum.

Picture this: Graphene brings 3-D holograms clearer and closer

04/28/2015  From mobile phones and computers to television, cinema and wearable devices, the display of full color, wide-angle, 3D holographic images is moving ever closer to fruition, thanks to international research featuring Griffith University.

Mentor Graphics releases design solutions for the independent engineer

04/28/2015  Mentor Graphics Corporation this week announced the delivery of three new PADS family products starting at five thousand dollars to address the advancing needs of the independent engineer.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

04/23/2015  A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

From metal to insulator and back again

04/23/2015  New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

Communications, computer systems drive IC sales across all regions

04/23/2015  Automotive systems forecast to remain a major application in Europe.

How emerging IoT impacts the semiconductor sector

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Brewer Science closer to zero-landfill status with "Big Blue" compactor that turns waste into electricity

04/21/2015  Brewer Science today announced its latest initiative to achieve and maintain zero-landfill status: a giant blue trash compactor that turns garbage into electricity.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 2015 (Date and time TBD)

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015