It's all about packaging - in this material world, who is your partner?

11/05/2015  With the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for semiconductor devices fabricated at 16 nm and below process nodes.

MEMS Executive Congress US Speaker Looks at MEMS Past, Present, and Future

11/04/2015  Much has changed in the world of microelectromechanical system (MEMS) devices in the past 20 years, and much more will change in the next two decades, said Steve Nasiri of Nasiri Ventures in his keynote address Wednesday (November 4) at the MEMS Executive Congress US conference in Napa, Calif.

SEMICON Japan attracts innovation: IoT and high-tech startups

11/04/2015  SEMI announced further details on SEMICON Japan, to be held at Tokyo Big Sight on December 16 through 18.

Allegro MicroSystems announces new 2D speed and direction sensor IC using vertical and planar Hall elements

11/04/2015  Allegro MicroSystems announced the release of a dual-channel Hall-effect latch featuring two-dimensional (2D) sensing via a combination of vertical Hall and planar Hall elements.

IMT partners with Silicon Catalyst to provide MEMS technology and manufacturing

11/03/2015  Innovative Micro Technology announced a partner agreement with Silicon Catalyst, a startup incubator focused exclusively on semiconductor solutions.

UPDATED - Semiconductor Manufacturing: ASMC 2016 - Nov. 11 "call for papers" deadline

11/03/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

Plasma-Therm acquires plasma processing technology from Nanoplas France

11/03/2015  Plasma-Therm announced that it has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal.

Practical Limits for Metallization Scaling in Fabs

11/02/2015  On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

11/02/2015  Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

Price erosion in sensors, volatility in discretes slows total O-S-D growth

10/29/2015  According to a report from IC Insights, the worldwide market for optoelectronics, sensors and actuators, and discrete semiconductors (O-S-D) has turned into a mixed bag of double-digit growth for several major product categories combined with single-digit declines in sales for nearly a dozen others.

InvenSense announces UltraPrint mass-manufacturable ultrasound fingerprint touch sensor solution

10/28/2015  InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

mCube unveils the world's smallest 1x1mm accelerometer

10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

Mentor Graphics updates Nucleus RTOS for Internet of Things and embedded connected devices

10/26/2015  Mentor Graphics Corporation announced an update to the Mentor (R) Embedded Nucleus (R) real time operating system (RTOS) targeting low power, next-generation applications for connected embedded and IoTdevices.

Light goes infinitely fast with new on-chip material

10/23/2015  Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) have designed the first on-chip metamaterial with a refractive index of zero.

Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components

10/22/2015  Two years after the launch of the PICS project , three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved.

New NSF-SRC report on energy efficient computing

10/22/2015  A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Slideshow: 2015 IEDM Preview

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

Stanford engineers create artificial skin that can send pressure sensation to brain cell

10/20/2015  Stanford engineers have created a plastic "skin" that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015