Testing: The key to AI-enabled autonomous driving

02/28/2018  Since 2010, 474 companies have poured $51 billion into developing products enabled by artificial intelligence (AI), with the bulk of these investments targeting autonomous driving and in-vehicle experiences, according to the McKinsey reports.

STMicroelectronics and Sigfox cooperate to connect billions of devices

02/26/2018  STMicroelectronics and Sigfox have announced a collaboration agreement to support and accelerate the growing demand for connected devices for a broad range of applications, including supply-chain management, building and equipment maintenance, water and gas metering, security, transportation, agriculture, mining and home automation.

Microsemi's new RF modules speed time to market for implantable medical device designers

02/23/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the ZL70123, a new radio frequency (RF) base station module for implantable devices utilizing the Medical Implant Communication Service (MICS) RF band.

Supermicro expands its Silicon Valley corporate headquarters

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

UBC engineers advance the capability of wearable tech

02/23/2018  A new low-cost ultra-stretchable sensor can do more with less.

Worldwide sales of smartphones recorded first ever decline during the fourth quarter of 2017

02/22/2018  Global sales of smartphones to end users totaled nearly 408 million units in the fourth quarter of 2017, a 5.6 percent decline over the fourth quarter of 2016, according to Gartner, Inc.

SEMI showcases achievements in flexible hybrid electronics, MEMS and sensors at 2018FLEX and MSTC conferences

02/22/2018  Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Integrated circuit technology advances continue to amaze

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

Researchers invent light-emitting nanoantennas

02/21/2018  Nanoscale light sources and nanoantennas already found a wide range of applications in several areas, such as ultra compact pixels, optical detection or telecommunications.

'Memtransistor' brings world closer to brain-like computing

02/21/2018  Combined memristor and transistor can process information and store memory with one device.

3D depth sensing & VCSEL technology surges: Key takeaways from SEMI Member Forum

02/16/2018  Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

Better together: Silicon qubits plus light add up to new quantum computing capability

02/15/2018  A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information -- known as qubits -- that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today's smartphones and computers.

Engineers develop smart material that changes stiffness when twisted or bent

02/15/2018  A new smart and responsive material can stiffen up like a worked-out muscle, say the Iowa State University engineers who developed it.

Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems

02/15/2018  Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

Rutgers-led innovation could spur faster, cheaper, nano-based manufacturing

02/14/2018  Scalable and cost-effective manufacturing of thin film devices.

2018 FLEXI awards innovation and leadership in flexible hybrid electronics

02/13/2018  The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017.

Close to the edge: Brain-inspired technologies will bring data processing and analytics to Internet of Things devices

02/13/2018  CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".

Frank Shemansky to lead SEMI's MEMS & Sensors Industry Group

02/13/2018  SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

MagnaChip offers 2nd-generation 0.13 micron BCD process technology with high-density embedded flash memory

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
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March 19, 2018 - March 23, 2018
LED Expo Thailand
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May 10, 2018 - May 12, 2018

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