MEMS

MEMS ARTICLES



Presto Engineering signs agreement with NAGRA for secure product production

06/27/2016  Presto will provide supply chain management and production services for several of NAGRA’s key products in the Pay TV market.

SMIC acquires LFoundry

06/27/2016  Semiconductor Manufacturing International Corporation jointly announces with LFoundry Europe GmbH and Marsica Innovation S.p.A., the signing of an agreement on June 24, 2016 to purchase a 70% stake of LFoundry for a consideration of 49 million EUR.

Brite Semiconductor and Semitech Semiconductor collaborate on industrial M2M SoC

06/24/2016  This SoC is designed to support M2M communication in the global industrial and energy transmission market via PLC/wireless modes.

Photovoltaic cells replicate rose petals

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

Automotive semiconductor market grows slightly in 2015 while ranks shift

06/22/2016  Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

06/21/2016  EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Solar cells for greener and safer energies

06/21/2016  ICFO researchers report on low-temperature, solution-processed, environmentally friendly inorganic solar cells made with Earth-abundant materials capable of operating with a power conversion of 6.3 percent.

Circuit technology that resolves issues with high-frequency piezoelectric resonators

06/17/2016  Realizing compact, low-cost, high-speed radio communication systems for the IoT age.

ams acquires CCMOSS

06/16/2016  ams, a manufacturer of high performance sensor and analog solutions, has signed an agreement to acquire 100% of the shares in Cambridge CMOS Sensors Ltd (CCMOSS), a developer of micro hotplate structures for gas sensing and infrared applications, in an all-cash transaction.

Electronic nose using CMOS integrated circuits analyzes breath

06/16/2016  Researchers at the Texas Analog Center of Excellence(TxACE), a Semiconductor Research Corporation(SRC)-funded research effort centered at the University of Texas at Dallas (UT Dallas), are working to develop an affordable electronic nose that can be used in breath analysis for a wide range of health diagnosis.

Leti Innovation Day in Lyon will explore new security challenges and responses for a safe connected world

06/15/2016  Leti, an institute of CEA Tech, is hosting a one-day conference covering "System Reliability & Security in a Connected World" in Lyon, France, on June 23.

Day 2 at The ConFab 2016: Success in semiconductor growth and fab management

06/14/2016  During the Tuesday morning sessions, ConFab attendees heard from speakers from Mentor Graphics, Intel, Infineon Technologies, Quantum Clean, and Edwards.

Gartner says worldwide smartphone sales to slow in 2016

06/14/2016  Gartner, Inc. said global smartphone sales will continue to slow and will no longer grow in double digits.

Changing markets drive smarter manufacturing by IC sector

06/13/2016  The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

Kicking off #TheConFab2016

06/13/2016  The ConFab 2016 kicked off this morning with speakers from GlobalFoundries, Silicon Catalyst, imec, TechInsights, CEA Leti, and New York Empire State Development.

Solid State Watch: June 3-9, 2016

06/10/2016  Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report

Scientists design energy-carrying particles called 'topological plexcitons'

06/10/2016  Scientists at UC San Diego, MIT and Harvard University have engineered "topological plexcitons," energy-carrying particles that could help make possible the design of new kinds of solar cells and miniaturized optical circuitry.

Countdown to Node 5: Moving beyond FinFETs

06/10/2016  A forum of industry experts at SEMICON West 2016 will discuss the challenges associated with getting from node 10 -- which seems set for HVM -- to nodes 7 and 5.

Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Novel energy inside a microcircuit chip

06/09/2016  VTT developed an efficient nanomaterial-based integrated energy.




TWITTER


WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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