Process Watch: Salami slicing your yield

09/26/2016  The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference

09/26/2016  MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.

EV Group extends volume manufacturing expertise to biotech and medical applications

09/26/2016  EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

NIST illuminates transfer of nanoscale motion through microscale machine

09/23/2016  For the first time, the NIST researchers have measured the transfer of motion through the contacting parts of a microelectromechanical system at nanometer and microradian scales.

Synopsys and TSMC collaborate to certify Custom Compiler for 16FFC process

09/22/2016  Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

09/21/2016  EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Thorlabs deploys manufacturing infrastructure to expand piezo chip/stack line

09/16/2016  Thorlabs has expanded its piezoelectric line to include new types of piezoelectric actuators, low‐voltage piezoelectric chips, and discrete stacks with through holes, enabling a higher level of flexibility when integrating the actuators into other devices.

SEMI and MSIG join together in strategic association partnership

09/15/2016  SEMI announced that MEMS & Sensors Industry Group (MSIG) will become a SEMI Strategic Association Partner effective January 1, 2017.

Actions Semiconductor enters into merger agreement for going private transaction

09/14/2016  Actions Semiconductor Co., Ltd. today announced that it has entered into a definitive merger agreement on September 12, 2016 pursuant to which the Company will be acquired by a consortium of investors.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

Imec scientist awarded ERC Starting Grant to develop breakthrough flexible electronics

09/13/2016  Nanoelectronics research center imec announces that Kris Myny, one of its young scientists, has been awarded an ERC Starting Grant.

SEMI’s new interactive mobile fab forecast: SEMI FabView

09/13/2016  SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.

High-volume processes for next-generation biotechnology devices

09/12/2016  Over the past several decades, miniaturization has significantly improved clinical diagnostics, pharmaceutical research and analytical chemistry. Modern biotechnology devices— such as biosensors, fully integrated systems for diagnostics, cell-analysis or drug discovery—are often chip-based and rely on close interaction of biological substances at the micro- and nanoscale. Thus, process technologies that enable the production of surface patterns and integration of fluidic components with small feature sizes are needed.

Fab equipment spending ascending

09/08/2016  Expect 4% growth (YoY) for 2016 and 11% for 2017

IC Insights updates semiconductor outlook for Internet of Things

09/07/2016  Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.

SEMI European MEMS Summit brings industry leaders to Stuttgart

09/06/2016  Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.



Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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SEMICON Europa 2016
Grenoble, France
October 25, 2016 - October 27, 2016
Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017