MEMS

MEMS ARTICLES



Pibond introduces a new product line for logic, memory, power and MEMS devices

04/01/2015  Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Imec and sureCore collaborate on SRAM Design IP

03/31/2015  sureCore Ltd., the low power SRAM IP company and nanoelectronics R&D center imec today announced that they are collaborating on low-power SRAM IP.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

ULVAC announces world's first, low temperature PZT sputtering technology

03/26/2015  ULVAC, Inc. this week announced industry's first low temperature PZT sputtering technology in mass production scale, enabling future advanced MEMS device integrated on CMOS which will be the mainstream of next generation MEMS devices.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

03/25/2015  At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

03/25/2015  Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Apple dictates the ranking of top 10 MEMS manufacturers in 2014

03/25/2015  Apple boosted Bosch’s MEMS revenue in 2014 again as Bosch is the sole supplier of the pressure sensors added to the iPhone 6 and 6+.

UW scientists build a nanolaser using a single atomic sheet

03/24/2015  University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

2014 top MEMS players ranking: Rising of the first MEMS titan

03/24/2015  With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clear #1.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

03/24/2015  Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

NC State researchers create 'nanofiber gusher'

03/19/2015  Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

Small powerful systems give rise to medical semiconductor sales

03/19/2015  Market for medical semiconductors seen rising to $8.2 billion in 2018.

Rice fine-tunes quantum dots from coal

03/18/2015  Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

AKM Semiconductor signs global distribution agreement with Digi-Key

03/18/2015  Global electronic components distributor Digi-Key Corporation, a provider of electronic component selection, availability and delivery, has partnered with AKM Semiconductor Inc., to facilitate the global distribution of AKM’s products.

Entrepix adds 300mm CMP capabilities to Phoenix foundry

03/17/2015  Entrepix, Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced that it has expanded its foundry operations in Phoenix, Arizona by installing 300mm chemical mechanical planarization (CMP) processing.

Poised for more growth

03/17/2015  Strong fab equipment spending expected in 2015; Slower but positive 2016.

EV Group releases new configurations to its high-vacuum wafer bonding technology

03/17/2015  EV Group introduced two new configurations to its EVG 580 ComBond series of automated high-vacuum covalent wafer bonding systems.

High tech start-ups to connect with investors at SEMICON Europa 2015

03/17/2015  SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS



3D Integration: The Most Effective Path for Future IC Scaling

Thursday, April 23, 2015 at 12:00 p.m. EST

It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

Sponsored By:
Trends in Materials: The Smartphone Driver

Thursday, April 30, 2015 at 1:00 p.m. EST

To understand 3-D FinFET doping and high mobility channel material, this talk will first review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015