MEMS

MEMS ARTICLES



Internet of Things stimulates MEMS market

12/23/2014  The explosive expansion of the Internet of things (IoT) is driving rapid demand growth for microelectromechanical systems (MEMS) devices in areas including asset-tracking systems, smart grids and building automation.

Global semiconductor market set for strongest growth in four years in 2014

12/23/2014  Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

Hands on: Crafting ultrathin color coatings

12/22/2014  In Harvard's high-tech cleanroom, applied physicists produce vivid optical effects on paper.

Piezoelectricity in a 2-D semiconductor

12/22/2014  Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

IoT's divergent needs will drive different types of technologies

12/19/2014  Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

The most expensive defect

12/18/2014  Defects that aren’t detected inline cost fabs the most.

Book-to-bill climbs above parity in November

12/18/2014  North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.

Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

12/17/2014  At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

Daintree Networks named to "50 Most Promising IoT Companies of 2014"

12/17/2014  Daintree Networks has been named by CIO Review Magazine as one of the '50 Most Promising Internet of Things (IoT) Companies 2014.'

Imec demonstrates broadband graphene optical modulator on silicon

12/17/2014  At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

The simplest element: Turning hydrogen into 'graphene'

12/16/2014  New work from Carnegie's Ivan Naumov and Russell Hemley delves into the chemistry underlying some surprising recent observations about hydrogen, and reveals remarkable parallels between hydrogen and graphene under extreme pressures.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Lead islands in a sea of graphene magnetize the material of the future

12/16/2014  Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

Synopsys and imec expand TCAD collaboration to 5nm and beyond

12/16/2014  Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

What’s next for MEMS?

12/16/2014  The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Stacking 2-dimensional materials may lower cost of semiconductor devices

12/12/2014  A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs.

Murata completes acquisition of Peregrine Semiconductor

12/12/2014  Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.

System Plus analyzes the world's smallest microbolometer-based thermal imaging camera core released by FLIR

12/11/2014  Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

Intel announces IoT platform

12/11/2014  Intel Corporation today announced the Intel IoT Platform, an end-to-end reference model designed to unify and simplify connectivity and security for the Internet of Things (IoT).




FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015