MEMS

MEMS ARTICLES



Plasma-Therm presents workshop at China University

06/16/2015  Plasma-Therm recently presented an advanced plasma processing workshop at Xidian University in Xi’an, China that was attended by researchers, students and industry representatives and featured a day-long series of presentations about plasma processing.

Fairchild launches MEMS product line

06/16/2015  Fairchild, a supplier of high-performance semiconductor solutions, today launched the FIS1100 6-axis MEMS Inertial Measurement Unit (IMU), the company’s first MEMS product stemming from its strategic investments in MEMS and motion tracking.

Renesas Electronics announces Synergy Platform for IoT

06/15/2015  Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the Renesas Synergy Platform.

A KAIST research team develops the first flexible phase-change random access memory

06/15/2015  Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

World's thinnest lightbulb -- graphene gets bright

06/15/2015  A team of scientists from Columbia, Seoul National University (SNU), and Korea Research Institute of Standards and Science (KRISS) reported today that they have demonstrated -- for the first time -- an on-chip visible light source using graphene, an atomically thin and perfectly crystalline form of carbon, as a filament.

Researchers grind nanotubes to get nanoribbons

06/15/2015  A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

“Easy does it” ─ Fabs trim spending plans

06/12/2015  Still capex and equipment spending expected to increase in 2015 and 2016.

MEMSIC's SmartSensing tech delivers highest performance in inertial measurement systems

06/11/2015  MEMSIC announced the launch of its latest addition, the INS380, to its portfolio of Inertial Systems enabled with SmartSensing technology targeted to a broad range of precision motion sensing applications.

Industry 4.0, automotive, and emerging markets highlights at SEMICON Europa

06/11/2015  Today, SEMI announced that SEMICON Europa 2015, the region’s largest microelectronics manufacturing event, will offer new themes to support the semiconductor industry’'s development in Europe.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

06/10/2015  CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

MIPT physicists develop ultrasensitive nanomechanical biosensor

06/10/2015  t can analyze the chemical composition of substances and detect biological objects, such as viral disease markers, which appear when the immune system responds to incurable or hard-to-cure diseases, including HIV, hepatitis, herpes, and many others.

Slip sliding away: Graphene and diamonds prove a slippery combination

06/10/2015  Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

Drive profitability through better forecasting

06/10/2015  Different forecasting algorithms are highlighted and a framework is provided on how best to estimate product demand using a combination of qualitative and quantitative approaches.

MEMS suppliers ride automotive safety wave

06/09/2015  Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS.

SEMI reports first quarter 2015 worldwide semiconductor equipment figures; billings $9.52B

06/09/2015  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.52 billion in the first quarter of 2015.

50 Years of Moore’s Law

06/09/2015  For 50 years, Moore’s Law has served as a guide for technologists everywhere in the world, setting the pace for the semiconductor industry’s innovation cycle.

Imagination and TSMC collaborate on advanced IoT IP platforms

06/08/2015  Imagination Technologies (IMG.L) and TSMC announce a collaboration to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market and simplify the design process.

Tackling Parameter Extraction for 16nm and Below

06/08/2015  There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.

Sankalp Semiconductor announces FD-SOI services and IP partnership with STMicroelectronics

06/05/2015  Sankalp Semiconductor, a chip design service company, announced that it has signed an agreement with STMicroelectronics to serve as an FD-SOI services and IP partner.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015