10/31/2016 At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves.
10/31/2016 UCSB electrical and computer engineers design an infinitesimal computing device.
10/28/2016 Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.
10/28/2016 Electrical currents can be now be switched on and off at the smallest conceivable scale enabling a new generation of 'green electronics' with the potential for great impact on the digital economy.
10/26/2016 Researchers have developed a prototype of a next-generation lithium-sulphur battery which takes its inspiration in part from the cells lining the human intestine. The batteries, if commercially developed, would have five times the energy density of the lithium-ion batteries used in smartphones and other electronics.
10/24/2016 Harvard University researchers have made the first entirely 3D-printed organ-on-a-chip with integrated sensing.
10/24/2016 SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.
10/21/2016 Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.
10/21/2016 Stanford, Oxford team creates high-efficiency tandem cells.
10/20/2016 UAB researchers will use pressures greater than those found at the center of the Earth to create as yet unknown new materials.
10/18/2016 STMicroelectronics today announced that its LSM6DSM 6-axis Inertial Measurement Unit (IMU) has earned certification for use in next-generation mobile devices running Google Daydream, a high-performance virtual-reality platform, and Tango, a platform that maps 3D space and enables it to be overlaid with virtual objects.
10/17/2016 Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.
10/17/2016 A new type of atomic force microscope (AFM) uses nanowires as tiny sensors. Unlike standard AFM, the device with a nanowire sensor enables measurements of both the size and direction of forces. Physicists at the University of Basel and at the EPF Lausanne have described these results in the recent issue of Nature Nanotechnology.
10/13/2016 SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.
10/13/2016 Researchers at the Nanoscience Center (NSC) of the University of Jyväskylä and BioMediTech (BMT) of the University of Tampere have now demonstrated a method to fabricate electronic devices by using DNA.
10/11/2016 MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.
10/07/2016 New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.
10/07/2016 Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.
10/06/2016 A research team led by faculty scientist Ali Javey at the Department of Energy's Lawrence Berkeley National Laboratory (Berkeley Lab) has done just that by creating a transistor with a working 1-nanometer gate. For comparison, a strand of human hair is about 50,000 nanometers thick.
10/04/2016 STMicroelectronics and WiTricity, an industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer.
December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,