MEMS

MEMS ARTICLES



Insect eyes inspire new solar cell design from Stanford

09/01/2017  Packing tiny solar cells together, like micro-lenses in the compound eye of an insect, could pave the way to a new generation of advanced photovoltaics, say Stanford University scientists.

Most of 2017 capital spending will go to foundry and flash memory

08/31/2017  Spending for DRAM expected to show biggest percentage gain in 2017.

STMicroelectronics boosts its ecosystem with partner program that connects customers with qualified third parties

08/31/2017  STMicroelectronics has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

08/30/2017  Qualcomm Incorporated and Himax Technologies, Inc. today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.

Acting like a muscle, nano-sized device lifts 165 times its own weight

08/30/2017  Rutgers materials scientists discover powerful effect that could benefit robotics, aviation, medicine and other fields.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

08/29/2017  Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

Automotive sensing: A mature yet highly dynamic market

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

High-speed switching for ultrafast electromechanical switches and sensors

08/29/2017  Unlike the slow ferroelastic domain switching expected for ceramics, high-speed sub-microsecond ferroelastic domain switching and simultaneous lattice deformation are directly observed for the Pb(Zr0.4Ti0.6)O3 thin films. This exciting finding paves the way for high-frequency ultrafast electromechanical switches and sensors.

SparkLabs launches $50M early-stage fund for South Korea

08/25/2017  SparkLabs Group, a network of accelerators and funds, is launching a $50 million early-stage fund (Series A & B) primarily focused on South Korea.

Next-generation drug testing on chips

08/25/2017  Improvements to tiny body-on-a-chip devices could lead to next-generation pre-clinical testing of drug toxicity.

Worldwide wearable device sales to grow 17% in 2017

08/24/2017  Sales of smartwatches to total 41.5 million units in 2017.

Analog Devices’ monitoring initiative aims to improve crop quality, yields, and boost profitability of local farmers

08/23/2017  The initiative instructs student farmers how to use Internet of Things and blockchain technologies to track the conditions and movement of produce from “Farm to Fork” to make decisions that improve quality, yields, and profitability.

Stretchable biofuel cells extract energy from sweat to power wearable devices

08/22/2017  A team of engineers has developed stretchable fuel cells that extract energy from sweat and are capable of powering electronics, such as LEDs and Bluetooth radios.

SiFive and Rambus to provide IP to the 'DesignShare' economy

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

'Electronic skin' takes wearable health monitors to the next level

08/21/2017  A soft, stick-on patch collects, analyzes and wirelessly transmits a variety of health metrics from the body to a smartphone.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Industry upswing: End of cycles?

08/14/2017  Semiconductor-related companies are trading at all-time highs, and record device shipments and revenues as well as equipment revenues are expected.

Brain-mimicking nanomaterials for A.I. retina receive $7M research grant

08/09/2017  A future android brain like that of Star Trek’s Commander Data might contain neuristors, multi-circuit components that emulate the firings of human neurons.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS