MEMS

MEMS ARTICLES



MEMS Executive Congress US 2015 examines commercial forces driving MEMS & sensors to $20B by 2020

08/18/2015  MEMS Industry Group (MIG)'s next MEMS Executive Congress US 2015 will explore the market drivers behind the double-digit growth propelling MEMS and sensors to more than $20+ billion by 2020.

SUSS MicroTec announces new competence-center for nanoimprint in North America

08/18/2015  SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies.

Imec pushes the boundaries of GaN technology

08/12/2015  Nano-electronics research center imec announced today that it is extending its Gallium Nitride-on-Silicon (GaN-on-Si) R&D program, and is now offering joint research on GaN-on-Si 200mm epitaxy and enhancement mode device technology.

Record shipments levels continue into the second quarter 2015

08/11/2015  Worldwide silicon wafer area shipments increased during the second quarter 2015 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Challenges for MEMS, sensors, and semiconductors

08/11/2015  Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

08/11/2015  Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

MagnaChip to host first Foundry Technology Symposium in Shanghai, China

08/10/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today it is hosting its first Foundry Technology Symposium at the Grand Hyatt in Shanghai, China, on September 22, 2015.

Flexible dielectric polymer can stand the heat

08/07/2015  Easily manufactured, low cost, lightweight, flexible dielectric polymers that can operate at high temperatures may be the solution to energy storage and power conversion in electric vehicles and other high temperature applications, according to a team of Penn State engineers.

Samsung cuts Intel's semiconductor sales lead to 16% in second quarter

08/06/2015  Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

Intel to collaborate with Georgia Tech

08/05/2015  Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

MEMS Industry Group Conference Asia explores MEMS and sensors opportunities in global IoT

08/04/2015  MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.

Microchip Technology completes acquisition of Micrel

08/04/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

ON Semiconductor introduces new ICs for next generation auto designs

08/03/2015  ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

OMRON to acquire motion control company, Delta Tau Data Systems, Inc.

08/03/2015  OMRON Corporation announced its entry into a stock purchase agreement to acquire a 100 percent stake in Delta Tau Data Systems, Inc. of California (DT), which will result in DT becoming a member of the OMRON Group.

Mid-year global semiconductor sales ahead of last year's pace by 4 percent

08/03/2015  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014.

IBM launches new Internet of Things community for developers

07/29/2015  IBM today announced the launch of a new community, IBM developerWorks Recipes, designed to help developers – from novice to experienced – quickly and easily learn how to connect Internet of Things (IoT) devices to the cloud and how to use data coming from those connected devices.

Tsunami of M&A deals underway in the semiconductor industry in 2015

07/29/2015  Marketshare expansion, Internet of Things opportunities, rising costs of R&D, and China’s aggressive new focus on the semiconductor industry all driving the recent M&A surge.

Short wavelength plasmons observed in nanotubes

07/28/2015  A team of researchers with Berkeley Lab's Materials Sciences Division, working at the Advanced Light Source (ALS), has generated and detected plasmons that boast one of the strongest confinement factors ever: the plasmon wavelength is only one hundredth of the free-space photon wavelength.

Opportunities in packaging are driving photolithography equipment demand

07/27/2015  Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

Penn researchers discover new chiral property of silicon, with photonic applications

07/24/2015  By encoding information in photons via their spin, "photonic" computers could be orders of magnitude faster and efficient than their current-day counterparts. Likewise, encoding information in the spin of electrons, rather than just their quantity, could make "spintronic" computers with similar advantages.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015