Thinner wafers are fostering the growth and emergence of new dicing technologies

09/06/2016  Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.

Top 4 drivers leading to the growth of the RF IC market

09/02/2016  Technavio analysts forecast the global radio frequency (RF) IC market to grow at a CAGR of nearly 12% during the forecast period, according to their latest report.

Iowa State engineers treat printed graphene with lasers to enable paper electronics

09/02/2016  Iowa State engineers have led development of a laser-treatment process that allows them to use printed graphene for electric circuits and electrodes -- even on paper and other fragile surfaces. The technology could lead to many real-world, low-cost applications for printed graphene electronics, including sensors, fuel cells and medical devices.

Memory for future wearable electronics

09/02/2016  Stretchable, flexible, reliable memory device inspired by the brain.

MCU market forecast to reach record high revenues through 2020

08/30/2016  After recent years of price erosion, MCU ASPs are forecast to rise and help lift sales to new highs.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Global MEMS market to grow at a CAGR of close to 12% until 2020

08/26/2016  According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

S. Korean University employs Advanced Vacuum plasma systems in nanotechnology research

08/24/2016  A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Full program for SEMI European MEMS Summit announced

08/24/2016  Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.

North American semiconductor equipment industry posts July 2016 book-to-bill ratio of 1.05

08/24/2016  North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05.

Longtime SRC researcher Pradeep Lall wins NSF Award

08/23/2016  Pradeep Lall, John and Anne MacFarlane professor of mechanical engineering, has received a top award from the National Science Foundation’s Industry/University Cooperative Research Centers program.

Automotive MEMS market to thrive; China and India project lucrative growth

08/22/2016  A few major brands in the automotive MEMS market witnessed a regulatory blow in 2014-15, resulting in passive market dynamics. However, the market has recovered rapidly and is currently growing at a significant pace, according to new research recently published by Future Market Insights.

Natural scale caterpillar soft robot is powered and controlled with light

08/18/2016  Researchers at the Faculty of Physics at the University of Warsaw, using the liquid crystal elastomer technology, originally developed in the LENS Institute in Florence, demonstrated a bioinspired micro-robot capable of mimicking caterpillar gaits in natural scale.

Global silicon photonics market to grow at a CAGR of over 48% through 2020

08/18/2016  Technavio analysts forecast the global silicon photonics market to grow at an impressive CAGR of over 48% during the forecast period, according to their latest report.

Tokyo Electron Limited joins Semiconductor Research Corporation

08/16/2016  Semiconductor Research Corporation today announced that Tokyo Electron Limited has joined SRC's Nanomanufacturing Materials and Processes initiative.

Ensuring safety in the sub-fab

08/16/2016  Problems frequently arise as a result of an incomplete or absent formal risk assessment when processes are modified or new materials introduced.

imec orders etch and deposition systems from Plasma-Therm

08/12/2016  A major research institution has placed orders for two Advanced Vacuum plasma processing systems that will provide etch and deposition capabilities to be used in nanoelectronics research and development.

Cypress names Hassane El-Khoury as next CEO

08/11/2016  Cypress Semiconductor Corporation today announced that Hassane El-Khoury has been named its president, chief executive officer, and a member of its board of directors.

As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

MEMS & Sensors Industry Group Conference Asia explores MEMS, sensors in IoT of today and tomorrow

08/08/2016  MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.



Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
Enabling The Future Of Information Technology Without Moore’s Law Scaling

November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.

Sponsored By:
More Webcasts


New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers


Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017