MEMS

MEMS ARTICLES



NUS scientists develop novel chip for fast and accurate disease detection at low cost

03/29/2018  Innovative microfluidic chip uses only standard lab microscope to spot nano-biomolecules without any fluorescent labels.

Optoelectronics, sensors/actuators, and discretes hit record-high sales

03/29/2018  Total revenues in the three O-S-D market segments climbed 11% in 2017 -- the strongest growth rate since 2010 -- and continue to be driven by high demand for sensors, actuators, CMOS imaging devices, light sensors, laser transmitters, and power discretes.

Smaller and faster: The terahertz computer chip is now within reach

03/28/2018  Hebrew university researcher shows proof of concept for nanotechnology that will make computers run 100 times faster.

Synopsys acquires Silicon and Beyond Private Limited

03/22/2018  Synopsys, Inc. today announced it has acquired Silicon and Beyond Private Limited, a provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

Golden touch: Next-gen optical disk to solve data storage challenge

03/22/2018  New technology offer cost-efficient and sustainable solution to global data storage challenge, while enabling the pivot from Big Data to Long Data and opening new realms of scientific discovery.

High-performance, cost-effective, thin-film solar cell technology provides an attractive source of portable and mobile power

03/22/2018  Magnolia Optical Technology, Inc. announced that it is working with the Defense Advanced Research Projects Agency (DARPA) under the Phase II SBIR Program for Development of High-Performance Thin-Film Solar Cells for Portable Power Applications.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

CEA shows path to creating building blocks of quantum processors

03/20/2018  CEA-Leti, a French technology research institute of the CEA and Inac, a joint fundamental research institute between the CEA and the University Grenoble Alpes, today announced a breakthrough towards large-scale fabrication of quantum bits, or qubits, the elementary bricks of future quantum processors.

GLOBALFOUNDRIES launches RF ecosystem program to accelerate time-to-market for wireless connectivity, radar and 5G applications

03/20/2018  GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFWave, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.

The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Synopsys and industry technologists to address the path to 2nm SoC design

03/16/2018  Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.

Imec honors Qualcomm founder Irwin M. Jacobs with Lifetime of Innovation Award

03/14/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, today presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm.

EV Group and IBM sign license agreement on laser debonding technology

03/14/2018  IBM's Hybrid Laser Release Process technology complements EV Group's low-temperature laser debonding equipment and process portfolio designed to enable highly flexible, high-throughput solution.

Researchers develop spectroscopic thermometer for nanomaterials

03/13/2018  A scientific team led by the Department of Energy's Oak Ridge National Laboratory has found a new way to take the local temperature of a material from an area about a billionth of a meter wide, or approximately 100,000 times thinner than a human hair.

Micron appoints Raj Talluri as senior vice president and general manager of Mobile Business Unit

03/13/2018  Micron Technology Inc. announced today that the company has appointed Raj Talluri as senior vice president and general manager of the Mobile Business Unit.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Breakthrough in circuit design makes electronics more resistant to damage and defects

03/12/2018  A newly published paper in Nature Electronics details how researchers at the Advanced Science Research Center, GC/CUNY, used an array of nonlinear resonators to overcome signal disruption when electronic circuits are broken or damaged.

Scientists develop new tool for imprinting biochips

03/09/2018  The new technology could allow researchers to fit more biochemical probes onto a single biochip and reduce the cost of screening and analyzing changes associated with disease development, detecting bioterrorism agents, and other areas of research.

A universally profitable renewable energy business model

03/08/2018  The solar energy sector shined in a global renewable energy market that maintained steady growth last year despite the United States’ shocking withdrawal from the Paris Agreement. Solar panel costs dropped to an all-time low, driving global demand that surpassed the 100GW mark for the first time on the strength of standout annual 26 percent growth.




TWITTER


WEBCASTS



Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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VIDEOS