10/04/2016 STMicroelectronics and WiTricity, an industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer.
10/04/2016 The five-year collaboration will include, but is not limited to, joint development and implementation of IoT and 5G based Smart ICT solutions for the EU and Taiwan, and scientific information exchanges.
10/04/2016 imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.
10/03/2016 Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).
10/03/2016 STMicroelectronics (NYSE: STM) today revealed its contributions to an intelligent toothbrush system from Oral-B.
10/03/2016 Leti, an institute of CEA Tech, announced today it has joined the Stanford SystemX Alliance, a network of 100 renowned Stanford University professors and 27 world-class companies, joining forces in a pre-competitive environment to define tomorrow's research strategies.
09/30/2016 Cypress Semiconductor Corp. (Nasdaq: CY) and Hackster today announced a global design competition that gives engineers the opportunity to prototype their innovative ideas that sense the world around us for use in the growing Internet of Things (IoT) market, home appliances, and consumer and industrial applications.
09/27/2016 SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.
09/27/2016 The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.
09/26/2016 The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.
09/26/2016 MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.
09/26/2016 EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.
09/23/2016 For the first time, the NIST researchers have measured the transfer of motion through the contacting parts of a microelectromechanical system at nanometer and microradian scales.
09/22/2016 Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.
09/21/2016 Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.
09/21/2016 EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.
09/21/2016 Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.
09/21/2016 The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.
09/19/2016 As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.
09/16/2016 Thorlabs has expanded its piezoelectric line to include new types of piezoelectric actuators, low‐voltage piezoelectric chips, and discrete stacks with through holes, enabling a higher level of flexibility when integrating the actuators into other devices.
December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,