MEMS

MEMS ARTICLES



SEMI member delegation to visit Vietnamese Central Government and High-Tech Parks in Hanoi

07/23/2015  After two Semiconductor Strategy Symposiums in Ho Chi Minh City in 2013 and 2014, SEMI announced today that a SEMI Member Delegation will visit the Vietnamese Central Government in Hanoi on September 21-24.

More efficient process to produce graphene developed by Ben-Gurion University researchers

07/23/2015  Ben-Gurion University of the Negev (BGU) and University of Western Australia researchers have developed a new process to develop few-layer graphene for use in energy storage and other material applications that is faster, potentially scalable and surmounts some of the current graphene production limitations.

ROHM Semiconductor acquires Powervation

07/23/2015  ROHM Co., Ltd., a developer of analog power IC solutions, announced today that it has completed the acquisition of Powervation Ltd., a privately held digital power IC company that develops Digital Power Management system-on-chip (SoC) solutions.

SIA commends launch of Congressional Semiconductor Caucus

07/22/2015  SIA recognized members of the caucus at a reception on Capitol Hill Tuesday evening and honored the caucus's co-chairs, Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.).

North American semiconductor equipment industry posts June 2015 book-to-bill ratio

07/22/2015  North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders worldwide in June 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the June EMDS Book-to-Bill Report published today by SEMI

Dr. Gary Patton joins The ConFab Advisory Board

07/21/2015  Solid State Technology today announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab.

Got MEMS? Get In Touch With memsstar For Production Equipment

07/17/2015  As you might guess from the company’s name, memsstar is involved in microelectromechanical system (MEMS) devices. The company offers manufacturing equipment for “MEMS-specific production,” says CEO Tony McKie.

Tanaka Precious Metals Is Big in Bonding Wires, Other Products

07/17/2015  Tanaka Precious Metals, a company dating back to 1885, is a leading supplier of gold bonding wire and other types of bonding wire for semiconductor packaging. It also specializes in electroplating equipment, unveiling a new system for research and development applications at SEMICON West 2015.

Wearable systems give major boost to total IoT sales in 2015

07/16/2015  Market revenues associated with network communications, sensing, and control functions in subsystems and objects attached to the Internet of Things (IoT) are forecast to grow 29% in 2015 to $62.4 billion after increasing 21% in 2014 to about $48.4 billion.

International Consortium Sets Up Shop for Advanced Manufacturing Research

07/16/2015  A metropolitan area in the center of the state is putting together a public-private partnership to attract high-tech companies, convincing them to set up shop and create jobs. Part of the attraction is a big public university, engaging in advanced research.

SEMI Standards leaders honored at SEMICON West 2015

07/15/2015  SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.

Low-Cost Manufacturing of Flexible Functionalities

07/15/2015  FlexTech Alliance updates on substrates, processes, and devices.

Gases: Completely Necessary to Semiconductor Manufacturing

07/15/2015  Silicon wafers. Semiconductor packaging. These are commonly known products in materials for manufacturing and assembling microchips. Process gases? Not as familiar a commodity, yet they are just as critical to semiconductor manufacturing.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

07/14/2015  Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

CoorsTek Increases its Business with Covalent Acquisition, Organic Growth

07/14/2015  CoorsTek made one of the biggest acquisitions of its century-long history late last year in purchasing Covalent Materials, formerly known as Toshiba Ceramics.

Technologies for Advanced Systems Shown at IMEC Tech Forum USA

07/14/2015  R&D summarized of the nanoscale building blocks for our fab future.

SEMI announces results of board elections and leadership appointments

07/14/2015  SEMI today announced that Stephen S. Schwartz, CEO of Brooks Automation, and Toshikazu Umatate, senior vice president and general manager of the Semiconductor Lithography Business at Nikon Corporation, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

SEMI forecasts three years of growth in chip equipment spending

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

Blood and tears at DAC

07/14/2015  At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

Graphene-based film can be used for efficient cooling of electronics

07/10/2015  Researchers at Chalmers University of Technology have developed a method for efficiently cooling electronics using graphene-based film.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015