MEMS

MEMS ARTICLES



A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

ESD Alliance reports EDA industry revenue increase for Q3 2016

12/23/2016  The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 7.0 percent for Q3 2016.

Sensor sensation

12/22/2016  OIST researchers create a novel sensor capable of measuring both charge and mass of biomolecules with potential applications in healthcare diagnostics.

Advance in intense pulsed light sintering opens door to improved electronics manufacturing

12/22/2016  Faster production of advanced, flexible electronics is among the potential benefits of a discovery by researchers at Oregon State University's College of Engineering.

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/22/2016  Mentor Graphics Corp. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Advances in artificial intelligence, IoT highlight IHS Markit's global technology predictions for 2017

12/21/2016  From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth.

STMicroelectronics and Valencell announce collaboration on biometric sensor platform for wearables and IoT

12/20/2016  New scalable development kit integrates ST SensorTile with Valencell's Benchmark biometric sensor system to accelerate smart wearable and IoT product development.

62 new facilities start operation 2017 and beyond

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

World's smallest radio receiver has building blocks the size of 2 atoms

12/16/2016  Researchers from the Harvard John A. Paulson School of Engineering and Applied Sciences have made the world's smallest radio receiver - built out of an assembly of atomic-scale defects in pink diamonds.

NIST device for detecting subatomic-scale motion may aid robotics, homeland security

12/16/2016  Highly sensitive measuring tool can also be mass-produced.

Linde Korea acquires Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business

12/15/2016  Linde Korea, a member of The Linde Group, today announced that it has completed the takeover of Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business in South Korea.

Imec and Holst Centre introduce world's first solid-state multi-ion sensor for IoT applications

12/13/2016  At last week's IEEE International Electron Devices Meeting (IEDM) in San Francisco (USA), imec, the world-leading research and innovation hub in nano-electronics and digital technology and Holst Centre debuted a miniaturized sensor that simultaneously determines pH and chloride (Cl-)levels in fluid.

Outfitting the future

12/12/2016  Wearable technology is about more than smartwatches or counting steps. Across North Carolina State University, researchers are using it to solve problems — monitoring heart rate and environmental dangers, powering electronic devices, delivering medications, building better prosthetics and improving safety.

Stamping technique creates tiny circuits with electronic ink

12/09/2016  New stamping technique creates functional features at nanoscale dimensions.

State of the art sensors made from graphene and children's toy silly putty

12/09/2016  World-first graphene innovation could be used for applications in medical devices and diagnostics.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

12/07/2016  EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

Leti shows memristive devices can mimic different kind of synaptic plasticity inspired by biology

12/07/2016  Presented at IEDM 2016, breakthrough suggests path to embedding neuromorphic learning in low-power devices that could enable autonomous systems.

Imec demonstrates record tunneling magnetoresistance for one of the world's smallest perpendicular magnetic tunnel junctions

12/06/2016  At the 2016 IEEE International Electron Devices Meeting, in a special poster session on MRAM, world-leading research and innovation hub for nano-electronics and digital technology imec presented a 8nm p-MTJ device with 100 percent tunnel magnetoresistance (TMR) and coercive field as high 1500Oe.




TWITTER


WEBCASTS



Internet of Things

February 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS