Close to the edge: Brain-inspired technologies will bring data processing and analytics to Internet of Things devices

02/13/2018  CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".

Frank Shemansky to lead SEMI's MEMS & Sensors Industry Group

02/13/2018  SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

MagnaChip offers 2nd-generation 0.13 micron BCD process technology with high-density embedded flash memory

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

Imec introduces CMOS chip with 16,384 micro-electrodes and 1,024 channels for multimodal cell interfacing

02/12/2018  Breakthrough for high-throughput cell assays and characterization of complex cell behavior and interaction.

Today's highest quality composite-piezoelectric developed at NUST MISIS

02/12/2018  NUST MISIS scientists jointly with an international group of scientists have managed to develop a composite material that has the best piezoelectric properties today. The research results were published in Scientific Reports journal.

Leti Chief Scientist Barbara De Salvo to deliver opening day talk on brain-inspired technologies at ISSCC 2018

02/08/2018  Delivering a keynote talk during the Feb. 12 plenary session that formally opens the conference, De Salvo will note that the architecture will include human-brain inspired hardware coupled to new computing paradigms and algorithms that "will allow for distributed intelligence over the whole IoT network, all-the-way down to ultralow-power end-devices."

A billion devices from SiTime empower self-driving cars, mobile phones, and everything in between

02/07/2018  SiTime Corporation, a developer of MEMS timing devices, announced today that it has shipped cumulatively over 1 billion timing devices.

Biosensors will be inexpensive, do more, go everywhere

02/07/2018  University of Cincinnati engineering professor Jason Heikenfeld maps the progress and untapped potential of wearable sensors in a critical review of the research field.

MACOM and STMicroelectronics to bring GaN on silicon to mainstream RF markets and applications

02/07/2018  MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs

02/06/2018  Texas Instruments (TI) today introduced the industry's smallest operational amplifier (op amp) and low-power comparators at 0.64 mm2.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

Measuring the temperature of two-dimensional materials at the atomic level

02/05/2018  Researchers at the University of Illinois at Chicago describe a new technique for precisely measuring the temperature and behavior of new two-dimensional materials that will allow engineers to design smaller and faster microprocessors.

IHS Markit identifies top trends driving the Internet of Things in 2018 and beyond

02/02/2018  Driven by the need for intelligent connected devices in industrial and commercial applications, the number of connected Internet of Things (IoT) devices globally will grow to more than 31 billion in 2018, according to new analysis from business information provider IHS Markit

Mobile system-on-chip designs, embedded processing lift MPU market

02/01/2018  Though accounting for less than half of total MPU sales, data-handling cellphones, tablets, and MPUs for embedded processing applications to keep MPU market active through 2022.

Smart manufacturing fuels digital transformation: Takeaways from SEMI Member Forum

02/01/2018  Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

Engineers design artificial synapse for "brain-on-a-chip" hardware

02/01/2018  Design is major stepping stone toward portable artificial-intelligence devices.

ST technologies help Neonode add touch interaction to any object, surface, or space

01/31/2018  Silicon chips from STMicroelectronics have enabled new zForce AIR touch-sensing modules from Neonode, the optical sensor technology company.

Leti develops lens-free, point-of-care system for diagnosing spinal meningitis

01/30/2018  Leti, a research institute at CEA Tech, has invented a lens-free microscope technology that provides point-of-care diagnosis for spinal meningitis. Outlined in a paper presented at Photonics West, the new technology provides immediate results and eliminates errors in counting white blood cells (leukocytes) in cerebrospinal fluid, which is required to diagnose the infection.

Researchers boost efficiency and stability of optical rectennas

01/29/2018  The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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