MEMS

MEMS ARTICLES



Understanding breakups

01/30/2017  A new model describing the deformation and breakup of droplets could help improve nanoscale printing and spraying.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

ams announces completion of transaction to acquire Heptagon

01/25/2017  ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

Vital Control in Fab Materials Supply-Chains

01/25/2017  Expert panel discussion at Critical Materials Council (CMC) conference.

ISS Europe 2017: European innovation leadership

01/24/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

New report from IHS Markit names top four trends driving the IoT in 2017 and beyond

01/24/2017  Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit.

New low-cost technique converts bulk alloys to oxide nanowires

01/20/2017  A simple technique for producing oxide nanowires directly from bulk materials could dramatically lower the cost of producing the one-dimensional (1D) nanostructures.

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

01/20/2017  Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

ams launches world’s first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology

01/17/2017  ams AG today launched the world's first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial applications.

HID Global predicts top trends for 2017 in the identity technology industry

01/11/2017  Shift in the use of trusted identities fuels broader adoption of mobile and advanced smart card technology, a greater emphasis on the Cloud and emerging IoT use cases.

STMicroelectronics incorporates CWS’ SiPEX in the RF PDK H9 SOI FEM

01/11/2017  Coupling Wave Solutions, S.A. and STMicroelectronics today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs

NIST physicists 'squeeze' light to cool microscopic drum below quantum limit

01/11/2017  Physicists at the National Institute of Standards and Technology (NIST) have cooled a mechanical object to a temperature lower than previously thought possible, below the so-called "quantum limit."

Researchers create practical and versatile microscopic optomechanical device

01/09/2017  Trapping light and mechanical waves within a tiny bullseye, design could enable more sensitive motion detection.

Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

01/06/2017  Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

imec collaborates with City of Antwerp and Flanders to establish Smart City Living Lab

01/06/2017  How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Living Lab in which businesses, researchers, local residents and the city itself will experiment with smart technologies that aim to make urban life more pleasant, enjoyable and sustainable.

Vesper and DSP Group demo near-zero-power voice-activation for battery-powered devices at CES 2017

01/05/2017  Vesper, DSP Group and Sensory will demonstrate their new development platform from January 5-8, 2017 during CES 2017.

Intel to acquire 15% ownership of HERE

01/04/2017  Intel has agreed to purchase a 15 percent ownership stake in HERE, a global provider of digital maps and location-based services, from HERE’s current indirect shareholders.

Bosch launches smallest high performance barometric pressure sensor at CES 2017

01/04/2017  Today, Bosch Sensortec launches the BMP380, the company's smallest and best performing barometric pressure sensor, with a compact size of only 2.0 x 2.0 x 0.75 mm3.

Gartner forecasts flat worldwide device shipments until 2018

01/04/2017  Emerging devices can enhance conventional device sales.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS