MEMS

MEMS ARTICLES



Another record year for silicon wafer shipment volumes in 2015

02/10/2016  Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

58% of pure-play foundry capacity under high risk for seismic activity

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

Call for Papers issued for SEMICON Russia

02/08/2016  SEMICON Russia 2016 on 7-9 June will provide insights into market developments, technology, and business opportunities, short and long-term.

The iron stepping stones to better wearable tech without semiconductors

02/05/2016  The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

Researchers develop hack-proof RFID chips

02/04/2016  New technology could secure credit cards, key cards, and pallets of goods in warehouses.

Cautious expectations amid a slow-growth global economy

02/04/2016  The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

Gartner says worldwide wearable devices sales to grow 18.4 percent in 2016

02/03/2016  Gartner, Inc. forecasts that 274.6 million wearable electronic devices will be sold worldwide in 2016, an increase of 18.4 percent from 232.0 million units in 2015.

Apple products are driving market growth for MEMS microphones

02/03/2016  The popularity of Apple’s iPhone 6S and other products is boosting the microelectromechanical-systems (MEMS) microphones market to a compound annual growth rate (CAGR) of 11 percent from 2015 to 2019.

Self-calibrated 10 Mbit/s phase modulator exceeds state-of-the-art performance

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a self-calibrated high-speed (10Mbits/s) phase modulator achieving an excellent Error Vector Magnitude (EVM) of -37dB at 10.25 GHz.

Imec and Vrije Universiteit Brussel present small, low-cost, low-power chip for multi-gigabit 60GHz communication

02/03/2016  At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a four-antenna path beamforming transceiver for 60GHz multi Gb/s communication in 28nm CMOS technology.

Global semiconductor sales top $335B in 2015

02/01/2016  The Semiconductor Industry Association (SIA) today announced the global semiconductor industry posted sales totaling $335.2 billion in 2015, a slight decrease of 0.2 percent compared to the 2014 total, which was the industry's highest-ever sales total.

Foundries takeover 200mm fab capacity by 2018

02/01/2016  IoT drives worldwide 200mm fab capacity in 2018 back to 2006 levels.

Growing application of semiconductor ICs in the IoT driving global packaging and assembly equipment market

01/28/2016  Technavio analysts forecast the global semiconductor packaging and assembly equipment market to post a CAGR of 4.7% by 2020, according to their latest report.

A step towards keeping up with Moore's Law

01/28/2016  POSTECH researchers develop a novel and efficient fabrication technology for cross-shaped memristor.

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99

01/27/2016  A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

China semiconductor acquisitions surge; SEMICON China brings the new market into focus

01/26/2016  During SEMICON China 2016 on March 15-17 in Shanghai, key government decision makers, IC fund managers, and global industry analysts will share their insights on China's IC manufacturing policy.

Two in five wearable devices will be enabled for wireless charging by 2020

01/26/2016  The wearable technology market continues to rapidly expand, driving more than $40 billion in revenue by 2020.

SEMICON Korea opening: Memory and mobility drive IC manufacturing

01/26/2016  SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees.

Led by iPhone 6S, sensor hubs market is growing fast

01/25/2016  The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.

Fingerprint sensor market growth continues upward trajectory

01/25/2016  Led by Apple’s iPhone juggernaut, unit shipments of fingerprint sensors were expected to have grown from 316 million in 2014 to 499 million in 2015 and will continue to increase each year to peak at 1.6 billion in 2020




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS