MEMS

MEMS ARTICLES



Consumer, healthcare, and industrial to drive wearable industry to potential value of $90B by 2020

07/01/2015  Wearable electronics is one of the consumer market’s hottest topics. Indeed, giants like Apple, Samsung, Xiaomi, and Huawei are now competing for a slice of a very promising pie.

MEMS foundry X-FAB selects ClassOne Solstice for electroplating

07/01/2015  Semiconductor equipment manufacturer ClassOne Technology announced that X-FAB — recently named “MEMS Foundry of the Year” — has just purchased a new Solstice S8 Electroplating System.

SPP Technologies to acquire SPTS Technologies' Thermal Products business

07/01/2015  ORBOTECH LTD. today announced that SPTS Technologies Group Ltd. (SPTS), an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co, Ltd.

SEMI and Solid State Technology announce the 2015 “Best of West” Award finalists

06/30/2015  The award was established to recognize new products moving the industry forward with technological developments in the microelectronics supply chain.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.

Taiwan tops fab spending - Driving anticipation for SEMICON Taiwan 2015

06/29/2015  In 2015,Taiwan is projected to have the highest capex for semiconductor manufacturing worldwide.

Opening a new route to photonics

06/29/2015  A new route to ultrahigh density, ultracompact integrated photonic circuitry has been discovered by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California (UC) Berkeley.

Photolithography equipment & materials market is attracting new players, but success is not guaranteed

06/29/2015  Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex roadmaps.

Solid State Watch: June 19-25, 2015

06/26/2015  IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future

“What’s next?” ─ Advances in technology at SEMICON West 2015

06/25/2015  The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

Toward tiny, solar-powered sensors

06/24/2015  Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

06/23/2015  Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

MEMS applications take the stage in the first edition of the European MEMS Summit

06/22/2015  The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

Bosch selects Rudolph for semiconductor inspection solutions

06/22/2015  Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

3DIC Technology Drivers and Roadmaps

06/22/2015  Circuit performance and silicon area improvements seen in new die stacks.

IHS says Moore's Law led to trillions of dollars added to global economy

06/19/2015  From connectivity to globalization and sustainability, the “Law” created by Gordon Moore’s prediction for the pace of semiconductor technology advances has set the stage for global technology innovation and contribution for 50 years.

North American semiconductor equipment industry posts May 2015 book-to-bill ratio of 0.99

06/18/2015  North America-based manufacturers of semiconductor equipment posted $1.56 billion in orders worldwide in May 2015 (three-month average basis) and a book-to-bill ratio of 0.99.

Organ-on-a-chip technology helps researchers better understand pregnancy

06/18/2015  National Institutes of Health (NIH) researchers and their colleagues have developed a "placenta-on-a-chip" to study the inner workings of the human placenta and its role in pregnancy.

Researchers create transparent, stretchable conductors using nano-accordion structure

06/18/2015  Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.




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TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015