Europe's secondary industry in the spotlight

09/22/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

Microcontroller market growth tied to IoT applications, IHS

09/22/2015  The market for microcontroller units (MCUs) used in Internet of things (IoT) applications is on the rise, which is having a positive effect on overall MCU market growth.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.

TSMC Moves from 16nm to 10nm to 7nm

09/21/2015  While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

Alcatel-Lucent acquires Mformation

09/18/2015  Alcatel-Lucent has announced the acquisition of Mformation, a leading provider of mobile and "Internet of Things" security and device management solutions for mobile operators, service providers and enterprises. Terms of the deal were not disclosed.

S3S - the conference for IoT technologies

09/18/2015  The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

TSMC Forum Emphasizes Industry Collaboration

09/17/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

New motion sensor from STMicroelectronics enhances user interface and image stabilization in smartphones and tablets

09/17/2015  STMicroelectronics has introduced a six-axis motion-sensing device fully supporting image stabilization in smartphones, tablets, and digital still cameras.

Leti demos MEMS fabrication on its 300mm line, pointing the way to lower manufacturing costs

09/17/2015  CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

GE creates GE Digital

09/17/2015  GE announced the creation of GE Digital, a move that brings together all of the digital capabilities from across the company into one organization.

$81 million to support new National Nanotechnology Coordinated Infrastructure

09/17/2015  To advance research in nanoscale science, engineering and technology, the National Science Foundation (NSF) will provide a total of $81 million over five years to support 16 sites and a coordinating office as part of a new National Nanotechnology Coordinated Infrastructure (NNCI).

OMRON to Acquire U.S. based Adept Technology

09/16/2015  OMRON Corporation and Adept Technology, Inc. today announced that the two companies have entered into an agreement whereby OMRON will acquire Adept.

2015 International Conference on Planarization/CMP Technology (ICPT 2015)

09/16/2015  September 30 - October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA. ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies.

IBM Launches Internet of Things and Education Business Units

09/14/2015  IBM announced two new business units that will apply the company's considerable knowledge in Big Data, advanced analytics and cognitive computing to the Internet of Things (IOT) and Educations markets.

Qualcomm Acquires Capsule Technologie

09/14/2015  Qualcomm Incorporated today announced that its subsidiary, Qualcomm Life, Inc., has acquired Capsule Technologie.

ClassOne Technology names Kevin Witt Chief Technology Officer

09/09/2015  Semiconductor equipment manufacturer ClassOne Technology has today announced the appointment of Kevin Witt to the position of Chief Technology Officer.

Semiconductor Research Corporation expands benchmarking research program

09/09/2015  Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research.

Key industry leaders join The ConFab Advisory Board

09/04/2015  Solid State Technology is thrilled to announce that several key industry leaders have joined the Advisory Board for its annual conference and networking event, The ConFab.

Global semiconductor sales down slightly in July

09/04/2015  Softening demand, currency devaluation lead to slower sales.

The future of MEMS in the IoT

09/03/2015  SEMI’s European MEMS Summit will be held on 17-18 September 2015 in Milan, Italy. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015