ams launches the industry's smallest module to offer color, ambient light and proximity sensing

08/02/2016  ams AG has launched the smallest ever optical sensor module that delivers a combination of colour (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

Global semiconductor sales increase in second quarter

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.

Top MEMS sensor suppliers of 2015

08/02/2016  Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.

STMicroelectronics earns MEMS Manufacturer of the Year Award

08/01/2016  STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.

Analog Devices and Linear Technology to merge

07/29/2016  Analog Devices, Inc. (NASDAQ: ADI) and Linear Technology Corporation (NASDAQ: LLTC) this week announced that they have entered into a definitive agreement under which Analog Devices will acquire Linear Technology in a cash and stock transaction that values the combined enterprise at approximately $30 billion.

Scientists find a way of acquiring graphene-like films from salts to boost nanoelectronics

07/29/2016  Physicists use supercomputers to find a way of making 'imitation graphene' from salt.

STMicroelectronics acquires ams' NFC and RFID reader assets

07/29/2016  STMicroelectronics today announced that it has acquired ams' assets related to NFC1 and RFID2 reader business

Busch to open a new service center in Austin, Texas

07/28/2016  Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.

Why are some MEMS devices successful while others are not?

07/28/2016  Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.

Sustainable sensors to detect, predict muscle fatigue

07/28/2016  A new study published in the ECS Journal of Solid State Science and Technology aims to take advantage of sweat's trove of medical information through the development of a sustainable, wearable sensor to detect lactate levels in your perspiration.

A*STAR'S IME kicks off consortia to develop packaging solutions for IoT applications

07/26/2016  Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

Registration open with new exhibition features at SEMICON Europa

07/22/2016  Today SEMI announced registration opened for Europe's largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble.

Sensor sales keep hitting new records but price erosion curbs growth

07/22/2016  Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

07/21/2016  Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

Research team led by NUS scientists develop plastic flexible magnetic memory device

07/20/2016  Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

STMicroelectronics unveils world's smallest single-chip motor driver

07/19/2016  With the combination of low power consumption and small form factor, the ST's new motor driver plans to contribute to the battery powered IoT device adoption.

Unisem ships 1 billion packaged MEMS devices

07/19/2016  Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

Scientists glimpse inner workings of atomically thin transistors

07/19/2016  With an eye to the next generation of tech gadgetry, a team of physicists at The University of Texas at Austin has had the first-ever glimpse into what happens inside an atomically thin semiconductor device.

Silicon Valley-based foundry Noel Technologies marks 20th Anniversary

07/18/2016  Silicon Valley specialty semiconductor foundry Noel Technologies, a provider of process development and substrate fabrication for a variety of high-technology industries, celebrates its 20th anniversary this month.

Light-trapping 3D solar cells undergo space testing

07/18/2016  A novel three-dimensional solar cell design developed at Georgia Tech will soon get its first testing in space aboard the International Space Station.



Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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SEMICON Europa 2016
Grenoble, France
October 25, 2016 - October 27, 2016
Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017