Metrology

MAGAZINE



METROLOGY ARTICLES



IBM to pay GlobalFoundries $1.5B to take over chip fabs

10/20/2014  IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

Growing momentum in semiconductor manufacturing in Vietnam

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

10/14/2014  India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

Altera CEO John Daane to receive Robert N. Noyce Award

10/08/2014  The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

Boston Semi Equipment creates industry's largest independent ATE organization

10/01/2014  Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

Kurita, SEMATECH partner on wafer surface contamination and cleaning technology in semiconductor processing

09/30/2014  SEMATECH, the global consortium of chipmakers, announced today that Kurita Water Industries Limited has partnered with SEMATECH to develop innovative technologies for low defectivity ultrapure water (UPW) applications used in semiconductor manufacturing.

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HEADLINES

InSilixa raises $13 mln
October 22, 2014

Mueller-BBM Active Noise Control and Sound Design Now Optimized on Cadence Tensilica HiFi Audio/Voice Processors for Automotive Applications
October 22, 2014

Mueller-BBM Active Noise Control and Sound Design Now Optimized on Cadence Tensilica HiFi Audio/Voice Processors for Automotive Applications
October 22, 2014

Broadcom to Webcast Annual Analyst Day on Tuesday, December 9, 2014
October 22, 2014

Ambarella S3 IP Camera SoC Delivers Outstanding 4K Video Quality Using State-of-the-Art H.265/HEVC Encoding; S3 reduces bitrates by up to 50% over Ambarella's current H.264 IP camera SoCs
October 22, 2014

Skyworks Ramps Revolutionary Diversity Receive Modules for LTE Smartphones; Proprietary Solutions Enhance LTE Data Throughput and Deliver Unprecedented Downlink Data Speeds; Leverage New Filter Capability and Systems Expertise;
October 22, 2014

Renesas Electronics Delivers Enhanced User Experience with Integrated Automotive Cockpit Solution; The R-Car E2 SoC Delivers Scalability, Higher Integration and Increased Performance Optimized for Entry-Level Systems
October 22, 2014

Avnet Electronics Marketing Adds "Embedded Brains" to Machine Vision with New Smart Vision Development Kit
October 22, 2014

PointGuard Ventures and Morningside Invest $13M in InSilixa's Semiconductor-Based Molecular Diagnostics Technology; CMOS Biochips Enable High-Performance, Mass-Deployable and Low Cost Products for Point-of-Care DNA Testing
October 22, 2014

Tamba Releases New Ultra-Low Latency Ethernet Cores for Xilinx UltraScale™ 20nm FPGA - Lowest Latency Achieved on an FPGA Device.
October 22, 2014

FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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VIDEOS