Metrology

METROLOGY ARTICLES



North American semiconductor equipment industry posts August 2017 billings 

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Leading-edge paves the way for pure-play foundry growth

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

Samsung Electronics joins Semiconductor Research Corporation on research consortium

09/19/2017  Semiconductor Research Corporation (SRC), today announced that Samsung Electronics Company Ltd. (Samsung), one of the world's largest chipmakers, has signed an agreement to join SRC's research consortium. Samsung will participate in two SRC platforms – the New Science Team (NST) project and the Global Research Collaboration (GRC) program.

IMAPS 2017 to showcase advances in microelectronics technology

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

Semiconductor industry records best second quarter in three years

09/14/2017  Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit.

Josh Shiode joins Semiconductor Industry Association as Government Affairs Director

09/13/2017  In this role, Shiode will help advance the U.S. semiconductor industry’s key legislative and regulatory priorities related to semiconductor research and technology, product security, and high-skilled immigration, among others.

SEMI reports second quarter 2017 worldwide semiconductor equipment figures

09/12/2017  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$14.1 billion for the second quarter of 2017.

KLA-Tencor releases five patterning control systems for sub-7nm IC manufacturing

09/12/2017  KLA-Tencor Corporation today introduced five patterning control systems that help chipmakers achieve the strict process tolerances required for multi-patterning technologies and EUV lithography at the sub-7nm logic and leading-edge memory design nodes.

Fab equipment spending breaking industry records

09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

Rudolph Technologies launches new Truebump technology at SEMICON Taiwan 2017

09/11/2017  The Dragonfly System now features fast, accurate and repeatable 3D bump metrology.

Global semiconductor sales increase 24% year-to-year in July

09/08/2017  Worldwide sales up 3 percent compared to previous month; Americas market leads the way with growth of 36 percent year-to-year and 5 percent month-to month.

Microsemi appoints Richard Beyer to its Board of Directors

09/07/2017  Microsemi Corporation today announced the appointment of Richard M. Beyer to its board of directors.

Securing talent to connect, collaborate and innovate

09/06/2017  Our industry has a significant need for additional workers and several trends are working against us.

Analysis of global lithography metrology equipment market

08/25/2017  The lithography metrology equipment market is riding on the high wave of the semiconductor industry.

North American semiconductor equipment industry posts July 2017 billings

08/23/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

TowerJazz and Tacoma announce a partnership for a new 8-inch fabrication facility in Nanjing, China

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

Covalent Metrology expands into a new facility

08/03/2017  Covalent Metrology announced today that it has consolidated operations in a larger facility located in Santa Clara, CA.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS