Metrology

METROLOGY ARTICLES



North American semiconductor equipment industry posts January 2017 billings

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Brooks Instrument names Mohamed Saleem as new Chief Technology Officer

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

Intel continues to drive semiconductor industry R&D spending

02/16/2017  Among Top-10 R&D spenders, Intel accounted for 36% of R&D outlays.

GlobalFoundries reveals expansion plans

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

Toshiba starts construction of Fab 6 and memory R&D center at Yokkaichi, Japan

02/09/2017  Toshiba Corporation today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

IC market growth limited by narrow window of global GDP expansion

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

SEMICON Korea huge 30th year anniversary event opens today

02/08/2017  SEMICON Korea 2017, opening today at COEX in Seoul, celebrates its 30th anniversary with its largest-ever exhibition.

Annual silicon volume shipments remain at record highs

02/07/2017  Revenues continue to be under pressure.

Samsung and Apple continued to lead as top global semiconductor customers in 2016

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

SEMI 2020: "There are far better things ahead than any we leave behind"

02/01/2017  “Do not go where the path may lead, go instead where there is no path and leave a trail,” was how I started last week’s article. In that article we looked back on 2016 and the incredible progress of the industry and how it continually cuts new trail and keeps moving at the speed of Moore’s Law.

Without technology, China's "MIC 2025" results for ICs likely to fall woefully short of its goals

02/01/2017  IC Insights believes China's self-sufficiency targets for ICs of 40% in 2020 and 70% in 2025 are unrealistic.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

North American semiconductor equipment industry posts December 2016 book-to-bill ratio of 1.06

01/25/2017  This combined with a significant increase in billings puts 2016 equipment sales of North American manufacturers well above 2015 levels and well positioned for 2017.

2015-2016 deals dominate semiconductor M&A ranking

01/20/2017  U.S. companies making acquisitions accounted for more than half of the value in announced transactions in the last two years, while Asia-Pacific represented 23%.

Market for power semiconductors in automotive to rev up by $3B by 2022

01/19/2017  Demand to soar due to big electrification in vehicles.

Fire, rain, and M&A 

01/19/2017  The expert panel, "The Future of M&A in the Semiconductor Industry," was a hot topic at SEMI's Industry Strategy Symposium (ISS) conference on January 11.

$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.




TWITTER


WEBCASTS



Internet of Things

February 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS