Metrology

METROLOGY ARTICLES



New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

04/22/2014  The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

04/11/2014  KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

February semiconductor sales up 11.4 percent compared to last year

04/09/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

04/08/2014  The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

04/07/2014  The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

ON Semiconductor to acquire Trusense Imaging, Inc.

04/03/2014  ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

SEMATECH announces leadership changes

03/31/2014  SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

Silicon Valley specialty foundry Noel Technologies names Joe Medeiros Director of Reclaim

03/27/2014  Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.

Particle Measuring Systems joins SEMATECH

03/26/2014  This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.

Mentor Graphics acquires Berkeley Design Automation

03/21/2014  Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

Equipment bookings and billings continue along a steady trend

03/20/2014  North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award

03/19/2014  Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

First methodology to analyze nanometer line pattern images

03/18/2014  To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference

03/12/2014  The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

SEMI reports 2013 global semiconductor equipment sales of $31.6 billion

03/12/2014  SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

03/11/2014  Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

Semtech Corporation announces the appointment of new Executive VP

03/07/2014  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

Fab equipment spending to increase 20-30% in 2014

03/06/2014  The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Samsung expands its 28nm technology offerings

03/06/2014  Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

University of Minnesota professor recognized for excellence in semiconductor research

03/06/2014  The Semiconductor Industry Association this week presented its University Research Award – in consultation with Semiconductor Research Corporation (SRC) – to University of Minnesota professor Sachin Sapatnekar in recognition of his outstanding contributions to semiconductor research.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014