Metrology

METROLOGY ARTICLES



Semiconductor Industry Association recognizes Senator Mike Crapo, Congressman Peter Roskam with Congressional Leadership Awards

04/20/2018  The Semiconductor Industry Association (SIA) this week presented its Congressional Leadership Awards to Senator Mike Crapo (R-Idaho) and Congressman Peter Roskam (R-Ill.) for their leadership in enacting tax reform legislation, the Tax Cuts and Jobs Act of 2017.

Boston Semi Equipment recognized for excellence by Texas Instruments

04/19/2018  Boston Semi Equipment today announced it is a recipient of the 2017 Texas Instruments Supplier Excellence Award (SEA).

Getting better by design

04/18/2018  With the IC industry now worth over $400 billion in annual revenue, developing a single new chip can cost hundreds of millions of dollars.

Lithography metrology equipment market: High demand for miniaturized electronic devices promotes growth

04/17/2018  Technavio market research analysts forecast the global lithography metrology equipment market to grow at a CAGR of around 8% during the period 2018-2022, according to their latest report.

UnitySC names Kamel Ait-Mahiout as CEO

04/17/2018  UnitySC, a developer of advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer.

SEMI postpones SEMICON Southeast Asia 2018 to avoid Malaysian election conflict

04/13/2018  SEMI today announced postponement of SEMICON Southeast Asia from 8-10 May 2018 to 22-24 May 2018.

Semiconductor leaders' marketshares surge over the past 10 years

04/11/2018  Top 25 companies held more than three-fourths of worldwide semiconductor market.

The 2018 Symposia on VLSI Technology & Circuits covers converging trends in machine learning, artificial intelligence & the IoT

04/09/2018  The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for 'smart living.'

GLOBALFOUNDRIES and Toppan Photomasks extend advanced photomask joint venture in Germany

04/09/2018  GLOBALFOUNDRIES Inc. and Toppan Photomasks, Inc. today announced a multi-year extension to their Advanced Mask Technology Center joint venture in Dresden, Germany.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

SEMI reports 2017 global semiconductor equipment sales of $56.6B

04/05/2018  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $56.6 billion in 2017, a year-over-year increase of 37 percent from 2016 sales of $41.24 billion.

Global semiconductor sales up 21% year-to-year in February

04/03/2018  Americas market grows by nearly 40 percent compared to last year; global sales decrease slightly month-to-month.

With its highest growth rate in 14 years, the global semiconductor industry topped $429B in 2017

03/30/2018  Samsung edged out Intel, to become the new semiconductor industry leader.

More than Moore’s overall wafer demand is driven by the megatrends

03/29/2018  The wafer demand is expected to reach more than 66 million 8-inch eq. wafers by 2023, with an almost 10% CAGR between 2017 and 2023.

ON Semiconductor names 2017 Supplier Award winners

03/28/2018  ON Semiconductor today announced it has recognized 20 companies with supplier excellence awards.

Making the most of color in your multi-patterning layouts

03/28/2018  There are many different situations in which special attention to color choices provide the potential to improve the manufacturing results of multi-patterned masks.

Improving human-data interaction to speed nanomaterials innovation

03/26/2018  New application of data analysis, visualization techniques achieves better representation of multidimensional materials data; Work is part of Lehigh University's initiative to accelerate understanding of materials through improved human-data interaction

Semiconductor Industry Association issues statement on Trump administration Section 301 action on China

03/23/2018  The Semiconductor Industry Association (SIA) today released the following statement from President & CEO John Neuffer in response to the Section 301 action taken by the Trump Administration to address China's trade practices.

North American semiconductor equipment industry posts February 2018 billings

03/23/2018  February billings remain at a level indicating another positive year for semiconductor equipment spending.

Mechanism and improvements of Cu voids under via bottom

03/22/2018  This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning processes. To Improve the Cu loss under via bottom, effective approaches are proposed. The modified actions for via bottom improve not only wafer yield but also reliability of the device.




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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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