SEMI forms Technology Communities to speed industry collaboration and innovation

02/08/2018  SEMI President & CEO Ajit Manocha has formed a new group, Technology Communities, to better collaborate, align, and enhance all of SEMI’s technology-focused activities by operating them under one umbrella.

First Trump State of the Union address: How it stacks up against SEMI public policy priorities

02/07/2018  SEMI evaluates the implications of the SOTU address for Trade, Taxes, Technology, Talent and other SEMI public policy priorities.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

Smart manufacturing fuels digital transformation: Takeaways from SEMI Member Forum

02/01/2018  Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

Largest SEMICON Korea ever highlights smart manufacturing, automotive

01/31/2018  SEMICON Korea 2018 opens at COEX in Seoul today with its largest-ever exhibition and an expected 50,000 attendees at the premier event for the Korean semiconductor and electronics manufacturing supply chain.

Mike Noonen joins efabless' Advisory Board

01/30/2018  efabless corporation, the world's first crowd sourcing platform for electronics solutions, today announced Mike Noonen joined its advisory board.

Researchers boost efficiency and stability of optical rectennas

01/29/2018  The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor

Electronics manufacturing in critical need of new talent

01/29/2018  SEMI, the global industry association representing the electronics manufacturing supply chain, today announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent.

Lam Research promotes Tim Archer to president

01/26/2018  Martin Anstice will remain Chief Executive Officer.

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

Year End Wow!

01/24/2018  2017 ended on a high note from an end market perspective.

North American semiconductor equipment industry posts December 2017 billings

01/24/2018  The billings figure is 16.3 percent higher than the final November 2017 level of $2.05 billion, and is 27.7 percent higher than the December 2016 billings level of $1.87 billion.

Worldwide semiconductor revenue forecast to grow 7.5% in 2018

01/22/2018  Worldwide semiconductor revenue is forecast to total $451 billion in 2018, an increase of 7.5 percent from $419 billion in 2017, according to Gartner, Inc.

ISS Europe to spotlight key chip industry issue of workforce development 

01/22/2018  Qualified workers key to Europe's competitive advantage in global supply chain.

Qualcomm receives authorization from the European Commission and Korea Fair Trade Commission for NXP Semiconductors acquisition

01/19/2018  Qualcomm Incorporated today announced that the European Commission and the Korea Fair Trade Commission authorized the acquisition by Qualcomm River Holdings B.V. of NXP Semiconductors N.V.

Silicon photonics has reached its tipping point

01/19/2018  Silicon photonics is still a small market today, with sales at die level estimated to be US$30 million in 2016. However, it has big promise, with a 2025 market value of US$560 million at chip level and almost US$4 billion at transceiver level.

Value of semiconductor industry M&A deals slows dramatically in 2017

01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

SkyWater Technology Foundry appoints Steve Wold as Chief Financial Officer

01/18/2018  SkyWater Technology Foundry, the industry's most advanced U.S.-based and U.S.-owned trusted foundry, announced today that it has appointed Steve Wold as Chief Financial Officer.

Korea is at full throttle on memory investments

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

Littelfuse completes acquisition of IXYS Corporation

01/17/2018  Littelfuse, Inc. today announced the completion of its acquisition of IXYS Corporation.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

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Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
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