Metrology

METROLOGY ARTICLES



Process Watch: Fab managers don’t like surprises

12/18/2014  Nobody likes surprises - especially the managers of $10 billion factories.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Global Semiconductor Alliance announces 2014 Award recipients

12/12/2014  GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

John Neuffer named president and CEO of SIA

12/11/2014  The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

Lattice Semiconductor announces appointment of Jeff Richardson to Board of Directors

12/10/2014  Lattice Semiconductor Corporation today announced that its Board of Directors has appointed Jeff Richardson to the company’s Board of Directors and Audit Committee.

SEMI reports third quarter 2014 worldwide semiconductor equipment figures

12/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 8.82 billion in the third quarter of 2014.

Mentor Graphics Announces New Verification IP for PCIe 4.0

12/08/2014  Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification by a factor of up to 10X.

Applied Materials Introduces New Hardmask Process, Saphira

11/24/2014  A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical strength, could reduce manufacturing costs by 35% per module.

China and US boost worldwide industrial semiconductor market in 2014

11/20/2014  Continuing strength in China and a resurgent U.S. economy are combining to drive accelerated growth in the worldwide market for semiconductors used in industrial applications this year, according to IHS Technology.

NFC IGZO TFT for Game Cards

11/20/2014  Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

Revolutionary solar-friendly form of silicon shines

11/18/2014  Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

Professors from UC Berkeley and UT Dallas honored for excellence in semiconductor research

11/13/2014  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

$1,000,000 "Challenge Grant" goal achieved for SEMI high tech industry workforce development

11/11/2014  With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

SEMATECH names Ronald Goldblatt permanent CEO

11/07/2014  SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

Focus on technology challenges at SEMICON Japan 2014

11/06/2014  Presentations by Accenture Japan, Scripps, Toyota and ARM, were announced today for SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

11/05/2014  SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

Reno Sub-Systems closes first venture round with Intel Capital, Innovacorp and other investors

11/05/2014  Reno Sub-Systems (Reno) today announced that it has closed its first venture funding round with Intel Capital, early stage Canadian venture capital organization Innovacorp and other investors.

2014 Global Semiconductor Alliance Award nominees announced

11/04/2014  The Global Semiconductor Alliance (GSA) is pleased to announce the 2014 award nominees for the GSA Awards Dinner Celebration taking place on Thursday, December 11, 2014, at the Santa Clara Convention Center in Santa Clara, Calif.

Experts at the Table: Focus on Semiconductor Materials

11/03/2014  The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde Electronics; Kate Wilson of Edwards Vacuum; David Thompson of Applied Materials; and Ed Shober of Air Products and Chemicals.




FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015