Metrology

METROLOGY ARTICLES



China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Imec reports breakthrough results on DSA

02/19/2015  At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development.

SEMI wins semiconductor etch equipment export control ruling

02/11/2015  This week, after a four-month investigation, the U.S. Department of Commerce declared the export controls on certain etch equipment and technology ineffective, thereby removing a cumbersome and onerous impediment to efficient trade.

Applied's merger with TEL: Still a work in progress

02/11/2015  Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

02/10/2015  The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Precision growth of light-emitting nanowires

02/10/2015  A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Qualcomm and China's National Development and Reform Commission reach resolution

02/09/2015  Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

SEMICON Show Highlights Chip Manufacturing in South Korea

02/04/2015  The SEMICON Korea conference and exhibition opens Wednesday in Seoul for a three-day run. The show highlights the importance of semiconductor manufacturing in South Korea, home to two of the biggest memory chip makers in the world, Samsung Electronics and SK Hynix.

Fabrication of patterns with linewidths down to 1.5nm

02/03/2015  Researchers at aBeam Technologies, Lawrence Berkeley National Laboratory and Argonne National Laboratory have developed a technology to fabricate test patterns with a minimum linewidth down to 1.5nm.

EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography

01/30/2015  Extreme ultraviolet lithography (EUV), 3D integration, and the Internet of Things will be among critical technologies featured at SPIE Advanced Lithography 2015 22 to 26 February in San Jose, California.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.

2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

01/26/2015  Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Global semiconductor sales in November outpace 2013 totals

01/05/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $29.7 billion for the month of November 2014.

Solid Doping for Bulk FinFETs

01/05/2015  In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process step in so-called “14nm node” finFET manufacturing.

Global semiconductor market set for strongest growth in four years in 2014

12/23/2014  Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

Process Watch: Fab managers don’t like surprises

12/18/2014  Nobody likes surprises - especially the managers of $10 billion factories.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.




FINANCIALS



TECHNOLOGY PAPERS



High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015