Metrology

METROLOGY ARTICLES



North American semiconductor equipment industry posts September 2017 billings 

10/20/2017  Global semiconductor equipment billings of North American headquartered suppliers for September were $2.0 billion, down 12 percent from the peak level set in June of this year.

IBM Technology influencer to deliver keynote address at The ConFab 2018

10/19/2017  The ConFab, to be held May 20-23 at The Cosmopolitan of Las Vegas, is excited to announce IBM's Dr. Rama Divakaruni will be the opening keynote for the 2018 conference.

Wafer shipments forecast to increase in 2017, 2018 and 2019

10/17/2017  Total wafer shipments this year are expected to exceed the market high set in 2016 and are forecast to continue shipping at record levels in 2018 and 2019.

Dr. Haijun Zhao, Dr. Liang Mong Song appointed as SMIC co-CEO and Executive Director

10/16/2017  Semiconductor Manufacturing International Corporation today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

Semiconductor IP market worth $6.22B by 2023

10/11/2017  The semiconductor IP market is expected to be valued at USD 6.22 billion by 2023, at a CAGR of 4.87% between 2017 and 2023.

HEIDENHAIN announces new Service Operations Manager for North America

10/10/2017  HEIDENHAIN CORPORATION announces the new appointment of David Fuson, Service Operations Manager for North America.

Fujitsu Semiconductor and ON Semiconductor announce increased strategic partnership

10/10/2017  ON Semiconductor agrees to purchase 30 percent incremental share of Fujitsu’s 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting in 40 percent ownership with plans to increase to 60 percent by the second half of 2018 and full ownership in the first half of 2020.

Monthly semiconductor sales reach $35B globally for first time in August

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

SEMICON Japan 2017 keynotes announced

10/03/2017  Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.

Comet Group to open Silicon Valley office

10/03/2017  COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

New 3D packaging & integration committee

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

Semiconductor Industry Association announces support of corporate tax reform framework

09/29/2017  The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.

Measuring metals, dielectrics, resists and CDs in advanced packaging

09/25/2017  A new system combines acoustic, optical and reflectometric techniques to enable measurement of metals, dielectrics, resists and critical dimensions on a single platform.

North American semiconductor equipment industry posts August 2017 billings 

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Leading-edge paves the way for pure-play foundry growth

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

Samsung Electronics joins Semiconductor Research Corporation on research consortium

09/19/2017  Semiconductor Research Corporation (SRC), today announced that Samsung Electronics Company Ltd. (Samsung), one of the world's largest chipmakers, has signed an agreement to join SRC's research consortium. Samsung will participate in two SRC platforms – the New Science Team (NST) project and the Global Research Collaboration (GRC) program.

IMAPS 2017 to showcase advances in microelectronics technology

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

Semiconductor industry records best second quarter in three years

09/14/2017  Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit.

Josh Shiode joins Semiconductor Industry Association as Government Affairs Director

09/13/2017  In this role, Shiode will help advance the U.S. semiconductor industry’s key legislative and regulatory priorities related to semiconductor research and technology, product security, and high-skilled immigration, among others.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS