Metrology

METROLOGY ARTICLES



Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

09/02/2016  The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.

Enabling industry collaboration to address critical ATE challenges

09/01/2016  For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.

ASMC 2017 "Call for Papers" deadline is October 17

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

NXP Semiconductors joins Semiconductor Research Corporation

08/31/2016  Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, today announced that NXP Semiconductors has signed an agreement to participate in multiple SRC research initiatives.

Industry veteran Lung Chu named president of SEMI China

08/30/2016  SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

China's semiconductor industry worth $157.66B by 2020

08/22/2016  The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020.

KLA-Tencor announces new suite of reticle inspection technologies

08/17/2016  Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced three advanced reticle inspection systems that address 10nm and below mask technologies: the Teron 640, Teron SL655 and Reticle Decision Center (RDC).

Hexagonal boron nitride semiconductors enable cost-effective detection of neutron signals

08/16/2016  Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports.

Seven Top-20 semiconductor suppliers show double-digit gains in 2Q16

08/15/2016  MediaTek and AMD register the fastest 2Q16/1Q16 growth rates of 32% and 23%, respectively.

Evolution of across-wafer uniformity control in plasma etch

08/12/2016  A look at control of process uniformity across the wafer during plasma etch processes.

As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

Power semiconductor market revenues decline

08/11/2016  Overall revenue for the power semiconductors market globally dropped slightly in 2015, due primarily to macroeconomic factors and application-specific issues.

Expanded focus areas and opportunities to exhibit at SEMICON Europa

08/10/2016  Europe's largest electronics manufacturing exhibition SEMICON Europa (25-27 October) will take place in Grenoble at ALPEXPO.

Huge 2H16 spending surge expected from Samsung, TSMC, and Intel

08/04/2016  Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

GLOBALFOUNDRIES appoints Wallace Pai as General Manager to oversee China business development

08/02/2016  GLOBALFOUNDRIES announced that Wallace Pai has been appointed as vice president and general manager of China.

Vortex laser offers hope for Moore's Law

07/29/2016  The optics advancement may solve an approaching data bottleneck by helping to boost computing power and information transfer rates tenfold.

What’s happening to Japan’s semiconductor industry?

07/28/2016  The 2016 global semiconductor market is forecast to decrease by 2.4 percent from the previous year according to the World Semiconductor Trade Statistics (WSTS).




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Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

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