Metrology

METROLOGY ARTICLES



Orbotech's SPTS Technologies receives $37M in multiple system orders from RF device manufacturers

02/14/2018  Orbotech Ltd. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received approximately $37M in orders for multiple etch and deposition systems from two GaAs foundry customers.

Amkor Technology names Doug Alexander and MaryFrances McCourt to Board of Directors

02/09/2018  Amkor Technology, Inc. today announced that Doug Alexander and MaryFrances McCourt have been appointed as new members of the Company's Board of Directors. With these appointments, Amkor's Board has been expanded to twelve members.

Mass production of new class of semiconductors closer to reality

02/09/2018  Two Waterloo chemists have made it easier for manufacturers to produce a new class of faster and cheaper semiconductors.

New IC manufacturing lines to boost total industry wafer capacity 8%

02/08/2018  Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017.

SEMI forms Technology Communities to speed industry collaboration and innovation

02/08/2018  SEMI President & CEO Ajit Manocha has formed a new group, Technology Communities, to better collaborate, align, and enhance all of SEMI’s technology-focused activities by operating them under one umbrella.

First Trump State of the Union address: How it stacks up against SEMI public policy priorities

02/07/2018  SEMI evaluates the implications of the SOTU address for Trade, Taxes, Technology, Talent and other SEMI public policy priorities.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

Smart manufacturing fuels digital transformation: Takeaways from SEMI Member Forum

02/01/2018  Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

Largest SEMICON Korea ever highlights smart manufacturing, automotive

01/31/2018  SEMICON Korea 2018 opens at COEX in Seoul today with its largest-ever exhibition and an expected 50,000 attendees at the premier event for the Korean semiconductor and electronics manufacturing supply chain.

Mike Noonen joins efabless' Advisory Board

01/30/2018  efabless corporation, the world's first crowd sourcing platform for electronics solutions, today announced Mike Noonen joined its advisory board.

Researchers boost efficiency and stability of optical rectennas

01/29/2018  The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor

Electronics manufacturing in critical need of new talent

01/29/2018  SEMI, the global industry association representing the electronics manufacturing supply chain, today announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent.

Lam Research promotes Tim Archer to president

01/26/2018  Martin Anstice will remain Chief Executive Officer.

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

Year End Wow!

01/24/2018  2017 ended on a high note from an end market perspective.

North American semiconductor equipment industry posts December 2017 billings

01/24/2018  The billings figure is 16.3 percent higher than the final November 2017 level of $2.05 billion, and is 27.7 percent higher than the December 2016 billings level of $1.87 billion.

Worldwide semiconductor revenue forecast to grow 7.5% in 2018

01/22/2018  Worldwide semiconductor revenue is forecast to total $451 billion in 2018, an increase of 7.5 percent from $419 billion in 2017, according to Gartner, Inc.

ISS Europe to spotlight key chip industry issue of workforce development 

01/22/2018  Qualified workers key to Europe's competitive advantage in global supply chain.

Qualcomm receives authorization from the European Commission and Korea Fair Trade Commission for NXP Semiconductors acquisition

01/19/2018  Qualcomm Incorporated today announced that the European Commission and the Korea Fair Trade Commission authorized the acquisition by Qualcomm River Holdings B.V. of NXP Semiconductors N.V.

Silicon photonics has reached its tipping point

01/19/2018  Silicon photonics is still a small market today, with sales at die level estimated to be US$30 million in 2016. However, it has big promise, with a 2025 market value of US$560 million at chip level and almost US$4 billion at transceiver level.




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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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