Metrology

METROLOGY ARTICLES



ON Semiconductor to acquire Fairchild for $2.4B

11/18/2015  The acquisition creates a leader in the power semiconductor market with combined revenue of approximately $5 billion, diversified across multiple markets with a strategic focus on automotive, industrial and smartphone end markets.

Leti and partners announce developments on three mature platforms

11/18/2015  CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms.

Taking 2D materials from lab to fab, and to technology

11/17/2015  Due to their exciting properties, 2D crystals like graphene and transition metal dichalcogenides promise to become the material of the future.

Wally Rhines of Mentor Graphics Gets Phil Kaufman Award

11/16/2015  The Phil Kaufman Award is presented by the Electronic Design Automation Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA). It honors the memory of Philip A. Kaufman, the EDA industry pioneer, electronics engineer, and entrepreneur, who died in 1992.

Silicon shipment levels decline in third quarter 2015

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Security by design

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

A new slant on semiconductor characterization

11/12/2015  Method analyzes non-uniform conductors with a magnetic field.

New MEMS, Sensors Emerge at MEMS Executive Congress US

11/09/2015  A wide variety of microelectromechanical system (MEMS) devices, sensors, and MEMS sensors were described and introduced at the MEMS Executive Congress US in Napa, Calif.

MEMS, Sensors Poised for Growth in the Internet of Things Era

11/09/2015  Not all segments in MEMS and sensors are enjoying hockey-stick growth forecasts, as commoditization and pricing pressures take hold. This was just one of the insights gleaned at last week’s MEMS Executive Congress US 2015.

MEMS Executive Congress US Speaker Looks at MEMS Past, Present, and Future

11/04/2015  Much has changed in the world of microelectromechanical system (MEMS) devices in the past 20 years, and much more will change in the next two decades, said Steve Nasiri of Nasiri Ventures in his keynote address Wednesday (November 4) at the MEMS Executive Congress US conference in Napa, Calif.

UPDATED - Semiconductor Manufacturing: ASMC 2016 - Nov. 11 "call for papers" deadline

11/03/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

Practical Limits for Metallization Scaling in Fabs

11/02/2015  On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

11/02/2015  Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Lam Research to acquire KLA-Tencor

10/21/2015  Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

10/19/2015  Mentor Graphics Corp. today announced the Veloce® VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today.

Infineon CEO Says Robot Cars Will Drive Semiconductor Demand

10/12/2015  Infineon’s CEO, Reinhard Ploss, says that the autonomously driven cars of the future will create a large demand for a variety of new semiconductors and sensors.

Mentor Graphics Tackles SoC Design Challenges

10/06/2015  System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.

Applied Materials Prospers in CMP, Deposition, Etch

10/06/2015  The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.

SPIE Photomask Panel: Money Is An Issue

10/02/2015  "Money (That’s What I Want)" could have been the theme song for playing off the EUV Mask Readiness panel discussion on Thursday morning (October 1) at the SPIE Photomask Technology conference in Monterey, California.




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WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
MEMS: Current Status and Future Directions

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

In 2015, the MEMS market did not grow as much as we initially expected. In the past, the Smart Phone industry was a strong driver of the MEMS industry with ever increasing volume. Today, MEMS are becoming commodity products with very low price. The webcast will review the latest market data and forecasts for the future. The MEMS “commoditization” paradox will be discussed as well as latest technical trends (sensors combos, packaging).

Sponsored By:
Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS