Metrology

METROLOGY ARTICLES



Securing talent to connect, collaborate and innovate

09/06/2017  Our industry has a significant need for additional workers and several trends are working against us.

Equipment forecast: $49.4 billion

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

Analysis of global lithography metrology equipment market

08/25/2017  The lithography metrology equipment market is riding on the high wave of the semiconductor industry.

North American semiconductor equipment industry posts July 2017 billings

08/23/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

TowerJazz and Tacoma announce a partnership for a new 8-inch fabrication facility in Nanjing, China

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

Covalent Metrology expands into a new facility

08/03/2017  Covalent Metrology announced today that it has consolidated operations in a larger facility located in Santa Clara, CA.

Gen. Keith Alexander to deliver keynote address at SIA's 40th Anniversary Award Dinner

08/02/2017  Former Director of National Security Agency, Commander of U.S. Cyber Command to weigh in on the importance of technology to national security.

Significant mid-year revision to 2017 IC market forecast

08/02/2017  DRAM, NAND flash memory markets drive the first annual double-digit upturn since 2010.

HEIDENHAIN offers new angular positioning system for metrology and micromachining

08/01/2017  The new SRP 5000 angular positioning system from HEIDENHAIN incorporates its high accuracy MRP 5000 angle encoder with accomplished bearing technology along with a unique ETEL torque motor with ultra-low detent torque.

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

07/28/2017  In-line metrology methods used during extreme wafer thinning process pathfinding and development are introduced.

NASA’s new vacuum-channel nanoelectronics rely on Park Systems AFM

07/27/2017  Using scanning capacitance microscopy with a Park Systems atomic force microscope a team at NASA successfully characterized both the spatial variations in capacitance as well as the topography of vacuum-channel nanoelectronic transistors.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Value of semiconductor industry M&A deals slows dramatically in 1H17

07/25/2017  Numerous smaller deals have been made but “megadeals” have yet to surface this year.

2017 IEEE IEDM to showcase technology and device breakthroughs in logic, memory, bioelectronics, silicon photonics

07/20/2017  Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel.

SUNY Poly awarded $720,000 by U.S. Department of Energy for next-generation semiconductor research

07/20/2017  Grant from Energy Department's Advanced Research Projects Agency-Energy supports further development of cutting-edge gallium nitride-based power electronics at SUNY Poly.

China will dominate the global semiconductor market in the next 5 years

07/19/2017  The semiconductor market in China continues to grow at a staggering speed. The current backbone of the electronics and telecom industry in China, semiconductor companies in China are driving innovation with new trends like spending on wafer fab equipment.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS