Metrology

METROLOGY ARTICLES



Seoul Semiconductor Europe GmbH announces new CEO

12/20/2016  Andreas Weisl (38), former Vice President Europe of Korean LED manufacturer Seoul Semiconductor (SSC), has taken on the position of CEO at Seoul Semiconductor Europe GmbH based Munich, Germany, with effect from November 11, 2016.

62 new facilities start operation 2017 and beyond

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

Number of IC manufacturers using 300mm wafers less than half using 200mm wafers

12/16/2016  Reliance on existing wafer sizes increases as outlook for 450mm wafers fades.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Toshio Maruyama to receive SEMI Marketing Excellence Award at SEMICON Japan

12/15/2016  SEMI this week announced that Toshio Maruyama has been selected as the 2017 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.

Linde Korea acquires Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business

12/15/2016  Linde Korea, a member of The Linde Group, today announced that it has completed the takeover of Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business in South Korea.

SEMICON China 2017 presents six forums in China's explosive growth market

12/14/2016  SEMI today announced the lineup for six forums at SEMICON China and FPD China held at the Shanghai New International Expo Centre on March 14-16, 2017.

New fab facilities: China dominates, followed by Americas and Taiwan

12/14/2016  The 62 facilities and lines range from R&D to high-volume fabs. Most of the newly operating facilities will be volume fabs; only seven are R&Ds or Pilot facilities.

Semiconductor equipment sales forecast: $40 Billion

12/13/2016  SEMI today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 8.7 percent to $39.7 billion in 2016.

SEMICON Japan 2016 opens tomorrow at Tokyo Big Sight

12/13/2016  SEMICON Japan 2016, the largest and most influential event for the electronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight.

Global Semiconductor Alliance announces 2016 Award recipients

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

Third quarter 2016 worldwide semiconductor equipment billings reach $11B, reports SEMI

12/06/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$11.0 billion in the third quarter of 2016.

Human-focused research and IoT promise profound, positive changes, say Leti CEO

12/06/2016  Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things – guided by a "human-centered research approach and symbiotic development strategies" – herald profound changes in the way individuals relate to each other and to the physical world.

SEMI adds industry veteran to Americas leadership

11/30/2016  David Anderson joins as SEMI Americas President.

North American semiconductor equipment industry posts October 2016 book-to-bill ratio of 0.91

11/28/2016  The book-to bill ratio for October dropped below parity for the first time in 11 months, even though bookings and billings activity remains at elevated levels relative to last year.

Executives to get strategic perspectives for success at SEMI ISS 2017

11/17/2016  Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.

Registration open for SEMICON Korea 2017's special 30-Year anniversary

11/16/2016  Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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VIDEOS