Metrology

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METROLOGY ARTICLES



Mid-IR frequency combs enable high resolution spectroscopy for sensitive gas sensing

03/10/2015  The results are an important step towards a small-footprint chip scale mid-infrared frequency comb source.

Applied Materials honored as a 2015 World's Most Ethical Company

03/10/2015  Applied Materials, Inc. today announced it has been recognized as a 2015 World's Most Ethical Company by the Ethisphere Institute.

CEA-Leti announces launch of Silicon Impulse IC design competence center

03/10/2015  CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

Boston Semi Equipment completes relocation of headquarters and Aetrium test handler business

03/05/2015  The new facility houses corporate functions as well as the Aetrium test handler business acquired in 2014 and relocated from Minnesota to Massachusetts.

Mentor Graphics joins the Center for Power Electronics Systems

03/04/2015  Mentor Graphics Corporation today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems.

Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

03/04/2015  Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Freescale and NXP agree to $40 Billion merger

03/03/2015  Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

Top semiconductor R&D leaders ranked for 2014

02/26/2015  Intel’s R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase; Nvidia with highest R&D/sales ratio.

AG Semiconductor Services and JA Mitsui Leasing join forces

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devices

02/23/2015  At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulse

02/23/2015  Cymer, an ASML company, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the shipment of its first XLR 700ix light source.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

02/20/2015  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

02/19/2015  Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Imec reports breakthrough results on DSA

02/19/2015  At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development.

SEMI wins semiconductor etch equipment export control ruling

02/11/2015  This week, after a four-month investigation, the U.S. Department of Commerce declared the export controls on certain etch equipment and technology ineffective, thereby removing a cumbersome and onerous impediment to efficient trade.

Applied's merger with TEL: Still a work in progress

02/11/2015  Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

02/10/2015  The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Precision growth of light-emitting nanowires

02/10/2015  A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Qualcomm and China's National Development and Reform Commission reach resolution

02/09/2015  Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.




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TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

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VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 - December 18, 2015