Metrology

METROLOGY ARTICLES



HEIDENHAIN offers new angular positioning system for metrology and micromachining

08/01/2017  The new SRP 5000 angular positioning system from HEIDENHAIN incorporates its high accuracy MRP 5000 angle encoder with accomplished bearing technology along with a unique ETEL torque motor with ultra-low detent torque.

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

07/28/2017  In-line metrology methods used during extreme wafer thinning process pathfinding and development are introduced.

NASA’s new vacuum-channel nanoelectronics rely on Park Systems AFM

07/27/2017  Using scanning capacitance microscopy with a Park Systems atomic force microscope a team at NASA successfully characterized both the spatial variations in capacitance as well as the topography of vacuum-channel nanoelectronic transistors.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Value of semiconductor industry M&A deals slows dramatically in 1H17

07/25/2017  Numerous smaller deals have been made but “megadeals” have yet to surface this year.

2017 IEEE IEDM to showcase technology and device breakthroughs in logic, memory, bioelectronics, silicon photonics

07/20/2017  Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel.

SUNY Poly awarded $720,000 by U.S. Department of Energy for next-generation semiconductor research

07/20/2017  Grant from Energy Department's Advanced Research Projects Agency-Energy supports further development of cutting-edge gallium nitride-based power electronics at SUNY Poly.

China will dominate the global semiconductor market in the next 5 years

07/19/2017  The semiconductor market in China continues to grow at a staggering speed. The current backbone of the electronics and telecom industry in China, semiconductor companies in China are driving innovation with new trends like spending on wafer fab equipment.

Former Micron CEO Mark Durcan to receive semiconductor industry's top honor

07/18/2017  The Semiconductor Industry Association (SIA) announced Mark Durcan, former CEO of Micron Technology, Inc., and a longtime leader in advancing semiconductor technology, has been named the 2017 recipient of SIA's highest honor, the Robert N. Noyce Award.

Professors from Oregon State University, University of Texas at Austin to be honored for excellence in semiconductor research

07/18/2017  The Semiconductor Industry Association today announced the winners of its 2017 University Research Award.

Bridging the macro and micro world of defects

07/12/2017  When it comes to defects and contamination in the semiconductor manufacturing industry, most people tend to think of small, sub-nm defects at the transistor level. As important as those are, there are plenty of things that can go wrong and be seen at the macro level.

$49.4B semiconductor equipment forecast: New record, Korea at top

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

Latest outlook for industrial semiconductor growth

06/29/2017  Worldwide industrial semiconductor revenues grew by 3.8 percent year-over-year in 2016, to $43.5 billion, according to the latest analysis from business information provider IHS Markit.

New Taiwan Automation Technology TC chapter

06/29/2017  At its recent Spring 2017 meeting, the North American Regional Standards Committee (NARSC) approved formation of a Taiwan chapter of the global SEMI Standards Automation Technology Committee.

SEMI and Solid State Technology announce 2017 “Best of West” Award finalists

06/28/2017  Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI.

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

ULVAC Technologies opens California office

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

Fast and precise surface measurement of back-grinding silicon wafers

06/16/2017  A new type of scattered light measurement method will be presented, capable of measuring the full wafer surface of a 300 mm wafer in less than 30 seconds. Besides the roughness, the sensor simultaneously measures warpage, waviness and defects.

The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS