Metrology

METROLOGY ARTICLES



Qualcomm/NXP deal underscores semiconductor merger trend

11/02/2016  Qualcomm's proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale.

Global semiconductor sales increase 11.5% in Q3

11/01/2016  Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

Cadence CEO to be awarded Dr. Morris Chang Exemplary Leadership Award

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

Qualcomm to acquire NXP

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

SEMICON Europa opens tomorrow in Grenoble, France

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

Semiconductor equipment bookings continue to outpace equipment billings in new book-to-bill report

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

POET Technologies to expand compound semiconductor operations in Singapore

10/19/2016  POET Technologies Inc. today announced that on October 17, 2016, it entered into an Agreement with the Singapore Economic Development Board (EDB) to expand POET's research and development (R&D) operations in Singapore.

SEMI Korea Members Day provides industry insights and networking

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

SMIC TianJin launches capacity expansion project

10/18/2016  After the project's completion, SMIC TianJin is expected to become the world's largest integrated 8-inch IC production line.

SMIC Shanghai starts construction of a new 12-inch wafer fab

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

Wafer shipments forecast to increase in 2016, 2017 and 2018

10/13/2016  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2016–2018.

SEMI announces retirement of president and CEO

10/13/2016  McGuirk will continue to lead SEMI in his current capacity until a successor is appointed.

2016 wafer demand grows while semiconductor chip revenue declines, says Semico Research

10/11/2016  Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies.

200mm fabs on the rise

10/11/2016  Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009.

Companies maximizing 300mm, 200mm wafer capacity

10/07/2016  Reliance on existing wafer sizes increases as near-term outlook for 450mm wafers fades.

KLA-Tencor, Lam Research call off merger deal

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.

Global semiconductor industry posts largest monthly sales increase in 3 years

10/05/2016  August sales up 3.5 percent compared to July, increase year-to-year for first time in more than a year.

Keynotes announced, registration open for SEMICON Japan 2016

10/05/2016  Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan's "SuperTHEATER" focusing on innovation and insights into the future of the electronics supply chain.

Top 5 takeaways from SEMI Strategic Materials Conference

09/29/2016  As the rate of traditional scaling slows, the chip sector looks increasingly to materials and design to move forward on multiple paths for multiple applications. Figuring out more effective ways to collaborate across silos will be crucial.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS