Brewer Science and Nissan Chemical Industries formalize agreement expanding support for the semiconductor industry

04/28/2015  Brewer Science, Inc., and Nissan Chemical Industries, Ltd., announced they have formally extended their business relationship through 2028.

Two-dimensional semiconductor comes clean

04/28/2015  Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

Applied Materials and Tokyo Electron terminate merger

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

How emerging IoT impacts the semiconductor sector

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

SEMI reports 2014 semiconductor photomask sales of $3.2B

04/14/2015  SEMI reports that the worldwide semiconductor photomask market was $3.2 billion in 2014 and is forecasted to reach $3.4 billion in 2016.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

Flexible facilities for 450mm wafer fabs

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02

03/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

GSA announces 2015 Board of Directors election results and appointment

03/19/2015  The Global Semiconductor Alliance (GSA) announced the appointment of two key executives as well as the results of its 2015 Board of Directors’ election.

NXP-Freescale merger to result in world's eighth largest chip maker

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015