Silicon wafer revenues decline in 2012
February 12, 2013
Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.
imec advances CMOS beyond silicon to Ge, III-V
December 14, 2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in "Advancing CMOS beyond the silicon roadmap with germanium and III-V devices" at IEDM.
Next Generation Metrology and Inspection
Nov 21 at 2 PM ET. Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.
Packaging technology is driven by a combination of cost, performance, form factor and reliability. This webcast will examine new advances in conventional back-end packaging, including wafer bumping and copper wire bonding, as well as the role of new 2.5D and 3D integration. Presenters will focus on isssues related to cost, performance (speed, power and noise immunity), form factor (thickness, weight, PCB area consumption), and testability, as well as the tradeoff of technical maturity versus risk in high-volume manufacturing.
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps. An additional challenge is that the reduction in device size and an increase in device topography makes the removal of small particles even more challenging.