Panasonic Flip Chip Bonder to Make North American Debut at Semicon

Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s SEMICON West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.

MDP-300, Panasonic’s latest bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. It includes a synchronous head motion that enables the bond head and the dispenser to work in parallel. This unique process immediately increases bond quality and enhances overall throughput.

Supporting up to 300mm (12”) wafer substrates, it can even connect to a SMT machine. Visitors can see the MDP-300 up-close and learn more about Panasonic’s microelectronic solutions to dice, prep, bond, and more in Panasonic’s booth – #6251 at the Moscone Center in San Francisco on July 8 – 10, 2014.