OLEDs

MAGAZINE



OLEDS ARTICLES



Pixelligent launches new PixClear light extraction materials for OLED lighting

08/03/2015  Pixelligent Technologies, a manufacturer of high index materials for demanding optoelectronics applications, announces the addition of four new OLED lighting products to its PixClear Zirconia nanocrystal family.

Nanowires could be the LEDs of the future

06/25/2015  The latest research from the Niels Bohr Institute shows that LEDs made from nanowires will use less energy and provide better light.

Pixelligent closes $3.4M in funding

06/16/2015  Pixelligent Technologies, producer of PixClear, a producer of nanocrystal dispersions for demanding applications in LED lighting, OLED Lighting, and Optical Coatings & Films markets, announced today that it closed $3.4 million in new funding.

Optimized printing process enables custom organic electronics

06/16/2015  They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market.

Flat panel display equipment spending forecast to reach $9B in 2015

06/02/2015  Revenues for flat panel display (FPD) manufacturing equipment are expected to grow for the third consecutive year to reach $9.1 billion.

Fujifilm and imec demonstrate full-color OLEDs with photoresist technology for organic semiconductors

06/02/2015  FUJIFILM Corporation and nano-electronics research institute, imec have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors.

Quantum dots are finally ready for prime time

05/05/2015  Quantum dots are finally ready for prime time and will exceed traditional phosphor revenue by 2020 by allowing LCD to compete with OLED in the race for the next display generation.

Global LCD TV panel shipments reached monthly record high in March 2015

04/28/2015  LCD TV panel shipments from global panel makers reached 23.9 million in March 2015, growing 20 percent month over month and 11 percent year over year.

C3nano seals acquisition of Asia's largest manufacturer of silver nanowire, Aiden Co. Ltd. Korea

04/28/2015  C3nano, Inc. announced today that it has acquired the major supplier of silver nanowire (AgNW) in Asia, Aiden Co. Ltd. of Korea.

Web tension control in roll-to-roll web processing

04/07/2015  Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.

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TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
Advanced Packaging

August 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
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VIDEOS



EVENTS



SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015