OLEDs

MAGAZINE



OLEDS ARTICLES



Graphene leans on glass to advance electronics

02/12/2016  Scientists have developed a simple and powerful method for creating resilient, customized, and high-performing graphene: layering it on top of common glass.

Breakthrough enables ultra-fast transport of electrical charges in polymers

01/28/2016  A research team at Umeå University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation.

How copper makes organic light-emitting diodes more efficient

01/13/2016  Scientists of Karlsruhe Institute of Technology (KIT), CYNORA, and the University of St Andrews have now measured the underlying quantum mechanics phenomenon of intersystem crossing in a copper complex.

Nanostructured metal coatings let the light through for electronic devices

12/10/2015  Light and electricity dance a complicated tango in devices like LEDs, solar cells and sensors. A new anti-reflection coating developed by engineers at the University of Illinois at Urbana Champaign, in collaboration with researchers at the University of Massachusetts at Lowell, lets light through without hampering the flow of electricity, a step that could increase efficiency in such devices.

Exploring the limits for high-performance LEDs and solar cells

12/03/2015  Hybrid optoelectronic devices based on blends of hard and soft semiconductors can combine the properties of the two material types, opening the possibility for devices with novel functionality and properties, such as cheap and scalable solution-based processing methods.

Led by Apple and Chinese brands, high tech smartphone panel shipments rising

11/24/2015  Demand for LTPS TFT LCD shipments rose 30 percent in September 2015 to reach 51.6 million units, due to strong demand from Apple and Chinese brands.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

The use of sapphire in mobile device and LED industries: Part 2

11/17/2015  The use of sapphire in the manufacturing of Light Emitting Diodes (LEDs) is covered in the second part of a two part series.

Flip chip technology: Which companies will invest to support the growth?

11/16/2015  Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of Flip Chip technology for LED and CMOS Image Sensors (CIS) applications, the Flip Chip market is expending.

Printing & vacuum deposition: Competing for market share in the flexible electronics sector

11/13/2015  Flexible electronic devices are starting to experience significant proliferation, with more and more devices with innovative form factors being brought to market, from small components such as disposable sensors that have been in the market for quite some time now, all the way to new flexible smart phones currently being demonstrated by consumer electronics giants like Samsung and LG.

MORE OLEDS ARTICLES

TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016