OLEDs

OLEDS ARTICLES



Miniscule amounts of impurities in vacuum greatly affecting OLED lifetime

01/03/2017  Reproducibility is a necessity for science but has often eluded researchers studying the lifetime of organic light-emitting diodes (OLEDs).

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

Kateeva President & COO named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association

12/01/2016  Kateeva, the OLED production equipment leader, today announced that President and COO, Conor Madigan, Ph.D., was named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association (SVIPLA).

ChipMOS and Tsinghua Unigroup agree to form joint-venture

11/30/2016  ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.

Display panel makers increase fab utilization rate to 90% in Q4 2016

11/17/2016  The overall utilization rate at fabrication plants (fabs) used for display panel production is expected to reach 90 percent in the fourth quarter of 2016, up 7 percentage points from the same period in the previous year, and up 1 percentage point from the previous quarter.

Kateeva takes home award for YIELDjetT FLEX System

11/17/2016  Last night at the Printed Electronics USA conference in Santa Clara, Calif., Kateeva’s YIELDjet FLEX inkjet printing system was named the winner of the prestigious Technical Development Manufacturing Award.

North America LED market to grow at 9.7% CAGR through 2022

11/11/2016  The North American LED market is expected to reach $11,702.6 Million by 2022.

Kateeva appoints Mark R. Shaw, Ph.D. as Senior VP of Human Resources

10/26/2016  Previously, Shaw worked at Lam Research and Applied Materials.

SEMI Korea Members Day provides industry insights and networking

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

South Korean IT display manufacturers replacing LCD with OLED

10/05/2016  Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays.

Dr. Jin Jang joins Silvaco's Technical Advisory Board

10/05/2016  Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Jin Jang of Kyung Hee University in Seoul, Korea, has joined the Technical Advisory Board (TAB).

Kateeva's YIELDjet FLEX inkjet printing system takes commanding lead in OLED TFE market

09/21/2016  Since the novel inkjet printing solution debuted in manufacturing in 2014, the company has secured the vast majority of available TFE orders.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Samsung introduces high-performance LED linear modules for indoor lighting applications

08/26/2016  Samsung Electronics Co., Ltd. today announced “H-series Gen 3,” a new line-up of LED linear modules that features high efficacy and enables easy replacement of fluorescent lights with LED lamps.

IHS Markit releases ranking of Top LED suppliers

08/18/2016  IHS Markit released its annual 2015 revenue-share ranking of the top LED suppliers in backlighting, automotive, lighting and other applications.

Advanced materials manufacturer Pixelligent closes $10.4M in funding

08/15/2016  Pixelligent Technologies, a developer of high-index advanced materials for solid state lighting and display applications and producer of PixClear products, announced today that it closed $10.4 million in new funding.

Towards a better screen

08/09/2016  New molecules promise cheaper, more efficient OLED displays.

Molecular switch for controlling color and fluorescence

07/15/2016  A collaboration of researchers from Kumamoto, Yamaguchi, and Osaka Universities in Japan have discovered a new method of drastically changing the color and fluorescence of a particular compound using only oxygen (O2) and hydrogen (H2) gases.

Kateeva: Enabling OLED success

07/13/2016  Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



High Efficiency Wireless: 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS