OLEDs

OLEDS ARTICLES



New approach for "nanohoops" could energize future devices

10/14/2015  A new paper from the University of Oregon shows that nanohoops can be made using a variety of atoms, not just those from carbon.

Applied Materials advances OLED display manufacturing for flexible mobile products and curved TVs

10/12/2015  Applied Materials, Inc. unveiled two new systems that enable the volume production of high-resolution, thin and lightweight flexible OLED displays for mobile products and TVs.

Infineon CEO Says Robot Cars Will Drive Semiconductor Demand

10/12/2015  Infineon’s CEO, Reinhard Ploss, says that the autonomously driven cars of the future will create a large demand for a variety of new semiconductors and sensors.

Organic semiconductors get weird at the edge: University of British Columbia research

10/08/2015  As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.

Mentor Graphics Tackles SoC Design Challenges

10/06/2015  System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.

Applied Materials Prospers in CMP, Deposition, Etch

10/06/2015  The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.

SPIE Photomask Panel: Money Is An Issue

10/02/2015  "Money (That’s What I Want)" could have been the theme song for playing off the EUV Mask Readiness panel discussion on Thursday morning (October 1) at the SPIE Photomask Technology conference in Monterey, California.

DuPont Displays opens OLED materials scale-up facility for next generation TVs

10/01/2015  DuPont Displays announced the opening of a state-of-the-art, scale-up manufacturing facility designed to deliver production scale quantities of advanced materials that enable large-format, solution-based printed Organic Light Emitting Diode (OLED) displays.

Intel Mask Engineer Reports "Steady Progress" in EUV Masks

09/30/2015  Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress.

Mask Conference Highlights Progress in Lithography

09/30/2015  Harry J. Levinson, senior director of technology research at GlobalFoundries, took “Lithography and Mask Challenges at the Leading Edge” as the theme for his keynote presentation Tuesday morning, opening the SPIE Photomask Technology 2015 conference in Monterey, California.

Functionalized graphene ink opens door to innovative screen-printing applications

09/29/2015  A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink.

CMP Technology Evolving to Engineer Surfaces

09/28/2015  New devices, materials, and substrates challenge atomic-scale integration.

Display technologies and electronic circuits to fuel organic electronics market globally through 2018

09/28/2015  Transparency Market Research (TMR) projects the global organic electronics market to grow at a CAGR of 32.6% from 2012 to 2018.

SEMI Conference Addresses Issues in Semiconductor Materials

09/25/2015  The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”

Linde Electronics Presents 2014 Global Supplier Awards

09/25/2015  Electronic Fluorocarbons LLC and Albemarle Corporation recognized for quality, safety, service and technology performance.

GlobalFoundries CTO Calls for Innovation in Chip Materials

09/24/2015  Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.

TSMC Moves from 16nm to 10nm to 7nm

09/21/2015  While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

TSMC Forum Emphasizes Industry Collaboration

09/17/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Rising Flexible Display Technology Patents Herald Future Market Growth

09/15/2015  With a recent sharp rise in the number of patent applications for flexible display technologies, the market for various types of flexible displays is expected to broaden.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS