OLEDs

OLEDS ARTICLES



The sapphire industry: What’s next?

06/10/2016  Almost two years after GTAT’s bankruptcy, the sapphire industry is still there. Its decor and characters have, of course, changed but the story is still unfolding.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

06/06/2016  The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

06/05/2016  Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

06/05/2016  Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

Solid State Watch: May 27-June 2, 2016

06/03/2016  GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators

Solid State Watch: May 20-26, 2016

05/31/2016  SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond

AGC develops amorphous thin film using unique sputtering target material

05/26/2016  GC Asahi Glass (AGC) today announced it has developed a uniform amorphous thin film using a unique sputtering target material, and has started industrialization and commercial production of the material.

Solid State Watch: May 13-19, 2016

05/23/2016  IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments; New type of graphene-based transistor will increase the clock speed of processors

Automotive LED industry drivers: Disruptive technologies and consumer behavior changes

05/20/2016  The lighting market for automotive applications should reach a 23.7% compound annual growth rate (CAGR) 2015-2121 reaching a US$27.7 billion market in 2021.

$88M in Series E financing for OLED production equipment maker, Kateeva

05/19/2016  Kateeva today announced that it has closed its Series E funding round with $88 million in new financing.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor's SLIM and SWIFT Packaging Technologies

05/05/2016  Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor's SLIM and SWIFT advanced fan-out package technologies.

How to Boost Verification Productivity with SystemVerilog/UVM and Emulation

05/03/2016  Use of emulation for hardware-assisted testbench acceleration is growing as design verification teams find that simulation alone cannot deliver the coverage or performance needed to get large, complex designs to market on time. If your design requires millions of clock cycles to fully verify, you need both simulation and emulation.

Leti's CoolCube 3D Transistor Stacking Improves with Qualcomm Help

04/27/2016  Collaborating to build out design to fabrication ecosystem.

Roll-to-Roll Coating Technology: It's a Different Ball of Wax

04/18/2016  Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IoT Demands Part 2: Test and Packaging

04/15/2016  To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

IoT Demands Part 1: EDA and Fab Nodes

04/14/2016  To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

The future is here: Interactive screens on your packages

04/08/2016  Instead of reading a label, consumers could be interacting with an electronic screen on packaging in the future, thanks to a revolutionary new development by scientists at the University of Sheffield.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS