03/02/2016 LCD manufacturer inventory adjustments and continued slowing demand are causing TV and IT display prices to fall, further eroding panel makers’ profitability.
03/01/2016 Researchers increased the device lifetime of OLEDs that use a recently developed class of molecules to convert electricity into light.
02/26/2016 Researchers at Kyushu University were able to widely vary the emission color and efficiency of OLEDs.
02/25/2016 Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?
02/25/2016 The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.
02/24/2016 Applied Materials, Inc. today announced that Dr. Robert Visser has received a 2016 Special Recognition Award from the Society of Information Display.
02/24/2016 That neon gas shortage? So 2015.
02/24/2016 The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.
02/22/2016 The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.
02/18/2016 Shipments of organic light-emitting materials used to produce organic light-emitting diode (OLED) displays grew 12 percent year over year in 2015, reaching 26,000 tons, according to IHS.
02/12/2016 Scientists have developed a simple and powerful method for creating resilient, customized, and high-performing graphene: layering it on top of common glass.
01/28/2016 A research team at Umeå University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation.
01/22/2016 Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.
01/20/2016 Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.
01/20/2016 ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.
01/13/2016 Scientists of Karlsruhe Institute of Technology (KIT), CYNORA, and the University of St Andrews have now measured the underlying quantum mechanics phenomenon of intersystem crossing in a copper complex.
12/21/2015 The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.
12/18/2015 John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.
12/18/2015 On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.
12/17/2015 The theme of this year's 3D Architectures for Semiconductor Integration and Packading (3D ASIP) conference is "The Year of Stacked Memory," noting how memory die stacked in one package are becoming more commonplace in 2015.
November 15, 2016 at 1:00 p.m. ET / Sponsored by Brewer Science
Directed self-assembly (DSA) patterning is one of the primary methods being pursued for future advanced patterning nodes. Since DSA’s initial introduction in the early 2000s, great progress has been made. However, many challenges remain for achieving manufacturing readiness. Key improvements in the areas of materials, defectivity, and process integration are still needed. This webcast will cover published progress to date, review key improvements needed, and discuss new advances in DSA technology. Results from CEA-LETI’s 300-mm lab-to-fab for validation of DSA’s manufacturing readiness will be discussed.
November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics
Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.